SMARTPHONE & CHIP MARKET OPPORTUNITIES

SMARTPHONE & CHIP MARKET OPPORTUNITIES published by Forward Concepts Company in February, 2009. This report consists of 607 Pages, 64 Figures, 152 Tables and the price starts from US $ 3750.

Introduction

Abstract

Overview

Smartphones essentially represent an evolution of the highly prolific voice-centric feature phones into mobile data devices. Although, there is no single industry-wide definition of Smartphones, we define Smartphones as devices designed around a core applications processor with standardized interfaces and powered by an open multitasking Operating System (O/S).

In today' s recessionary economy, Smartphones are projected to be one of the few bright spots in the electronics industry, with 2008 unit growth projected to be just over 13%. Although this is below the previous year' s growth of 19%, it still represents bright opportunities for Smartphone vendors and the vendors of the chips and software that enable them. This report provides calibration and guidance for all companies that serve the cellphone market.

The first-generation Smartphones were expensive and hence essentially enterprise-focused, catering primarily to mobile email, messaging and calendaring functions with a limited set of document viewing and productivity applications. However, the widespread adoption of 3G networks and price erosion has resulted in a significant growth of Smartphones in the consumer market. The two fundamental market trends driving the next-generation consumer Smartphones are - Mobile Internet and Mobile Multimedia.

While in its most basic form Mobile Internet involves bringing full PC-level web browsing capabilities to Smartphones, it is also driving a host of other Internet-centric applications, such as location-based services. Similarly, basic Mobile Multimedia capabilities enable users to browse and consume rich-media content present in social networking and other websites using Web 2.0 technologies. However, thanks to a powerful array of signal processing, computation capabilities and hardware accelerators in higher end applications processors, Mobile Multimedia in a more potent form is driving a whole new level of sophisticated consumer and entertainment oriented applications such as, mobile gaming, highresolution digital cameras with anti-blur capturing and image sharpening, camcorders with advanced image stabilization and noise reduction, high-definition video, multi-channel audio and mobile TV.

The digital camera and camcorder features in the higher-end devices are beginning to rival those in the respective standalone devices, often at a far lower price premium, only to be further accentuated by the significant operator subsidies towards Smartphones purchased with a contract, resulting in a priceperformance unrivalled in any modern day consumer electronic device. These factors are driving increasing levels of sophisticated Smartphones integrated with a host of arcane technologies into the mass consumer market on an unprecedented and global scale.

Current-generation Smartphones also integrate numerous other sensors and peripherals such as fullscreen multi-touch displays, Wi-Fi, WiMAX, FM transceivers, accelerometers and fingerprint sensors not to mention the ubiquitous presence of Bluetooth and GPS and increasing penetration of 7.2 Mbps HSDPA.

With the ever increasing computational and multimedia capabilities of mobile applications processors, Smartphones are evolving from fixed function devices with tightly integrated OEM software to a more open architecture with support from a large contingent of third party applications, very much reminiscent of the early days of the PC industry. This changing business model coupled with the access to a large number of function accelerators embedded within Smartphones supporting functions such as high-definition video codecs, audio codecs and image processors along with the aforementioned peripherals and sensors is sparking a new set of innovative applications built around popular themes such as, location based services, geotagging, social networking, security, e-commerce and entertainment.

Music, mobile Internet, location based services and mobile TV are currently the most popular Smartphone applications. In order to capitalize on this opportunity and better differentiate their products, major Smartphone OEMs including Nokia, RIM, Apple and Google have all announced applications and services strategies supporting their respective Smartphones, in their attempt to move beyond a hardware-centric business model. Apple has iTunes and AppStore, Google has launched its own Android Market, Motorola has MotoMusic and RIM has confirmed plans for a BlackBerry application storefront. Nokia has also announced its own comprehensive Comes-With-Music and Ovi mobile Internet service strategy. In its attempt to catch-up with iTunes and iPhone, Nokia has forged partnerships with the big-four, Sony BMG, Warner Music, Universal Music and EMI, and, for the first time, is offering an unlimited download service for 12 months following the purchase of a qualified Smartphone.

Unlike Nokia, Sony-Ericsson has chosen to offer its PlayNow"! unlimited music service through mobile operators for a monthly fee. In January 2008, the company announced partnerships with 10 of the largest international and regional music labels including: Sony BMG, Warner Music Group, EMI, The Orchard, IODA, The PocketGroup, Hungama, X5 Music, Bonnier Amigo and VidZone, adding over 5 million new tracks to PlayNow. Telenor of Sweden was the first operator to offer PlayNow on Sony Ericsson' s Walkman series Smartphones.

While Apple had the first movers advantage with operators, Nokia and others taking an operator independent approach will face increasing level of resistance from operators themselves are looking into offering similar services to their subscribers. Orange has announced its own Musique Max service in France that combines unlimited music download with a mobile-Internet service for a flat monthly fee. Mobile gaming is another growing application in Smartphones. Sony Ericsson has added 250 new games through agreements with leading games manufactures such as EA Games, Gameloft, THQ, Glu, Digital Chocolate and I-Play making its Smartphone users download more games than users of any other Smartphone.

