Annual Information Service - 227299
Quarterly Touch Module Cost Breakdown Report
|Published by||TrendForce Corp.|
|Published||frequently updated||Content info|
The quarterly report surveys the touch module costs, which is divided into various main components and processes: sensor, cover glass, bonding and touch IC. In terms of different touch module technologies, the report lists costs of glass type, film type, and OGS type to help readers understand relations between technologies and costs. In addition to the current cost level, the cost forecasts of the next three quarters are included in the research, which in advance underline the possible industry changes and their impacts on costs.