SMARTPHONE DEVICE & CHIP MARKET OPPORTUNITIES '10

Published by	Forward Concepts Company
Published	February, 2010	Product code	114240
Content info	470 Pages
Price	US $ 3750 Hard Copy (North America) US $ 3850 Hard Copy(international) US $ 7500 PDF by E-mail (Enterprise License)

Introduction
Related Reports

SMARTPHONE DEVICE & CHIP MARKET OPPORTUNITIES '10 published by Forward Concepts Company in February, 2010. This report consists of 470 Pages and the price starts from US $ 3750.

Introduction

Abstract

2009 was the year of Smartphone applications, with Apple' s leading App Store having reached 140,000 applications. All major O/S vendors have followed suit with larger OEMs such as Nokia...with its own Ovi initiative having completed a major upgrade during the year. Spearheaded by Apple, most major OEMs are similarly moving towards an integrated hardware, O/S, applications and services strategy.

On the device front, there is a shifting emphasis towards lower-cost Smartphones in line with the projected growth of emerging countries. As a result, entry-level and mid-range categories will experience significantly higher growth in unit shipments as compared to the higher-end devices popular in operator-subsidized regions. Increasing competition in higher-end devices is also driving above average ASP declines in developed regions.

In ' 09, the Smartphone market defied the global recession reaching $67 billion dollars and 171 million units, registering an 18% YoY growth. The Smartphone market is forecast to continue demonstrating strong growth and is forecast to reach 496 million units in 2014 for a 24% compound annual growth rate.

Forward Concepts is pleased to present this extensive (470-page) market study on all aspects of the Smartphone market and the integrated circuits that enable them.

Estimated shipments by each Smartphone vendor for 2008 and 2009 are provided along with of geographical shipment breakouts for many of the major vendors. Detailed Smartphone shipments for each global region are provided by air interface and operating system are also included.

Chip shipments for all major categories are provided, including basebands, RF transceivers, and application processors along with ancillary chips like Wi-Fi, Bluetooth, GPS, FM, image sensors, etc., with vendor market shares and forecasts for each chip type through 2014. Volatile and non-volatile memories and Smartphone displays are also covered in the report.

Size

470 Pages, 50 Figures, 133 Tables, plus Appendix.

I. EXECUTIVE SUMMARY

A. What is a Smartphone?
B. Introduction
C. Mobile Internet Market Overview
D. Smartphone Device Market Overview
E. Smartphone Semiconductor Market Overview

II. THE SMARTPHONE DEVICE MARKET

A. Smartphone Market Segmentation
- 1. Business Smartphones
  - a) Large Enterprise
  - b) Small and Medium Business (SMB)
- 2. Consumer Smartphones
  - a) Performance Smartphones
  - b) Mid-Range Smartphones
    - i. Music Smartphones
    - ii. Camera Smartphones
    - iii. Navigation Smartphones
    - iv. Gaming Smartphones
  - c) Entry-Level Smartphones
B.Smartphone Device Market Trends
- 1. Architectural Trends
  - a) Processor
  - b) Input Methods
- 2. Hardware Trends
  - a) 3D Graphics
- 3. Supply Chain
- 4. Software and O/S Trends
- 5. Air Interface Trends
- 6. Mobile Operator Trends
C. Global Smartphone Suppliers
- 1. Acer/E-Ten
- 2. Amoi Mobile
- 3. Apple
- 4. ASUS/ASUSTeK
- 5. CEC Telecom
- 6. Gigabyte Communications
- 7. Hewlett Packard
- 8. HTC Corporation
- 9. Huawei
- 10. Kyocera
- 11. Lenovo Mobile Communications
- 12. LG Electronics
- 13. Mitac
- 14. Motorola
- 15. Nokia
- 16. Palm
- 17. Pantech & Curitel
- 18. Research In Motion (RIM)
- 19. Sony Ericsson
- 20. Samsung
- 21. ZTE
D.Regional Smartphone Markets and Forecast
- 1. North America
- 2. Western Europe
- 3. Japan
- 4. South Korea
- 5. Asia Pacific
- 6. China
- 7. India
- 8. Eastern Europe
- 9. Central and Latin America (CALA)
- 10. Middle East and Africa
E. Smartphone Operating Systems
- 1. Google Android
- 2. Nokia Maemo
- 3. Palm WebOS
- 4. Symbian
- 5. Windows Mobile