Table of Contents

I. Executive Summary

• A. Overview
• B. Key Findings
• C. Smartphone Market Overview
• D. Smartphone Chip Market Overview
• E. Smartphone Semiconductor Forecast Highlights

II. Smartphone Market Trends

• A. Device and Usage Trends
  • 1. Macro Trends
  • 2. Architectural Trends
  • 3. Security Trends
  • 4. Input Method Trends
  • 5. Air Interface Trends
• B. O/S Trends
• C. Service & Application Trends
• D. Semiconductor Trends

III. Mobile Internet

• A. Mobile Web Browsers
  • 1. Apple MobileSafari
  • 2. BlackBerry Browser
  • 3. Microsoft Internet Explorer Mobile
  • 4. Nokia Web Browser for S60 (formerly OSS Browser)
  • 5. Opera Mobile
  • 6. Skyfire
• B. Web Technologies & Environments
  • 1. Java ME (Micro Edition)
  • 2. Asynchronous JavaScript and XML (AJAX)
  • 3. Dynamic HTML (DHTML)
• C. Browser Plug-ins
  • 1. Adobe Flash
  • 2. Microsoft Silverlight

IV. 3G Market Drivers & Migration Paths

• A. Spectral Efficiency
  • 1. Increased Voice Capacity
  • 2. Improved Cell Edge Performance
• B. Higher Peak & Average Data Rates
• C. All IP-Network Benefits
  • 1. VoIP over Cellular
  • 2. Simplified Fixed Mobile Convergence (FMC) Implementation
• D. Reduced End-to-End Network Latencies & Jitter
• E. New and Improved Services
  • 1. IMS Integration
  • 2. Better Suitability for Streaming Media Services
    • a) Support for Broadcast and Multicast Services

V. Mobile Multimedia

• A. Multimedia Players
  • 1. Windows Media Player Mobile
  • 2. RealNetworks RealPlayer
• B. Multimedia Containers
  • 1. 3GPP 3GP
  • 2. Apple QuickTime
  • 3. Microsoft Advanced Systems Format (ASF)
  • 4. Microsoft Audio Video Interleave (AVI)
  • 5. ISO/IEC MPEG-4 Part 14 (MP4)
  • 6. Ogg
  • 7. RealNetworks RealMedia
    • a) RealNetworks RealMedia Variable BitRate (RMVB)
• C. Multimedia Communication Protocols
  • 1. 3GPP 3G-324.M
  • 2. IETF Session Initiation Protocol (SIP)
  • 3. ITU-T H.323
• D. Video Coding Algorithms
  • 1. ITU-T H.263
  • 2. ITU-T H.264/MPEG-4 Part 10
  • 3. Microsoft Windows Media Video (WMV / WMV9 / VC-1)
  • 4. RealNetworks RealVideo
  • 5. DivX
  • 6. TrueMotion VP6
  • 7. Xvid
• E. Digital Audio Coding Algorithms
  • 1. Audio Interchange File Format (AIFF)
  • 2. MPEG Audio Layer 3 (MP3)
  • 3. Advanced Audio Codec (AAC)
  • 4. High Efficiency AAC (HE-AAC)/aacPlus/aacPlus v1/AAC+
  • 5. High Efficiency AAC v2/aacPlus v2/Enhanced AAC+/AAC++
  • 6. RealNetworks RealAudio
  • 7. Microsoft Windows Media Audio (WMA)
• F. Speech Coding & Recording Algorithms
  • 1. Half Rate (HR /GSM-HR)
  • 2. Full Rate (FR /GSM-FR / GSM 06.10)
  • 3. Microsoft GSM (MS-GSM)
  • 4. Enhanced Full Rate (EFR /GSM-EFR)
  • 5. Adaptive Multi-Rate (AMR/AMR-NB/AMR-HR/AMR-FR)
  • 6. Adaptive Multi-Rate - Wide Band (AMR-WB)
  • 7. Variable Multi-Rate - Wide Band (VMR-WB)
  • 8. Extended Adaptive Multi-Rate-Wide Band (AMR-WB+)
  • 9. Qualcomm PureVoice (QCELP)
  • 10. Enhanced Variable Rate Codec (EVRC/IS-127)
  • 11. Enhanced Variable Rate Codec B (EVRC-B)

VI. 3GPP 3G Standards Overview

• A. 3GPP Packet Network Architecture Evolution
  • 1. Core Network Architecture Evolution
  • 2. Radio Access Network (RAN) Architecture Evolution
• B. 3GPP Air Interface Technology Evolution
  • 1. HSDPA (3GPP Release 5)
    • a) Time Domain Link Adaption
    • b) Hybrid ARQ
    • c) Fast Packet Scheduling
  • 2. HSUPA (3GPP Release 6)
  • 3. HSPA Evolved or HSPA+ (3GPP Release 7)
    • a) Higher-Order Modulation
    • b) Multiple Input Multiple Output (MIMO)
    • c) Continuous Packet Connectivity (CPC)
  • 4. Evolved EDGE (3GPP Release 7)
  • 5. LTE (3GPP Release 8)
    • a) LTE System Architecture
    • b) LTE Radio Interface Protocol Architecture
    • c) LTE - WCDMA Handovers
    • d) Frequency Domain Scheduling
    • e) Frequency Domain Link Adaptation
    • f) Channel Quality Estimation
    • g) Frequency Domain Channel Equalization
    • h) Advantages of OFDM over WCDMA
    • i) Drawbacks of OFDM
• C. Technical References

VII. Global Smartphone Market

• A. Overall Global Smartphone Market Share (2008)
• B. Smartphone Vendor Market Shares by Region (2008)
  • 1. North America
  • 2. Western Europe
  • 3. Japan
  • 4. South Korea
  • 5. China
  • 6. India
  • 7. Middle-East and Africa
  • 8. Central/Latin America
  • 9. Eastern Europe
  • 10. Asia Pacific
• C. Global Smartphone Shipment Forecast (' 08-' 12)
  • 1. Global Smartphone Unit Shipment Forecast by Region (' 08-' 13)
  • 2. Global Smartphone Unit Shipment Forecast by Cellular Technology (' 07-' 13)

