Ericsson RU22 W-CDMA 850MHz Model KRC 118 22/1 R1D/B

Published by	EJL Wireless Research
Published	May, 2009	Product code	89935
Content info	59 Pages, 21 Tables, 37 Exhibits
Price	US $ 5000 PDF by E-mail (Single User License) US $ 12500 PDF by Email, Enterprise use license (up to five users)

Introduction
Related Reports

Ericsson RU22 W-CDMA 850MHz Model KRC 118 22/1 R1D/B published by EJL Wireless Research in May, 2009. This report consists of 59 Pages, 21 Tables, 37 Exhibits and the price starts from US $ 5000.

Introduction

Abstract

This report covers the design analysis of an Ericsson RU22 WCDMA850MHz radio transceiver unit. This unit is part of the RBS3x06 WCDMA base station platform. The unit was manufactured in Q2 2006.

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Anaren Microwave, Altera, Epcos AG, Fairchild Semiconductor, Ferroxcube, Freescale Semiconductor, Infineon Technologies, Integrated Device Technology, M/A-COM, Maxim Integrated Products, Murata Electronics Co., Ltd., National Semiconductor, NDK, NXP Semiconductors, RF Microdevices, STMicroelectronics, Texas Instruments, TriQuint Semiconductors and Vishay Semiconductors.

Features

Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description
Package Type

Important Note: There is NO component pricing contained within the report.

EXECUTIVE SUMMARY

Active/Passive Component Summary
Important Note:

CHAPTER 1: RBS 3X0X SYSTEM

1.1 Overview of Ericsson RBS 3000 Platform

CHAPTER 2: MECHANICAL ANALYSIS

2.1 Mechanical Analysis

CHAPTER 3: TRANSCEIVER SUBSYSTEM

Area A: Transceiver Baseband Digital Processing
Area B: Transceiver Power Management
Area C: Transceiver Tx Section
Area D: Transceiver Rx Section
63 PA7F17 Synthesizer Module
62 PA7F16 Synthesizer Module
E268C Synthesizer Module
Area E: Master Signal Generation
Area F: Transmit Sample Path for DPD
Area G: Secondary PLL
Area H: Hex Inverter
Area I: RF Rx/Serial Connectors

CHAPTER 4: POWER AMPLIFIER SYSTEM

Area J: Power Amplifier Power Management Section
Area K: Driver Amplifier Section
Area L: High Power Output Amplifier Section
Area M: RF Output Conditioning Section

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

Table 1: Area A Bill of Materials
Table 2: Area B Bill of Materials
Table 3: Area C Bill of Materials
Table 4: Area D1, D2 Bill of Materials
Table 5: 63 PA7F17 Bill of Materials
Table 6: 62 PA7F16 Bill of Materials
Table 7: E268C Bill of Materials
Table 8: Area E Bill of Materials
Table 9: Area F Bill of Materials
Table 10: Area G Bill of Materials
Table 11: Area H Bill of Materials
Table 12: Area I Bill of Materials
Table 13: Area J Bill of Materials
Table 14: Area K Bill of Materials
Table 15: Area L Bill of Materials
Table 16: Area M Bill of Materials
Table 17: Passive Component Case Size Distribution by System Subsection
Table 18: Identified Passive Component Supplier Distribution by System Subsection
Table 19: Active/Passive Component Distribution by System Subsection
Table 20: Active Semiconductor Vendor Distribution by System Subsection
Table 21: Active Semiconductor Vendor Distribution by System Subsection (con' t)