III. THE SMARTPHONE SEMICONDUCTOR MARKET

A. Smartphone Semiconductor Market Trends
- 1. Processor
- 2. Image Sensors and Image/Video Processors
- 3. Wireless Peripherals
- 4. Volatile and Non-Volatile Memory
B. Communication Processors/Platforms
- 1. Overview
- 2. 2.5G Communication Processors/Platforms
  - a) Overview
  - b) 2.5G Communication Processor Vendor Market Share & Forecast
  - c) 2.5G Communications Processor Vendor Profiles
    - i. Freescale (EGPRS Platform)
    - ii. Marvell (Single-Die EGPRS Baseband Communications Processor)
    - iii. Texas Instruments (Single-chip EGPRS Baseband Applications Processor)
    - iv. Texas Instruments (Single-die EGPRS Baseband Multimedia Applications Processor)
- 1. 3G Communication Processors/Platforms
  - a) Overview
  - b) 3G Communication Processor Vendor Market Share & Forecast
  - c) 3G Communications Processors/Platforms Vendor Profiles
    - i. Broadcom (Single-die HSDPA/EDGE Low-Def ARM11 Baseband Processor)
    - ii. Freescale Semiconductor (Multimode, Multiband ARM11 HEDGE Platform)
    - iii. Marvell (Single-Die HEDGE XScale Baseband Communications Processor)
    - iv. NEC Electronics (Single-chip HEDGE Std-Def Baseband Communications Processor)
    - v. Panasonic (GPRS/HSDPA High-Def Baseband Communication Processors)
    - vi. Qualcomm (ARM11 HEDGE Low-Def Multimedia Platforms)
    - vii. Qualcomm (ARM11 HEDGE and EV-DO Std.-Def Multimedia Platforms)
    - viii. Qualcomm (Scorpion HEDGE, EV-DO and LTE High-Def Multimedia Platforms)
    - ix. Renesas Technology (FOMA and HEDGE High-Def Multimedia Platforms)
    - x. ST-Ericsson (NXP Vintage) (ARM9 WEDGE Low-Def Multimedia Platform)
    - xi. ST-Ericsson (EMP) (ARM 11/Cortex-A8/A9 HEDGE Std.-/High-Def Multimedia Platforms)
C.Stand-alone Applications Processors
- 2. Overview
- 3. Standalone Applications Processor Vendor Market Share & Forecast
- 3. Low-Definition Multimedia Applications Processor Vendor Profiles
  - a) Marvell (Standalone Applications Processors)
  - b) Samsung (Stacked Memory MCP Applications Processor)
  - c) ST-Ericsson (NXP Vintage) (Standalone Applications Processor)
  - d) ST-Ericsson (STMicro Vintage) (Standalone Applications Processors)
  - e) Texas Instruments (Standalone Applications Processors)
- 4. Standard-Definition Multimedia Applications Processor Vendor Profiles
  - a) Broadcom (Multimedia Applications Processor)
  - b) Core Logic (Multimedia Applications Processor)
  - c) Freescale (90 nm Multimedia Applications Processor)
  - d) Marvell (90 nm Standalone Applications Processor)
  - e) Nvidia (130 nm Standalone Applications Processor)
  - f) Panasonic (65 nm Standalone Applications Processor)
  - g) Renesas Technology
  - h) Samsung (65 nm Standalone Applications Processor)
  - i) ST-Ericsson (STMicro Vintage) (130 nm and 90 nm Standalone Applications Processors)
  - j) Texas Instruments (90 nm Standalone Applications Processors)
- 5. High-Definition Multimedia Applications Processor Vendor Profiles