VIII. Global Smartphone Suppliers

• 1. Acer/E-Ten
• 2. Amoi
• 3. Apple
• 4. ASUSTeK Computer
• 5. CEC Telecom
• 6. Gigabyte Communications
• 7. Hewlett Packard
• 8. HTC Corporation
• 9. Kyocera
• 10. Lenovo Mobile Communications
• 11. LG Electronics
• 12. Mitac
• 13. Motorola
• 14. Nokia
• 15. Palm
• 16. Pantech & Curitel
• 17. Research In Motion (RIM)
• 18. Sony Ericsson
• 19. Samsung

IX. Japan Smartphone Market

• A. Overview
• B. Japanese Smartphone Suppliers
  • 1. Fujitsu
  • 2. NEC Mobile
  • 3. Panasonic Mobile Communications
  • 4. Sharp
  • 5. Sony Ericsson
  • 6. Toshiba

X. Smartphone Operating Systems

• A. Overview
• B. Smartphone O/S Market Share and Forecast
• C. Global Smartphone O/S Market Share & Forecast
• D. Regional Smartphone O/S & Air IF Market Shares & Forecast
  • 1. North America
  • 2. Western Europe
  • 3. Japan
  • 4. South Korea
  • 5. China
  • 6. India
  • 7. Southeast Asia
  • 8. Eastern Europe
  • 9. Central and Latin America
  • 10. Middle East & Africa
• E. O/S Vendor Profiles
  • 1. Google Android"!
  • 2. Microsoft Windows Mobile
  • 3. Symbian

