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Market Research Report

Technology Analysis: LED Manufacturing Process, Equipment & Sub-Material

Published by DisplayBank
Published April, 2010 Product code 117224
Content info  
Price
US $ 5500 PDF By E-mail (Single User)


Technology Analysis: LED Manufacturing Process, Equipment & Sub-Material published by DisplayBank in April, 2010. This report price starts from US $ 5500.

Introduction

Abstract

Description

Report Composition and Highlights:

  • LED Manufacturing Process
    • LED Manufacturing Process Overview & Substrate Crystal Manufacturing Process
    • Epi-Wafer Manufacturing Process and Epi Growth Technology
    • Chip Manufacturing Process & in-Depth Analysis of Package Manufacturing Process
  • LED Equipment
    • Coverage in Epi Growth Equipment by Each Maker
    • Detailed Coverage in Technology & Characteristics for Chip Manufacturing Process Equipment and Package Manufacturing Equipment
  • LED Sub-Material
    • Epoxy and Silicon Resin Technology used for Molding Material in LED Package
    • PCB Substrate, Lead Frame Substrate, Ceramic Substrate and WLP Technology that Mainly Compose Substrate
    • Characteristics and Technical Issues by Phosphor Type

Supply Chain for LED Industry & Major Company List are Included:

  • Number of Pages : 140 page
  • Published on April 2010

Light Emitting Diode, or LED for short, is essentially a device that passes electrical current through compound semiconductor terminals to induce bond at the P-N junction or the active layer and emit light through the combination of electrons and holes. Especially White LEDs are applied to backlight for large-sized LCD display, automotive lighting and general lighting and the application fields are gradually being widened.

The white light source applying LED is mercury-free and therefore environmentally friendly. Being a solid device, white LED lighting is highly durable. It' s likely that white LED will replace all incandescent and fluorescent lighting in the future. This is what makes the socioeconomic impact of white LED lighting that much more significant.

LEDs are already show high penetration into BLU / Automotive / Scenic lighting that real-life applications that utilize LED light source gather much attention. Above and beyond the effect of amplifying its designable concept, LED has become commercial goods itself.

To this end, Displaybank aims to provide an exhaustive analysis on individual manufacturing process, equipment, substrate, and mainstream sub-material technologies for Epi, Chip, and Package, the three stages of LED product manufacturing.

The “Technology Analysis: LED Manufacturing Process, Equipment & Sub-Material” offers extensive analysis on LED manufacturing process / equipment / sub-material that will become the center of luminous source in near future to benefit LED epi, chip and package makers, companies that are interested in new LED businesses and all makers/suppliers located in LED supply chain.

Table of Contents

0. Introduction

  • 0.1. Report Overview
  • 0.2. Research Methodology

1. LED Manufacturing Process

  • 1.1 Overview
  • 1.2 Substrate Crystal Manufacturing Process
    • 1.2.1 Comparison of Characteristics by Substrate
    • 1.2.2 GaN-based Substrate
    • 1.2.3 GaAs-based Substrate
  • 1.3 Epi-Wafer
    • 1.3.1 Overview
    • 1.3.2 Comparison of LED Epitaxial Growth Technologies
    • 1.3.3 Details of LED Growth Technologies
    • 1.3.4 Blue LED
    • 1.3.5 Red LED
    • 1.3.6 IR(InfraRed) LED
  • 1.4 Chip
    • 1.4.1 LED Chip Structure
    • 1.4.2 Blue Chip Process
    • 1.4.3 Red Chip Process
    • 1.4.4 Details of Unit Processes
  • 1.5. Package
    • 1.5.1 PCB Substrate Package
    • 1.5.2 Lead Frame Package
    • 1.5.3 Middle Power Package
    • 1.5.4 High Power Package

2. LED Equipments

  • 2.1 Epitaxial Growth Equipments
    • 2.1.1 Aixtron / Thomas Swan
    • 2.1.2 Veeco
  • 2.2 Chip Manufacturing Equipments
    • 2.2.1 Mask Aligner
    • 2.2.2 E-Beam Evaporator
    • 2.2.3 ICP-RIE (Inductively Coupled Plasma Reactive Ion Etcher)
    • 2.2.4 PECVD (Plasma Enhanced Chemical Vapor Deposition)
    • 2.2.5 RIE (Reactive Ion Etcher)
    • 2.2.6 Plasma Asher
  • 2.3 Package Manufacturing Equipments
    • 2.3.1 Die Bonder
    • 2.3.2 Wire Bonder
    • 2.3.3 Transfer Mold Machine
    • 2.3.4 Saw Machine
    • 2.3.5 Tester & Handler
    • 2.3.6 Taping Machine

3. LED Subsidiary Materials

  • 3.1 Molding Materials
    • 3.1.1 Epoxy
    • 3.1.2 Silicon
  • 3.2 Package Substrate (Frame)
    • 3.2.1 PCB
    • 3.2.2 Lead Frame
    • 3.2.3 Ceramic
    • 3.2.4 WLP
  • 3.3 Phosphor
    • 3.3.1 Principles of Light Emission
    • 3.3.2 Light Emitting Characteristics and Features of Detergent
    • 3.3.3 Synthetic Technologies
    • 3.3.4 LED-use Phosphor Characteristics by Type

Appendix. LED Value Chain

  • A. W/W LED Enterprises
  • B. Korean LED Enterprises
  • C. Taiwan LED Enterprises
  • D. W/W Ingot/Substrate Enterprises
  • E. W/W Major LED Subsidiary Material Enterprises
  • F. W/W Major LED Package Equipment Enterprises
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