  - a) Freescale (65nm Standalone Multimedia Applications Processor)
  - b) Intel (45nm Atom Processors and SoCs)
  - c) Marvell (55nm Standalone Applications Processors)
  - d) Nvidia (65nm Standalone Applications Processors)
  - e) Samsung (65nm and 45 nm Standalone Applications Processors)
  - f) Texas Instruments (65nm and 45nm Standalone Applications Processors)
D. Media Co-Processors
- 6. Overview
- 7. Media Co-Processor Forecasts
- 8. Supplier Profiles
  - a) AMD/ATI Technologies (Std. Definition Media Co-Processor)
  - b) Broadcom (High-Def Media Co-Processor)
  - c) Marvell (Std.-Definition Media Co-Processor)
  - d) MtekVision (Std.-Definition Media Co-Processor)
  - e) Nvidia (Std.-Definition Media Co-Processor)
  - f) Nvidia (Low-Definition Media Co-Processor)
  - g) Texas Instruments (Low-Definition & Std.-Definition Media Co-Processors)
  - h) Toshiba (Std.-Definition Media Co-Processor)
E.Non-Captive Cellular Baseband & RF Transceivers
- 9. Technology Overview
- 10. 3G Stack Market Overview
  - a) LTE Software
- 11. Smartphone Digital Baseband & RF Transceiver Forecast
- 12. LTE Supplier Landscape
- 13. Cellular Baseband and RF Transceiver Supplier Profiles
  - a) 4M Wireless (LTE Protocol Stack)
  - b) Altair Semiconductor (LTE Baseband/MIMO RF & TD-LTE MIMO RF)
  - c) AKM (WCDMA RF Xceivers)
  - d) Broadcom (EDGE Multimedia Baseband Processor)
  - e) Comsys Communications (LTE Baseband)
  - f) Datang Telecom Technology (TD-LTE Baseband)
  - g) Freescale (WEDGE & EDGE RF Subsystems)
  - h) Freescale (Multi-Mode LTE Baseband)
  - i) HiSilicon Technologies (TD-LTE Baseband)
  - j) Icera Semiconductor (Multimode HSPA/EDGE Baseband/RF and LTE/HSPA+ Basebands)
  - k) Infineon Technologies (EDGE, WEDGE & LTE RF Xceivers)
  - l) Infineon Technologies (Multimode/Multiband HEDGE BB/RF/PM Platforms)
  - m) Infineon Technologies (65nm Programmable Baseband Processor)
  - n) LG Electronics (LTE Baseband)
  - o) MediaTek (Multimode WCDMA and GPRS/EGPRS Basebands)
  - p) MediaTek (TD-SCDMA Baseband Processor and Dual-Band RF)
  - q) mimoOn GmbH (LTE SDR Baseband and Protocol Stack)
  - r) NEC (LTE Baseband)
  - s) Qasara (LTE Protocol Stack)
  - t) Qualcomm (WCDMA/EV-DO Baseband/RF + Multimedia Co-Processors)
  - u) Qualcomm (Multimode LTE Basebands)
  - v) Renesas Technology (Single-chip Multiband WEDGE/HSPA RF Xceiver)
  - w) Renesas (LTE Software Reconfigurable Radio)
  - x) Sandbridge Technologies (LTE Baseband Processor)
  - y) Skyworks Solutions (Multiband, Direct Conversion HEDGE RF Xceivers)
  - z) Spreadtrum Communications (Multimode 3GPP R4/R5 TD-SCDMA Basebands and Single-Chip RF)
    - aa) ST-Ericsson (EMP Vintage) (HSPA, HSPA+ and LTE Modems)
    - bb) ST-Ericsson (EMP Vintage) (UMTS/HSPA BB/RF + Multimedia Co-Processors)
    - cc) ST-Ericsson (LTE Baseband and RF Xceiver)
    - dd) SySDSoft (LTE Protocol Stack)
    - ee) T3G Technology/ST-Ericsson (Multimode 3GPP R4/R5 TD-SCDMA Basebands)