XI. Smartphone Semiconductor Market

• A. Communication Processors
  • 1. Overview
  • 2. 2.5G Communication Processors
    • a) Overview
    • b) 2.5G Communication Processor Market Share & Forecast
    • c) 2.5G Communications Processor Vendor Profiles
      • i. Freescale (EGPRS Platform)
      • ii. Marvell (Single-Die EGPRS Baseband Communications Processor)
      • iii. Texas Instruments (Single-chip EGPRS Baseband Applications Processor)
      • iv. Texas Instruments (Single-die EGPRS Baseband Multimedia Applications Processor)
  • 3. 3G Communication Processors/Platforms
    • a) Overview
    • b) 3G Communication Processor Market Share & Forecast
    • c) 3G Communications Processors/Platforms Vendor Profiles
      • i. Broadcom (Single-die HSDPA/EDGE Baseband Processor)
      • ii. Broadcom (Single-die HSPA/EDGE Baseband+RF Processor)
      • iii. Ericsson Mobile Platforms (HEDGE Multimedia Platforms)
      • iv. Freescale Semiconductor (Multimode, Multiband HEDGE Platform)
      • v. Marvell (Single-Die HEDGE Baseband Communications Processor)
      • vi. Panasonic (GPRS/HSDPA Baseband High-Def Communication Processors)
      • vii. NEC Electronics (Single-chip HEDGE Baseband Communications Processor)
      • viii. NXP (WEDGE Multimedia Platform)
      • ix. Qualcomm (HEDGE and EV-DO Multimedia Platforms)
      • x. Renesas Technology (FOMA and HEDGE Multimedia Platforms)
• B. Stand-alone Applications Processors
  • 1. Overview
  • 2. Stand-alone Applications Processor Market Share & Forecast
  • 3. Low-Definition Multimedia Applications Processor Vendor Profiles
    • a) Marvell
    • b) NXP
    • c) Samsung (Stacked Memory MCP Applications Processor)
    • d) STMicroelectronics
    • e) Texas Instruments
  • 4. Standard-Definition Multimedia Applications Processor Vendor Profiles
    • a) Core Logic
    • b) Freescale
    • c) Marvell
    • d) Nvidia
    • a) Panasonic
    • e) Renesas Technology
    • f) Samsung
    • g) STMicroelectronics
    • a) Texas Instruments
    • b) Zoran (Multimedia Applications Processor)
• C. Media Co-Processors
  • 1. Overview
  • 2. Supplier Profiles
    • a) AMD/ATI Technologies (Std. Definition Media Co-Processor)
    • b) Broadcom (High-Def Media Co-Processor)
    • c) Marvell (Std.-Definition Media Co-Processor)
    • d) MtekVision (Std.-Definition Media Co-Processor)
    • e) Nvidia (Std.-Definition Media Co-Processor)
    • f) Nvidia (Low-Definition Media Co-Processor)
    • g) Texas Instruments (Low-Definition & Std.-Definition Media Co-Processors)
    • h) Toshiba (Std.-Definition Media Co-Processor)
• D. Non-Captive Baseband & RF Transceivers
  • 1. 3G Stack Market Overview
    • a) LTE Software
  • 2. Cellular Baseband & RF Transceiver Market Share & Forecast
  • 3. Cellular Baseband and RF Transceiver Supplier Profiles
    • a) AKM (WCDMA RF Xceivers)
    • b) Broadcom (EDGE DBB, RF Xceiver, DBB+RF Xceiver)
    • c) Ericsson Mobile Platforms (HSPA, HSPA+ and LTE Modems)
    • d) Ericsson Mobile Platforms (UMTS/HSPA BB/RF + Multimedia Co-Processors)
    • e) Freescale (WEDGE and EDGE RF Subsystems)
    • f) Icera Semiconductor (Multimode HSPA/EDGE Baseband)
    • g) Infineon (CMOS EDGE, WEDGE & LTE Xceivers)
    • h) Infineon (Multimode/Multiband HEDGE BB/RF/PM Platform)
    • i) Interdigital (Multimode HSPA/EDGE Baseband)
    • j) NXP (CMOS EDGE Xceivers)
    • k) Qualcomm (WCDMA/EV-DO Baseband/RF + Multimedia Co-Processors)
    • l) Renesas (SOI BiCMOS GSM/GPRS/EDGE Xceiver)
    • m) Renesas Technology (Single-chip Multiband WEDGE/HSPA RF Xceiver)
    • n) RF Micro Devices (EDGE Xceiver/SW-PA Module)
    • o) Skyworks Solutions (Multiband, Direct Conversion HEDGE RF Xceivers)
• E. Bluetooth
  • 1. Overview
    • a) Bluetooth 1.0 and 1.0B
    • b) Bluetooth 1.1
    • c) Bluetooth 1.2
    • d) Bluetooth 2.0 EDR
    • e) Bluetooth 2.1
    • f) Wimedia High-speed Bluetooth
    • g) Bluetooth Seattle
    • h) Ultra Low Power Bluetooth (a.k.a. Wibree)
    • i) Advanced Audio Distribution (A2DP) Profile
  • 2. Bluetooth Market Share & Forecast
  • 3. Bluetooth Supplier Profiles
    • a) Broadcom (130nm CMOS BT 2.1+EDR + FM/RDS + Wi-Fi)
    • b) CSR (130 nm CMOS BT 2.1+EDR, BT 2.1+EDR + Wibree + FM/RDS + GPS)
    • c) Infineon Technologies AG (130 nm CMOS BT 2.0 EDR)
    • d) NXP (CMOS BT 2.0 EDR, BT 2.0 EDR + Wi-Fi)
    • e) Qualcomm (130 nm CMOS BT 2.0 EDR)
    • f) Staccato (110 nm CMOS BT 3.0, USB over UWB)
    • g) STMicroelectronics (Single-Chip CMOS BT 2.1 EDR, BT 2.1 EDR + FM Xceiver)
    • h) Texas Instruments (Single-Chip 65nm CMOS BT 2.1 EDR + FM Xceiver)
• F. Mobile Wireless LAN
  • 1. Overview
  • 2. Mobile Wireless LAN Market Share & Forecast
  • 3. Mobile Wireless LAN Supplier Profiles
    • a) Atheros Communications (Single-Chip Wi-Fi and GPS)
    • b) Broadcom (Single-Chip Wi-Fi+Bluetooth+FM)
    • c) Marvell (Single-Chip Wi-Fi + BT 2.0 EDR, Wi-Fi + BT 2.0 EDR + FM)
