Press Release

TSV Metrology/Inspection Equipment Market Expects to See Major Growth

May 6th, 2010

Global Information, Inc. would like to present a new market research report, "3-D TSV: INSIGHT ON CRITICAL ISSUES AND MARKET ANALYSES" by Information Network.

According to Dr. Robert Castellano, President of The Information Network, market analysis indicates that "the overall equipment market will grow at a compound annual growth rate of nearly 60% between 2008 and 2013, the Metrology/Inspection sector is expected to grow nearly 80%." Meanwhile, on the device side, TSVs (Through Silicon Via) for MEMS is projected to grow nearly 100% for the forecast period. TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The desire for lighter, more compact and power efficient devices have led to chip stacking in the same package. TSVs (Through Silicon Vias) enable chips to be stacked upon each other. Stacking chips provides more computing process in a compact space.

TSV technology requires unique processing steps that arent used in standard 2D ICs. Hence, new measurement tools and techniques need to be developed. TSV measurement needs include:

  • Wafer level integration  alignment of chips for stacking
  • Damage to metal layers
  • Bond strength
  • Defects in bonding
  • TSV Depth and Profile through multiple layers
  • Wafer Thickness and TTV after thinning

Market adoption of 3D ICs will mainly be driven by increased performance, cost reduction, and reduced form factor. This report provides a comprehensive market analysis of TSV ICs, equipment, and materials.

Global Information Inc.(GII) - specializing in market research provision for the vertical industries, GII offers expert independent recommendations of publications from hundreds of the globe's leading market research firms.

Product Code : 107976