IV. ANCILLIARY SMARTPHONE CHIPS, MEMORY AND DISPLAYS

A. Overview
B. Bluetooth
- 1. Overview
- 2. Smartphone Bluetooth Market Share & Forecast
- 3. Bluetooth Supplier Profiles
  - a) Broadcom (130nm/65nm BT 2.1+EDR + FM-RDS Xceiver + 802.11b/g/n)
  - b) CSR/SiRF (130nm BT 2.1+EDR, BT 2.1 +EDR+Wibree+FM/RDS+GPS)
  - c) Infineon Technologies AG (130nm BT 2.0/2.1 EDR)
  - d) Qualcomm (130nm BT 2.0 EDR)
  - e) Staccato (110nm BT 3.0, USB over UWB)
  - f) ST-Ericsson (NXP Vintage) (BT 2.0 EDR, BT 2.0 EDR + Wi-Fi)
  - g) ST-Ericsson (STMicro Vintage) (130 nm Single-Chip BT 2.1 EDR, BT 2.1 EDR + FM-RDS Xceiver)
  - h) Texas Instruments (Single-Chip 130/90/65nm BT 2.0/2.1 EDR + FM Xceiver)
C.Mobile Wireless LAN
- 1. Overview
- 2. Mobile WLAN Market Share and Forecast
- 3. Mobile Wireless LAN Supplier Profiles
  - a) Atheros Communications (Single-Chip Wi-Fi and GPS)
  - b) Broadcom (Single-Chip Wi-Fi+Bluetooth+FM)
  - c) Marvell (Single-Chip Wi-Fi+BT2.0 EDR, Wi-Fi+BT2.0 EDR+FM)
  - d) Qualcomm
  - e) ST-Ericsson (NXP Vintage) (Wi-Fi/UMA, Wi-Fi+Bluetooth SIP)
  - f) ST-Ericsson (STMicro Vintage) (SIP-based Wi-Fi)
  - g) Texas Instruments (Single-Chip Wi-Fi + BT 2.1 EDR + FM/RDS)
A. GPS
- 1. Overview
  - a) Alternate Satellite Navigation Systems
  - b) Navigation Software for Smartphones
- 2. GPS Market Share and Forecast
- 3. GPS Chip Supplier Profiles
  - a) Atheros/u-Nav (One-Chip SoC)
  - b) Broadcom/Global Locate (A-GPS)
  - c) Infineon (65nm Single-chip GPS)
  - d) Qualcomm (Embedded A-GPS)
  - e) RFMD (Software-assisted GPS Receiver)
  - f) CSR/SiRF Technology (Stand-alone and Assisted 65nm and 90nm Single-Die GPS)
  - g) ST-Ericsson (NXP Vintage) (GloNav)
  - h) ST-Ericsson (STMicro Vintage) (2-Chip Set)
  - i) Texas Instruments (Single-Chip A-GPS)
B. FM Radio
- 1. Overview
- 2. FM Radio Market Share and Forecast
- 3. FM Radio Supplier Profiles
  - a) Airoha Technologies (FM Stereo Receiver + RDS/RBDS)
  - b) Silicon Labs (CMOS FM Stereo RDS/RBDS Xceiver, AM/FM Receiver)
  - c) ST-Ericsson (NXP Vintage) NXP (Single-Chip FM Stereo Receiver + RDS + AM)
  - d) ST-Ericsson/STMicroelectronics (FM RDS Receiver)
  - e) Texas Instruments (FM RDS Transceiver)
C. Mobile TV
- 1. Mobile TV Standards Overview
- 2. MTV Semiconductor Market Share and Forecast
- 3. Mobile TV Semiconductor Vendor Profiles
- a) Auvitek (DTMB Demodulators)
- b) Broadcom (DVB-H & DVB-T Monolithic Tuner)
- c) DiBcom (DVB-H/T/SH Tuners & Demods)
- d) Imagination Technology (Multi-Standard MTV Demodulator IP Core)
- e) Infineon (DVB-H, DVB-T Tuner & Demod)
- f) Innofidei (CMMB Demod & Decode)
- g) Legend Silicon (DTMB Demodulators)
- h) LG Electronics (ATSC-M/H Demod)
- i) Maxim (ISDB-T 1Seg & 3Seg Tuners)
- j) Mirics Semiconductor (Multi-standard Tuner and Software Demodulator)
- k) MegaChips (ISDB-T Demod)
- l) Newport Media (DVB-H, ISDB-T Tuner & Demod)
- m) Qualcomm (MediaFLO"!, ISDB-T, DVB-H Tuner & Demod)
- n) Samsung (Multi-Mode DVB-T/H, DAB-IP, ISDB-T/T-DMB Tuner & Demod)
- o) Siano Mobile Silicon (DVB-T/H, T-DMB, ISDB-T, CMMB Tuner & Demod)
- p) Spreadtrum (CMMB Demod and Decode)
- q) ST-Ericsson (NXP Legacy) (Analog TV Output Processor)
- r) Telegent Systems (Analog TV & DVB-T/H Tuner, Demod & Decode)
- s) Texas Instruments (DVB-H, ISDB-T Tuner & Demod)
D. Full-Screen Touch Controllers
- 1. Overview
  - a) Resistive Touchscreens
  - b) Capacitive Touchscreens
- 2. Smartphone Full-screen Touch Controller Market Share and Forecast
- 3. Touch-Screen Controller Suppliers
  - a) Analog Devices (Resistive Touchscreen Controllers)
  - b) Atmel (Capacitive Touchscreen Controllers)
  - c) Broadcom (Custom Full-Screen Capacitive Touchscreen Controller)