    • d) NXP Semiconductors (Wi-Fi/UMA, Wi-Fi+Bluetooth SIP)
    • e) Qualcomm
    • f) STMicroelectronics (SIP-based Wi-Fi)
    • g) Texas Instruments (Single-Chip Wi-Fi + BT 2.1 EDR + FM/RDS)
• G. FM Radio
  • 1. Overview
  • 2. FM Radio Market Share & Forecast
  • 3. FM Radio Supplier Profiles
    • a) Airoha Technologies (FM Stereo Receiver + RDS/RBDS)
    • b) NXP (Single-Chip FM Stereo Receiver + RDS + AM)
    • c) ROHM (Single-Chip FM Stereo Receiver)
    • d) Sanyo (AM/FM Receiver)
    • e) Silicon Labs (CMOS FM Stereo RDS/RBDS Xceiver, AM/FM Receiver)
    • f) STMicroelectronics (FM RDS Receiver)
    • g) Texas Instruments (FM RDS Transceiver)
• H. GPS
  • 1. Overview
    • a) Future Satellite Navigation Systems
    • b) Navigation Software for Smartphones
  • 2. GPS Market Share & Forecast
  • 3. GPS Chip Supplier Profiles
    • a) Atheros/u-Nav (One-Chip SoC)
    • b) Broadcom/Global Locate (A-GPS)
    • c) Infineon (Global Locate GPS Chip)
    • d) Nemerix
    • e) NXP (GloNav)
    • f) Qualcomm (Embedded A-GPS)
    • g) RFMD (Software-assisted GPS Receiver)
    • h) SiRF Technology (Stand-alone 90 nm Single-Die A-GPS)
    • i) STMicroelectronics (2-Chip Set)
    • j) Texas Instruments (Single-Chip A-GPS)
• I. Mobile WiMAX
  • 1. Overview
  • 2. Mobile WiMAX Supplier Profiles
    • a) Beceem Communications (802.16e Wave 2 PHY, MAC & Direct Conversion RF)
    • b) IntelR (802.16e Wave 2 PHY, MAC & Triple-band RF)
    • c) Sequans (802.16e Wave 2 PHY, MAC & CMOS RF)
• J. Mobile TV
  • 1. Mobile TV Standards Overview
  • 2. Mobile TV Semiconductor Market Share & Forecast
  • 3. Mobile TV Semiconductor Vendors
    • a) Broadcom (CMOS DVB-H & DVB-T Monolithic Tuner)
    • b) DiBcom (DVB-H/T/SH Tuners & Demods)
    • c) Imagination Technology (Multi-Standard MTV Demodulator IP Core)
    • d) Infineon (CMOS DVB-H, DVB-T Tuner & Demod)
    • e) Innofidei (CMMB Demod & Receiver)
    • f) Legend Silicon (DMB-TH, TDS-OFDM Demod)
    • g) Maxim (ISDB-T 1Seg & 3Seg Tuners)
    • h) MegaChips (ISDB-T Demod)
    • i) Newport Media (CMOS DVB-H, ISDB-T Tuner & Demod)
    • j) NXP (Analog TV Output Processor)
    • k) Qualcomm (MediaFLO"!, ISDB-T, DVB-H Tuner & Demod)
    • l) Samsung (Multi-Mode DVB-T/H, DAB-IP, ISDB-T/T-DMB Tuner & Demod)
    • m) Siano Mobile Silicon (DVB-T/H, T-DMB, ISDB-T, CMMB Tuner & Demod)
    • n) Texas Instruments (DVB-H, ISDB-T Tuner & Demod)
• K. Digital Camera Image Sensors & Processors
  • 1. Overview
  • 2. Image Sensor Market Share & Forecast
  • 3. Image Sensor Supplier Profiles
    • a) Aptina Imaging (CMOS Image Sensors and Processors)
    • b) MagnaChip Semiconductor (SXGA, UXGA & 3.2MP Imagers & Processors)
    • c) OmniVision (3.2MP, 5MP and 8MP CMOS Sensors & Processors)
    • d) Samsung (8.4 MP CMOS Image Sensor)
    • e) STMicroelectronics (1.3MP, 2MP and 3.15MP Sensors & Processors)
    • f) Toshiba Electronic Components (CMOS 3.2 MP & 2MP)
• L. Fingerprint Sensors
  • 1. Overview
    • a) Fingerprint Sensor Technologies
  • 2. Fingerprint Sensor Market Share & Forecast
  • 3. Fingerprint Sensor Supplier Profiles
    • a) Atmel (Fingerprint Recognition Sensor)
    • b) Atrua Technologies (Fingerprint Authentication & Touch Navigation Chip)
    • c) Authentec (Fingerprint Authentication Sensors)
    • d) UPEK (Capacitive Fingerprint Sensors)
• M. Touchscreen Panels & Controllers
  • 1. Overview
    • a) Resistive Touchscreens
    • b) Capacitive Touchscreens
  • 2. Touchscreen Controller Market Share & Forecast
  • 3. Touchscreen Controller Supplier Profiles
    • a) Broadcom (Capacitive Touchscreen Controller)
    • b) Cypress (Capacitive Touchscreen Controllers)
    • c) ELANTECH (Capacitive Touchscreen Modules & Controllers)
    • d) Leadis Technology (Capacitive Touchscreen Controllers With Integrated Haptics Driver)
    • e) STMicroelectronics (Resistive & Capacitive Touchscreen Controllers)
    • f) Synaptics (Capacitive & Resistive Touchscreen Controllers)
    • g) Texas Instruments (Resistive Touchscreen Controllers)
• N. Accelerometers
  • 1. Overview
  • 2. Accelerometer Vendor Market Share & Forecast
  • 3. Accelerometer Semiconductor Vendor Profiles
    • a) Analog Devices (3-axis MEMS Accelerometers)
    • b) Bosch Sensortec (3-axis MEMS Accelerometers)
    • c) Freescale (3-axis Digital Accelerometers)
    • d) Hitachi Metals (3-axis Digital Accelerometers)
    • e) Kionix (3-axis MEMS Accelerometers)
    • f) STMicroelectronics (3-axis Linear MEMS Accelerometers)
• O. Pico Projectors
  • 1. Overview
  • 2. Semiconductor Vendor Profiles
    • a) Microvision (Single-Mirror MEMS Pico Projector)
    • b) Texas Instruments (DLP Pico Projector)
• P. Licensed Processor, Graphics & Media Cores
  • 1. ARM Cortex"! A8 (Low-Power Processor IP)
  • 2. AMD/ATI Technologies (Low-Power 2D/3D Graphics Cores)
  • 3. Imagination Technologies Group (2D/3D Graphics, Multimedia & Display IP)

