Future Handset Connectivity Technologies published by Berg Insight AB in June, 2008. This report consists of 100 PAGES and the price starts from US $ 2250.
Introduction
Abstract
Future Handset Connectivity Technologies gives first-hand insights into the
development of Bluetooth, WLAN, NFC and UWB technologies for mobile handsets.
This report in the VAS Research Series from Berg Insight provides you with 100
pages of unique business intelligence including 5-year industry forecasts and
expert commentary on which to base your business decisions.
This report will allow you to:
Understand the opportunities and challenges with integration of new
connectivity technologies in mobile handsets.
Learn about the strategies for Bluetooth, WLAN, NFC and UWB of the leading
chipset and handset vendors in the mobile industry.
Identify drivers and barriers for industry-wide adoption of new technology.
Predict future design trends and technology developments.
Anticipate the timing of mass-market introduction of new handset
connectivity features.
This report answers the following questions:
How will Bluetooth evolve in the future handset environment?
What is the roadmap for integration of WLAN in mass-market mobile phones?
When will NFC become a widespread handset connectivity technology?
Does UWB have a future in the mobile industry?
Which connectivity technologies are being adopted by the main handset
manufacturers?
What impact will new technologies have on the wireless chipset value chain?
How is the greater diversity of radios affecting wireless chipset and
handset design?
What is the current status of the standardisation work?
Table of Contents
Table of Contents
List of Figures
Executive summary
1. Handset connectivity technologies
1.1 Wireless communication technologies
1.1.1 Personal area and local area network technologies
1.1.2 Cellular mobile communication technologies
1.1.3 Spectrum and interference
1.1.4 Technical comparison
1.2 Broadcast connectivity technologies
1.2.1 Radio
1.2.2 Mobile TV
1.2.3 GPS
1.3 Handset platforms and connectivity integration
1.3.1 Handset hardware and software platforms
1.3.2 Horizontal and vertical integration of connectivity technologies
1.4 Single chip versus discrete chip integration
1.5 Handset value-chain overview
1.5.1 Cellular chipset vendors
1.5.2 Connectivity chipset vendors
1.5.3 Handset OS and software vendors
1.5.4 Handset manufacturers
1.6 Drivers and barriers to integration
1.6.1 Bluetooth
1.6.2 WLAN
1.6.3 UWB
1.6.4 NFC
2. Bluetooth in mobile phones
2.1 Overview of the Bluetooth technology
2.1.1 Bluetooth specifications
2.1.2 Bluetooth applications and profiles
2.2 Bluetooth and other connectivity technologies
2.2.1 Bluetooth and FM radio
2.2.2 Bluetooth and WLAN
2.2.3 Bluetooth and GPS
2.2.4 Bluetooth and cellular baseband integration
2.3 Company profiles
2.3.1 Broadcom
2.3.2 CSR
2.3.3 Infineon Technologies
2.3.4 Qualcomm
3. Wireless LAN in mobile phones
3.1 Overview of Wireless LAN
3.1.1 WLAN standards
3.1.2 WLAN in mobile phones
3.2 WLAN and Bluetooth coexistence
3.3 Company profiles
3.3.1 Atheros Communications
3.3.2 Marvell
3.3.3 Nanoradio
3.3.4 Redpine Signals
3.3.5 STMicroelectronics and NXP wireless joint venture
3.3.6 Texas Instruments
4. NFC and UWB technologies
4.1 Overview of NFC and UWB technologies
4.2 Near Field Communication technology and standards
4.2.1 NFC modes
4.2.2 NFC solution architecture and chipsets
4.3 Ultra wideband technology and standards
4.3.1 WiMedia Alliance
4.3.2 Certified Wireless USB
4.4 Company profiles
4.4.1 Alereon
4.4.2 Artimi
4.4.3 Gemalto
4.4.4 Innovision
4.4.5 Inside Contactless
4.4.6 NXP Semiconductors
4.4.7 Realtek
4.4.8 Sony
4.4.9 Staccato Communications
4.4.10 Wisair
4.4.11 WiQuest Communications
5. Handset manufacturers
5.1 Nokia
5.2 Samsung Electronics
5.3 Motorola
5.4 Sony Ericsson
5.5 LG Electronics
5.6 Research In Motion
5.7 HTC
5.8 Second tier handset vendors
5.8.1 Acer/E-TEN
5.8.2 Apple
5.8.3 ASUSTeK
5.8.4 BenQ
5.8.5 Fujitsu
5.8.6 Gigabyte
5.8.7 Hewlett Packard
5.8.8 i-mate
5.8.9 Mio Technology
5.8.10 NEC
5.8.11 Palm
5.8.12 Panasonic
5.8.13 Sagem
5.8.14 Sharp
5.8.15 Toshiba
6. Market trends and forecasts
6.1 Market trends
6.2 Worldwide handset sales
6.3 Handset shipments by connectivity standard
6.4 IC vendor market shares
6.5 Connectivity IC shipment forecasts
6.6 Connectivity IC revenue forecasts
Glossary
List of Figures
Figure 1.1: Range versus throughput for wireless communication technologies
Figure 1.2: Performance comparison
Figure 1.3: Mobile phone hardware and software platform
Figure 1.4: GPS handset and service value chain
Figure 2.1: Examples of Bluetooth profiles
Figure 2.2: Overview of key Bluetooth chipset developers for handsets
Figure 2.3: Examples of Broadcom connectivity chipsets
Figure 2.4: Examples of CSR connectivity chipsets
Figure 2.5: Examples of Infineon connectivity chipsets
Figure 2.6: Examples of Qualcomm GSM/EGPRS/HSDPA wireless chipsets
Figure 3.1: IEEE 802.11 WLAN standards
Figure 3.2: Overview of mobile WLAN chipset developers
Figure 3.3: Examples of Atheros Communications' connectivity chipsets
Figure 3.4: Examples of STMicroelectronics' connectivity chipsets
Figure 3.5: Examples of Texas Instruments connectivity chipsets
Figure 4.1: UWB spectrum and band groups
Figure 5.1: Tier 1 mobile phone and smartphone manufacturers (World 2007)
Figure 5.2: Nokia handset sales and market share
Figure 5.3: Nokia WLAN, GPS or NFC-enabled GSM/WCDMA handsets
Figure 5.4: Samsung handset sales and market share
Figure 5.5: Samsung WLAN enabled handsets
Figure 5.6: Motorola handset sales and market share
Figure 5.7: Motorola handsets with WLAN or GPS
Figure 5.8: Sony Ericsson handset sales and market share
Figure 5.9: LG handset sales and market share
Figure 5.10: RIM handset sales and market share
Figure 5.11: RIM BlackBerry smartphones
Figure 5.12: GPS and WLAN-enabled HTC handsets
Figure 6.1: Worldwide handset sales by technology (World 2006- 2012)
Figure 6.2: Number of handset models available by connectivity technology
Figure 6.3: Handset shipments by connectivity technology (World 2004- 2007)
Figure 6.4: Market shares, Bluetooth ICs for mobile phones (2007)
Figure 6.5: Market shares, WLAN ICs for mobile phones (2007)
Figure 6.6: Handset sales by connectivity technology and attach rates
(World 2007- 12)
Figure 6.7: Connectivity solution revenues by technology (World 2007- 2012)