  - d) Cypress (Capacitive Touchscreen Controllers)
  - e) ELANTECH (Capacitive Touchscreen Modules & Controllers)
  - f) IDT/Leadis Technology (Capacitive Touchscreen Controllers With Integrated Haptics Driver)
  - g) Maxim (Resistive Touchscreen Controllers)
  - h) National Semiconductor (Resistive Touchscreen Controllers)
  - i) ST-Microelectronics (Resistive & Capacitive Touchscreen Controllers)
  - j) Synaptics (Capacitive & Resistive Touchscreen Controllers)
  - k) Texas Instruments (Resistive Touchscreen Controllers)
  - l) Wolfson Microelectronics (Combo Resistive Touchscreen Controllers and Audio/Voice Codec)
E. Digital Camera Image Sensors & Processors
- 1. Overview
- 2. Image Sensor Market Share and Forecast
- 3. Image Sensor Supplier Profiles
  - a) Aptina Imaging (0.3 - 9 MP CMOS Image Sensors & SoCs)
  - b) MagnaChip Semiconductor (SXGA, UXGA & 3.2MP Image Sensors & Processors)
  - c) NEC (12MP Image Sensor, 1080p Video Processor)
  - d) OmniVision (VGA, 1.3, 2, 3.2, 5, 8 & 9MP CMOS Image Sensors)
  - e) Samsung (VGA, 1.3, 2, 3, 5 & 8.4 MP CMOS Image Sensors & SoCs)
  - f) Seti (VGA & 1.3 MP CMOS Sensors)
  - g) Sony (5, 8 & 12MP CMOS Sensors)
  - h) STMicroelectronics (1.3, 2 & 3.2MP Sensors & Processors)
  - i) Toshiba Electronic Components (VGA, 2, 3.2, 5 & 8MP CMOS Sensors)
F. Accelerometers and Gyroscopes
- 1. Overview
- 2. Accelerometer and Gyroscope Market Forecast
- 3. Accelerometer and Gyroscope Vendor Profiles
  - a) Analog Devices (3-axis MEMS Analog and Digital Accelerometers)
  - b) Bosch Sensortec (3-axis MEMS Analog and Digital Accelerometers)
  - c) Freescale (3-axis Digital Accelerometers)
  - d) Hitachi Metals (3-axis Digital Accelerometers)
  - e) Hokuriku Electric (3-axis Digital Accelerometer)
  - f) Kionix (3-axis MEMS Accelerometers)
  - g) MEMSIC (2- and 3-axis MEMS Accelerometers)
  - h) STMicroelectronics (3-axis Linear MEMS Accelerometers)
G. Volatile and Non-Volatile Memories
- 1. Overview
- 2. Smartphone Volatile and Non-Volatile Memory Forecast
- 3. Volatile and Non-Volatile Memory Supplier Profiles
  - a) Elpida (Mobile DRAM)
  - b) Hynix (Mobile DRAM, PSRAM, SRAM and Discrete NAND Flash)
  - c) Hynix-Numonyx (Managed NAND Flash)
  - d) Micron (Mobile DRAM and PSRAM)
  - e) Micron-Intel (Discrete NAND, Serial NAND and Managed NAND Flash)
  - f) Numonyx (Discrete NOR, Discrete NAND and Managed/Hybrid NAND Flash)
  - g) Samsung (Discrete NAND and Managed/Hybrid NAND Flash)
  - h) Spansion (Discrete NOR and Hybrid NAND Flash)
  - i) Toshiba-SanDisk (Discrete NAND and Managed/Hybrid NAND Flash)
H.Smartphone Displays
- 1. Overview
  - a) TFT-LCD
  - b) Passive Matrix OLED (PM-OLED)
  - c) Active Matrix OLED (AM-OLED)
  - d) Light Emitting Polymer OLED (P-OLED)
  - e) MEMS Interferometric Modulator
  - f) MEMS Electronic Paper
- 2. Smartphone Display Forecast
- 3. Display Vendor Profiles
  - a) AU-Optronics (2.x/3.x TFT-LCD, 3.x AM-OLED Displays)
  - b) Chi Mei EL (2.x/3.x/4.x Low-res AM-OLED)
  - c) Eastman Kodak (AM-OLED Technology Licensing)
  - d) E-Ink/Primeview Corporation (Electronic Paper Display)
  - e) LG Display (2.x/3.x TFT-LCD, 3.x/4.x AM-OLED Displays)
  - f) Qualcomm MEMS Technologies (Interformatic Modulator Displays)
  - g) Samsung Mobile Display (2.x/3.x/4.x TFT-LCD, 3.x/4.x AM-OLED Displays)
  - h) Toshiba Mobile Display (2.x/3.x TFT-LCD, 2.2”/3.x” AM-OLED Displays)
  - i) TPO (2.x/3.x TFT-LCD, 3.x”/4.x” AM-OLED Displays)
I. Pico Projectors
- 1. Overview
- 2. Semiconductor Vendor Profiles
  - a) Microvision (Single-Mirror MEMS Pico Projector)
  - b) Texas Instruments (DLP Pico Projector)