XII. Semiconductor & Mobile Platform Vendor Profiles

• A. Broadcom
• B. Ericsson Mobile Platforms (EMP)
• C. Freescale
• D. Infineon
• E. Marvell
• F. NEC Electronics
• G. NXP Semiconductor
• H. Qualcomm
• I. Renesas Technology
• J. ST Microelectronics
• K. Texas Instruments

XIII. Wireless & Multimedia: Acronyms & Abbreviations

List of Figures

• Figure 1 Smartphone Shipments by Region - 2008
• Figure 2 Smartphone O/S Vendor Unit Market Share - 2008
• Figure 3: Smartphone Semiconductor Revenue Forecast - 2008 - 2013
• Figure 4: Nokia Mobile Browser and Web Runtime Roadmap
• Figure 5: 3GPP, 3GPP2 and Mobile WiMAX Standards and Migration Paths
• Figure 6: Spectral Efficiency for WCDMA (R99 - R8) and LTE
• Figure 7: Voice Capacity in Paired 10 MHz Band for GSM, UMTS R99/R6/R7 and LTE
• Figure 8: HSPA (R6) and LTE Typical Cell Edge User Throughput
• Figure 9: Peak Data Rates in UL and DL for WCDMA and LTE
• Figure 10: EDGE, WCDMA (R99 - R7), LTE and DSL Typical Roundtrip Network Latencies
• Figure 11: Bandwidth and Latency Requirements for Key Services
• Figure 12: 3GPP Packet Network Architecture Evolution
• Figure 13: 3GPP Core Network Architecture and Interfaces
• Figure 14: LTE Overall System Architecture
• Figure 15: Functional Split Between E-UTRAN and Evolved Packet Core (EPC)
• Figure 16: LTE Radio Interface Protocol Architecture
• Figure 17: E-UTRAN Layer 2 Downlink Radio Protocol Architecture and Workload Partitioning
• Figure 18: Motorola MOTOMAGX Mobile Linux Platform
• Figure 19: Android Software Stack
• Figure 20: Freescale MXC275 EGPRS Platform
• Figure 21: Marvell PXA901 Communications Processor Block Diagram
• Figure 22: OMAP850 Communications Processor Block Diagram
• Figure 23: OMAP850 Based Smartphone Reference Design
• Figure 24: OMAPV1030 Communications Processor Block Diagram
• Figure 25: Broadcom HEDGE Applications Processor
• Figure 26: Broadcom Standard Definition Apps Processor Block Diagram
• Figure 27: Freescale 3G Single-Core Modem Platform
• Figure 28: NEC Electronics Medity2 Chipset
• Figure 29: NXP 7210 WEDGE Platform
• Figure 30: Qualcomm MSM7600 Chipset Solution
• Figure 31: Qualcomm MSM7600 Chipset RF Options
• Figure 32: Marvell PXA270 Block Diagram
• Figure 33: NXP PNX4008 Block Diagram
• Figure 34: STMicro STn8815 Block Diagram
• Figure 35: TI OMAP1710 Applications Processor Block Diagram
• Figure 36: Core Logic Multimedia Device Block Diagram
• Figure 37: Freescale Standard-Definition Applications Processor Block Diagram
• Figure 38: Marvell PXA320 Standard-Definition SoC Block Diagram
• Figure 39: Samsung Standard-Definition Apps Processor Block Diagram
• Figure 40: STMicro Nomadik STn8815 Applications Processor Block Diagram
• Figure 41: Texas Instruments Standard-Definition OMAP Apps Processor Block Diagram
• Figure 42: Broadcom High-Def Mobile Multimedia Co-Processor Block Diagram
• Figure 43: Marvell 2700G Graphics and Multimedia Accelerator
• Figure 44: MtekVision Multimedia Co-Processor Architecture
• Figure 45: TI OMAP-DM500/OMAP-DM299 Media Co-processor
• Figure 46: TI OMAP-DM510 Media Co-processor
• Figure 47: RF Transceiver Supplier Overview
• Figure 48: Broadcom BCM21331 Cellular EDGE Processor
• Figure 49 Freescale' s 4-chip WCDMA/EDGE Radio Block Diagram
• Figure 50: Freescale' s RFX300-30: 2-chip WCDMA/EDGE Radio Block Diagram
• Figure 51: Infineon HSDPA Modem Platform
• Figure 52: MSM6260 Cat. 6 HSDPA Multimedia Platform
• Figure 53: MSM6280 Cat. 8 HSDPA Enhanced Multimedia Platform
• Figure 54: MSM6500 EV-DO Rev 0 + GSM/GPRS Multimedia Platform
• Figure 55: MSM6550 1X Rel 0/Rev A/EV-DO Rev 0 + GSM/GPRS Multimedia Platform
• Figure 56: Texas Instruments WiLink 6.0 Solution
• Figure 57: GPS Receiver Block Diagram
• Figure 58 Global Locate/Broadcom Hammerhead II A-GPS Chip Block Diagram
• Figure 59: Intel WiMAX Connection 2400 Solution
• Figure 60: Sequans SQN1130 802.16e Wave 2 Baseband (MAC+PHY) Chip Architecture
• Figure 61: Smartphone Image Sensor Usage by Resolution - 2008
• Figure 62: NEC Medity Applications Processor Roadmap
• Figure 63: Renesas SH-Mobile Applications Processor Product Roadmap
• Figure 64: Renesas SH-Mobile G-series Smartphone Platforms with Integrated Baseband LSI

