This publication has been discontinued on June 30, 2011.
Below is the updated product.
Published: March, 2011
Product code: 203149
Abstract
LED (Light Emitting Diode) basically is a device which emits lights through a
bonding of an electron and a hole either in an active layer or near P-N
conjugation by spilling electric currents in a compound semiconductor
terminal. White LED is commercialized as BLUs for large-area LCD (TV, Monitor,
NotePC), automobile headlights, and regular lightings. Its application
gradually expands.
The white light source using LED is mercury-free, eco-friendly, and has a long
lifetime that it is expected to replace a considerable number of light source
in the future. Therefore, the social and economic influence of the LED is
significantly large if it presumably replaces a large number the conventional
light source.
In addition, the LED has already secured its place in BLUs, automobile
lightings, and landscape lightings. Product applications using LED light
sources also draw great attentions. Now, the LED appears to have passed the
effect of amplifying the design concept and become to play a role in product
share itself.
Displaybank analyzes the basic structure and manufacturing process of LED and
cost structures in each stage along with maker and price trend of key
sub-materials.
In terms of the report composition,
Chapter 1 offers an in-depth analysis on the LED manufacturing process
overview, substrate single crystal manufacturing process, epi-wafer
manufacturing process, epi growth technology, and chip manufacturing process.
Chapter 2 discusses key material and product composition of LED and
analyzes the cost of chip and package by main size in detail.
Chapter 3 discusses the status of makers, industry trend, and prices of
key sub-materials in relation to key sub-material of LED including substrate
single crystal, epi-wafer, chip, substrate (epoxy, lead frame, ceramic, WLP),
molding material (epoxy, silicon), and phosphor.
Moreover, a value chain is composed by LED industry.
Table of Contents
0. Introduction
- 0.1. Report Overview
- 0.2. Research Methodology
- 0.3. Research Scope and Definition
1. Basic Structure and Manufacturing Process of LED
- 1.1. Overview
- 1.2. Substrate Single Crystal
- 1.2.1. GaN based Substrate
- 1.2.2. GaAs based Substrate
- 1.3. Epi-wafer
- 1.3.1. Overview
- 1.3.2. Blue LED Epi-wafer
- 1.3.3. Red LED Epi-wafer
- 1.3.4. Infrared (IR) LED Epi-wafer
- 1.4. Chip
- 1.4.1. Blue based Chip
- 1.4.2. Red based Chip
- 1.5. Package
- 1.5.1. PCB Substrate Applied LED Lamp Package
- 1.5.2. Lead Frame Applied LED Lamp Package
- 1.5.3. Middle Power LED Lamp Package
- 1.5.4. W Power LED Lamp Package
2. LED Cost Structure
- 2.1. Key Material and Component Composition
- 2.1.1. Substrate
- 2.1.2. Epi-wafer
- 2.1.3. Chip
- 2.1.4. Package
- 2.2. Chip
- 2.2.1. 250*250 Chip
- 2.2.2. 350*350 Chip
- 2.2.3. 250*600 Chip
- 2.2.4. 500*500 Chip
- 2.2.5. 600*600 Chip
- 2.2.6. 1000*1000 Chip
- 2.3. Package
- 2.3.1. 1608 SMD Package
- 2.3.2. 3528 SMD Package
- 2.3.3. 5050 SMD Package
- 2.3.4. 0.5W SMD Package
- 2.3.5. 1W Power Package
3. Key LED Sub-Industry Trend
- 3.1. Substrate Single Crystal
- 3.1.1. Overview
- 3.1.2. Sapphire Substrate Roadmap
- 3.1.3. Sapphire Substrate Price
- 3.2. Epi-wafer/Chip
- 3.2.1. Overview
- 3.2.2. Epi-wafer Price
- 3.2.3. Chip Price
- 3.3. Substrate (Frame)
- 3.3.1. Overview
- 3.3.2. PCB Substrate
- 3.3.3. Lead Frame
- 3.3.4. Ceramic
- 3.3.5. WLP (Wafer Level Package)
- 3.4. Molding Material (Encapsulation)
- 3.4.1. Overview
- 3.4.2. Epoxy Resin
- 3.4.3. Silicon Resin
- 3.5. Phosphor
- 3.5.1. Overview
- 3.5.2. Phosphor Property by Type
- 3.5.3. Maker and Demand Trend
- 3.5.4. Price
Appendix. LED Value Chain
- A. W/W LED Maker
- B. Korea based LED Maker
- C. Taiwan based LED Maker
- D. W/W Ingot/Substrate Maker
- E. Key W/W LED Sub-Material Maker
INDEX