List of Figures

Figure 1: Mobile Device Market Share Forecast by Device Type - ‘08 - ‘14
Figure 2: Global Mobile Internet Subscriber Market Share by Air-Interface - ‘08 - ‘14
Figure 3: Global Mobile Internet Subscriber Market Share by Region - ‘08 - ‘14
Figure 4: Smartphone Shipments by OEM - ‘09
Figure 5: Smartphone Shipments by Air-Interface - ‘09 - ‘14
Figure 6: Smartphone Shipments by Device Category - ‘09 - ‘14
Figure 7: Smartphone O/S Market Share - ‘09 - ‘14
Figure 8: Smartphone Semiconductor/Display Revenue Forecast - ‘08 - ‘14
Figure 9: 2.5G (EDGE) Communications Processor and Non-Integrated DBB Shipments - ‘08-14
Figure 10: Freescale MXC275 EGPRS Platform
Figure 11: Marvell PXA901 Communications Processor Block Diagram
Figure 12: OMAP850 Communications Processor Block Diagram
Figure 13: OMAP850 Based Smartphone Reference Design
Figure 14: OMAPV1030 Communications Processor Block Diagram
Figure 15: 3G Communications Processor and Non-Integrated DBB Shipments - ‘08-‘14
Figure 16: Broadcom HEDGE Baseband Processor
Figure 17: Freescale 3G Single-Core Modem Platform
Figure 18: NEC Electronics Medity2 Chipset
Figure 19: Qualcomm MSM7600 EV-DO/UMTS Chipset Solution
Figure 20: Qualcomm MSM7600 Chipset RF Options
Figure 21: NXP 7210 WEDGE Platform
Figure 22: Standalone Apps Processors and Comm. Processor Shipments - ‘08 - ‘14
Figure 23: Marvell PXA270 Block Diagram
Figure 24: NXP PNX4008 Block Diagram
Figure 25: STMicro STn8815 Block Diagram
Figure 26: TI OMAP1710 Applications Processor Block Diagram
Figure 27: Broadcom Multimedia Applications Processor
Figure 28: Core Logic Multimedia Device Block Diagram
Figure 29: Freescale Standard-Definition Applications Processor Block Diagram
Figure 30: Marvell PXA320 Standard-Definition SoC Block Diagram
Figure 31: Samsung Standard-Definition Apps Processor Block Diagram
Figure 32: STMicro Nomadik STn8815 Applications Processor Block Diagram
Figure 33: Texas Instruments Standard-Definition OMAP Apps Processor Block Diagram
Figure 34: TI OMAP44x Block Diagram
Figure 35: Broadcom High-Def Mobile Multimedia Co-Processor Block Diagram
Figure 36: Marvell 2700G Graphics and Multimedia Accelerator
Figure 37: MtekVision Multimedia Co-Processor Architecture
Figure 38: TI OMAP-DM500/OMAP-DM299 Media Co-processor
Figure 39: TI OMAP-DM510 Media Co-processor
Figure 40: Freescale' s 4-chip WCDMA/EDGE Radio Block Diagram
Figure 41: Freescale' s RFX300-30: 2-chip WCDMA/EDGE Radio Block Diagram
Figure 42: Infineon HSDPA Modem Platform
Figure 43: MSM6260 Cat. 6 HSDPA Multimedia Platform
Figure 44: MSM6280 Cat. 8 HSDPA Enhanced Multimedia Platform
Figure 45: MSM6500 EV-DO Rev 0 + GSM/GPRS Multimedia Platform
Figure 46: MSM6550 1X Rel 0/Rev A/EV-DO Rev 0 + GSM/GPRS Multimedia Platform
Figure 47: Texas Instruments WiLink 6.0 Single-chip WLAN, Bluetooth and FM Solution
Figure 48: A Typical GPS Receiver Block Diagram
Figure 49: Global Locate/Broadcom Hammerhead II A-GPS Chip Block Diagram
Figure 50: Smartphone Image Sensor Penetration by Resolution - ‘09