List of Tables

• Table 1: Smartphone Vendor Unit Shipments and Market Share - 2008
• Table 2: Smartphone Unit Shipments and Market Share by Primary Cellular Technology - 2008
• Table 3: Java Technologies Supported by Nokia Series 40 and Series 60 Platforms
• Table 4: Theoretical Max Achievable Spectral Efficiency for GPRS, EDGE, WCDMA & LTE
• Table 5: Peak and Average UL/DL Data Rates for GPRS, EDGE, WCDMA (R99 - R7) and LTE
• Table 6: 3GPP Standards Evolution
• Table 7: HSDPA Supported User Equipment (UE) Categories
• Table 8: HSDPA supported Modulation and Channel Coding Schemes (MCS)
• Table 9: HSUPA Supported User Equipment Categories
• Table 10: Release 7 HSPA+ Peak Data Rates
• Table 11: LTE Radio Interface UL and DL Specifications
• Table 12: Smartphone Vendor 2008 Unit Shipments & Market Share - Overall
• Table 13: Smartphone Vendor 2008 Unit Shipments & Market Share - North America
• Table 14: Smartphone Vendor 2008 Unit Shipments & Market Share - Western Europe
• Table 15: Smartphone Vendor 2008 Unit Shipments & Market Share - Japan
• Table 16: Smartphone Vendor 2008 Unit Shipments & Market Share - South Korea
• Table 17: Smartphone Vendor 2008 Unit Shipments & Market Share - China
• Table 18: Smartphone Vendor 2008 Unit Shipments & Market Share - India
• Table 19: Smartphone Vendor 2008 Unit Shipments & Market Share - Middle-East/Africa
• Table 20: Smartphone Vendor 2008 Unit Shipments & Market Share - Central/Latin America
• Table 21: Smartphone Vendor 2008 Unit Shipments & Market Share - Eastern Europe
• Table 22: Smartphone Vendor 2008 Unit Shipments & Market Share - Asia Pacific
• Table 23: Global Smartphone Shipment Forecast by Region (' 08-' 13)
• Table 24: Global Smartphone Unit Shipment Forecast by Cellular Technology (2008-2013)
• Table 25: Acer/E-Ten Windows Mobile Smartphones - Technical Specifications
• Table 26: Amoi Windows Mobile Smartphones - Technical Specifications
• Table 27: Apple 2.5G and 3G iPhone - Technical Specifications
• Table 28: ASUSTeK Windows Mobile Smartphones - Technical Specifications
• Table 29: CEC Telecom Windows Mobile (Chinese) Smartphones - Technical Specifications
• Table 30: Gigabyte Communications Windows Mobile Smartphones - Technical Specifications
• Table 31: HP Windows Mobile Smartphones - Technical Specifications
• Table 32: HTC Touch Screen Smartphones - Technical Specifications
• Table 33: HTC Non Touch Screen Smartphones - Technical Specifications
• Table 34: HTC PDA Smartphones - Technical Specifications
• Table 35: Kyocera Windows Mobile Smartphone - Technical Specifications
• Table 36: Lenovo Windows Mobile Smartphones - Technical Specifications
• Table 37: LG Symbian and Windows Mobile Smartphones - Technical Specifications
• Table 38: Mitac Windows Mobile Smartphones - Technical Specifications
• Table 39: Motorola Q Windows Mobile GSM and CDMA Smartphones - Technical Specifications
• Table 40: Motorola Symbian/UIQ Smartphones - Technical Specifications
• Table 41: Motorola Mobile Linux Smartphones - Technical Specifications
• Table 42: Nokia S60 Smartphones by Edition
• Table 43: Nokia Enterprise Smartphones - Technical Specifications
• Table 44: Nokia N95 Smartphone Models Comparison
• Table 45: Nokia Consumer Smartphones #1 - Technical Specifications
• Table 46: Nokia Consumer Smartphones #2 - Technical Specifications
• Table 47: Palm WCDMA Smartphones - Technical Specifications
• Table 48: Palm CDMA2000 Smartphones - Technical Specifications
• Table 49: Pantech Windows Mobile Smartphones - Technical Specifications
• Table 50: Blackberry EGPRS, WCDMA and CDMA2000 Smartphones - Technical Specifications
• Table 51: Sony-Ericsson Symbian & Windows Mobile Smartphone for RoW - Tech. Specifications
• Table 52: Samsung Windows Mobile Smartphones - Technical Specifications
• Table 53: Samsung Symbian Smartphones - Technical Specifications
• Table 54: Samsung Linux Smartphones - Technical Specifications
• Table 55: Fujitsu Windows Mobile Smartphones - Technical Specifications
• Table 56: Fujitsu Symbian Smartphones - Technical Specifications
• Table 57: NEC Linux Smartphones - Technical Specifications
• Table 58: Panasonic Linux and Symbian Smartphones - Technical Specifications
• Table 59: Sharp Symbian and Windows Mobile Smartphones - Technical Specifications
• Table 60: Sony-Ericsson Symbian Smartphones for the Japanese Market - Technical Specifications
• Table 61: Toshiba Windows Mobile Smartphones - Technical Specifications
• Table 62: Web 2.0 Technologies and Multimedia Feature Comparison by Mobile O/S
• Table 63: Global Smartphone O/S Market Share (2008) & Forecast (' 08-' 13)
• Table 64: Smartphone O/S Shipment Market Share (2008) & Forecast (' 08-' 13) - N. America
• Table 65: Smartphone Air-Interface Shipments & Forecast (' 08-' 13) - N. America
• Table 66: Smartphone O/S Shipment Market Share & Forecast (' 08-' 13) - W. Europe
• Table 67: Smartphone Air Interface Shipment Market Share & Forecast (' 08-' 13) - W. Europe
• Table 68: Smartphone O/S Shipment Market Share & Forecast (' 08-' 13) - Japan
• Table 69: Smartphone Air Interface Shipment Market Share & Forecast (' 08-' 13) - Japan
• Table 70: Smartphone O/S Shipment Market Share (2008) & Forecast (' 08-' 13) - S. Korea
• Table 71: Smartphone Air-interface Shipment Market Share (2008) & Forecast (' 08-' 13) - S. Korea