List of Tables

Table 1: Global Smartphone Unit Shipments and Revenue Forecast - ‘09 - ‘14
Table 2: Global Smartphone Shipment Forecast by Air-Interface Technology - ‘09 - ‘14
Table 3: Global Smartphone Shipment Forecast by Device Category - ‘09 - ‘14
Table 4: Intel MID/Smartphone Platform Roadmap - ‘08-‘11
Table 5: Global Mobile Internet Subscriber Forecast by Region and Air-Interface - ‘08-‘14
Table 6: Global Mobile Subscriber Forecast by Air-Interface Technology - ‘08-‘14
Table 6: Global Smartphone Supplier Unit Shipments, Market Share and YoY Growth - ‘09
Table 7: Apple Smartphone Hardware and Software Overview
Table 8: Apple Smartphone Unit Shipments by Region - ‘09
Table 9: HTC Smartphone Hardware and Software Overview
Table 10: HTC Non-ODM Smartphone Unit Shipments by Region - ‘09
Table 11: Motorola Smartphone Hardware and Software Overview
Table 12: Motorola Smartphone Unit Shipments by Region - ‘09
Table 13: Nokia Smartphone Hardware and Software Overview
Table 14: Nokia Smartphone Unit Shipments by Region - ‘09
Table 15: RIM Smartphone Hardware and Software Overview
Table 16: RIM Smartphone Unit Shipments by Region - ‘09
Table 17: Sony Ericsson Smartphone Hardware and Software Overview
Table 18: Sony-Ericsson Smartphone Unit Shipments by Region - ‘09
Table 19: Samsung Smartphone Hardware and Software Overview
Table 20: Samsung Smartphone Unit Shipments by Region - ‘09
Table 21: Global Smartphone Shipment Forecast by Region- ‘09 - ‘14
Table 22: North America Smartphone Vendor Market Share - ‘09
Table 23: North America Smartphone Shipment Forecast by Air Interface - ‘09 - ‘14
Table 24: North America Smartphone Shipment Forecast by O/S - ‘09 - ‘14
Table 25: North America Smartphone Shipment Forecast by Device Category - ‘09 - ‘14
Table 26: Western Europe Smartphone Vendor Market Share - ‘09
Table 27: Western Europe Smartphone Shipment Forecast by Air Interface - ‘09 - ‘14
Table 28: Western Europe Smartphone Shipment Forecast by O/S - ‘09 - ‘14
Table 29: Western Europe Smartphone Shipment Forecast by Device Category - ‘09 - ‘14
Table 30: Japan Smartphone Vendor Market Share - ‘09
Table 31: Japan Smartphone Shipment Forecast by Air Interface - ‘09 - ‘14
Table 32: Japan Smartphone Shipment Forecast by O/S - ‘09 - ‘14
Table 33: Japan Smartphone Shipment Forecast by Device Category - ‘09 - ‘14
Table 34: South Korea Smartphone Vendor Market Share - ‘09
Table 35: South Korea Smartphone Shipment Forecast by Air Interface - ‘09 - ‘14
Table 36: South Korea Smartphone Shipment Forecast by O/S - ‘09 - ‘14
Table 37: South Korea Smartphone Shipment Forecast by Device Category - ‘09 - ‘14
Table 38: Asia Pacific Smartphone Vendor Market Share - ‘09