• Table 72: Smartphone O/S Shipment Market Share & Forecast (' 08-' 13) - China
• Table 73: Smartphone Air-interface Shipment Market Share & Forecast (' 08-' 13) - China
• Table 74: Smartphone O/S Shipment Market Share (2008) & Forecast (' 08-' 13) - India
• Table 75: Smartphone Air-Interface Shipment Market Share (2008) & Forecast (' 08-' 13) - India
• Table 76: Smartphone O/S Shipment Market Share (2008) & Forecast (' 08-' 13) - S.E. Asia
• Table 77: Smartphone Air-Interface Shipment Market Share (2008) & Forecast (' 08-' 13) - S.E. Asia
• Table 78: Smartphone O/S Shipment Market Share (2008) & Forecast (' 08-' 13) - E. Europe
• Table 79: Smartphone Air-Interface Shipment Market Share (2008) & Forecast (' 08-' 13) - E. Europe
• Table 80: Smartphone O/S Shipment Market Share & Forecast (' 08-' 13) - Central/Latin America
• Table 81: Smartphone Air-Interface Unit Market Share & Forecast (' 08-' 13) - Central/Latin America
• Table 82: Smartphone O/S Shipment Market Share & Forecast (' 08-' 13) - Middle-East and Africa
• Table 83: Smartphone Air Interface Market Share & Forecast (' 08-' 13) - Middle-East & Africa
• Table 84: 2.5G Communication Processor Vendor Market Share (' 07-' 09)
• Table 85: 2.5G Communication Processor Forecast ' 08-' 13
• Table 86: 2.5G Communication Processor Vendor Overview
• Table 87: 3G Communication Processor Vendor Market Shares ' 07-' 09
• Table 88: 3G Communication Processor Forecast ' 08-' 13
• Table 89: 3G Communication Processor/Platform Vendor Overview
• Table 90: Panasonic UniPhier 4MBB+ Specification
• Table 91: OpenGL and Direct3D Feature Comparison
• Table 92: Stand-alone Applications Processor Vendor Market Share 2007-2009
• Table 93: Stand-alone Applications Processor Forecast ' 08-' 13
• Table 94: Panasonic UniPhier 4M Specification
• Table 95: Renesas SH-Mobile 3A Specifications
• Table 96: MtekVision' s current lineup of MMP (Mobile Multimedia Platform) products
• Table 97: Nvidia Standard-Definition Media Co-Processor Specifications
• Table 98: Nvidia Low-Definition Media Co-Processor Specifications
• Table 99: Toshiba T5G Specifications
• Table 100: WCDMA Advanced Receiver Types
• Table 101: 3G Stack Source for Major UMTS Baseband Chip Suppliers
• Table 102: Digital Baseband Overall (Integrated and Non-Integrated) 2008 Vendor Market Share
• Table 103: RF Transceiver 2008 Vendor Market Shares
• Table 104: Non-Integrated DBB Forecast - ' 08-' 13
• Table 105: RF Transceiver Forecast ' 08-' 13
• Table 106: Smartphone Non-Integrated DBB Supplier Overview
• Table 107: Bluetooth Penetration Rates in Smartphones by Vendor
• Table 108: Bluetooth Vendor Unit Shipments and Market Share - 2008
• Table 109: Bluetooth Forecast ' 08-' 13
• Table 110: WLAN Penetration in Smartphones by OEM
• Table 111: Mobile WLAN Vendor Unit Shipments and Market Share - 2008
• Table 112: Stand-alone & Combo Wi-Fi Chipset Forecast ' 08-' 13
• Table 113: WLAN Stand-alone and Combo Chipset Supplier Overview
• Table 114: FM Penetration Rates in Smartphones by Vendor
• Table 115: Stand-alone and Combo FM Chipset Vendor Unit Shipments and Market Share - 2008
• Table 116: Stand-alone and Combo FM Chipset Shipment Forecast - ' 08-' 13
• Table 117: Stand-alone and Combo FM Chipset Supplier Overview
• Table 118: GPS Chipset Vendor 2008 Market Share
• Table 119: GPS Chipset Forecast ' 08-' 13
• Table 120: GPS Penetration in Smartphones by Supplier
• Table 121: SiRF GPS Chips
• Table 122: Mobile WiMAX Profiles
• Table 123: Popular WiMAX 802.16-2005 Profiles Supporting Mobility
• Table 124: Intel Mobile WiMAX Specifications
• Table 125: Mobile TV Smartphone 2008 Vendor Shipments and Market Share
• Table 126: Mobile TV Chipset 2008 Shipments by Standard
• Table 127: Mobile TV Multicast Chipset and Subscriber Forecast by MTV Standard (' 08-' 13)
• Table 128: Mobile TV Demodulators & Tuners Product Overview
• Table 129: Primary and Secondary Image Sensor 2008 Unit Shipments and Market Share
• Table 130: Image Sensor Shipment/Revenue Forecast 2009-2013
• Table 131: Image Sensor Supplier Overview
• Table 132: Fingerprint Sensor Vendor Market Share - 2008
• Table 133: Fingerprint Sensor Market Forecast - 2009-2013
• Table 134: Touchscreen Technology Comparison
• Table 135: Touchscreen Technology Used in Popular Smartphones
• Table 136: Capacitive Touchscreen Controller 2008 Market Share
• Table 137: Resistive & Capacitive Touchscreen Controller Forecast - ' 08-' 13
• Table 138: Cypress TrueTouch Capacitive Controller Characteristics
• Table 139: ELANTECH Capacitive Full-Screen Multi-Touch Modules
• Table 140: ELANTECH Capacitive Single-Touch Controllers
• Table 141: Accelerometer Market Forecast ' 08-' 13
• Table 142: Accelerometer Supplier Overview
• Table 143: Imagination Technologies Graphics and Video IP Licensees for Smartphones
• Table 144: Qualcomm' s MSM WAN Processor Evolution - 2000 to 2008
• Table 145: Qualcomm Platform Segmentation Strategy
• Table 146: Qualcomm CDMA2000-centric Platform Portfolio
• Table 147: Qualcomm WCDMA-centric Platform Portfolio
• Table 148: ST' s Nomadik Applications Processor Family Specifications
• Table 149: TI' s Stand-alone Smartphone Applications Processors
• Table 150: TI' s Smartphone 2.5G Communications Processor ABB/PMU/RF Pairings

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