Table 39: Asia Pacific Smartphone Shipment Forecast by Air Interface - ‘09 - ‘14
Table 40: Asia Pacific Smartphone Shipment Forecast by O/S - ‘09 - ‘14
Table 41: Asia Pacific Smartphone Shipment Forecast by Device Category - ‘09 - ‘14
Table 42: China Smartphone Vendor Market Share - ‘09
Table 44: China Smartphone Shipment Forecast by O/S - ‘09 - ‘14
Table 45: China Smartphone Shipment Forecast by Device Category - ‘09 - ‘14
Table 46: India Smartphone Vendor Market Share - ‘09
Table 47: India Smartphone Shipment Forecast by Air Interface - ‘09 - ‘14
Table 48: India Smartphone Shipment Forecast by O/S - ‘09 - ‘14
Table 49: India Smartphone Shipment Forecast by Device Category - ‘09 - ‘14
Table 51: Eastern Europe Smartphone Shipment Forecast by Air Interface - ‘09 - ‘14
Table 52: Eastern Europe Smartphone Shipment Forecast by O/S - ‘09 - ‘14
Table 53: Eastern Europe Smartphone Shipment Forecast by Device Category - ‘09 - ‘14
Table 54: CALA Smartphone Vendor Market Share - ‘09
Table 55: Central/Latin America Smartphone Shipment Forecast by Air Interface - ‘09 - ‘14
Table 56: CALA Smartphone Shipment Forecast by O/S - ‘09 - ‘14
Table 57: Central/Latin America Smartphone Shipment Forecast by Device Category - ‘09 - ‘14
Table 58: Middle-East/Africa Smartphone Vendor Market Share - ‘09
Table 59: Middle-East/Africa Smartphone Shipment Forecast by Air Interface - ‘09 - ‘14
Table 60: Middle-East/Africa Smartphone Shipment Forecast by O/S - ‘09 - ‘14
Table 61: Middle-East/Africa Smartphone Shipment Forecast by Device Category - ‘09 - ‘14
Table 62: Global Smartphone Unit Shipment Forecast by O/S - ‘09 - ‘14
Table 63: Android Mobile Smartphone Unit Shipments by Region - ‘09
Table 64: Symbian Smartphone Unit Shipments by Region - ‘09
Table 65: Windows Mobile Smartphone Unit Shipments by Region - ‘09
Table 66: 2.5G Communication Processor Vendor Market Share - ‘08-' 09
Table 67: 2.5G Communication Processor Forecast ‘08-‘14
Table 68: 2.5G Communication Processor Vendor Overview
Table 69: 3G Communication Processor Vendor Market Shares ‘08-' 09
Table 70: 3G Communication Processor Forecast ‘08-‘14
Table 72: 3G Communication Processor/Platform Vendor Overview
Table 73: Panasonic UniPhier 4MBB+ Specifications
Table 74: Qualcomm Snapdragon Communication Processors
Table 75: Stand-alone Applications Processor Vendor Market Share ‘07-‘09
Table 76: Stand-alone Applications Processor Forecast ‘08-‘14
Table 77: Panasonic UniPhier 4M Specification
Table 78: Renesas SH-Mobile 3A Specifications
Table 79: Intel MID Platform Roadmap 2008-2011
Table 80: Nvidia Tegra and APX Applications Processors
Table 81: Texas Instruments OMAP34x, OMAP36x & OMAP44x Applications Processors
Table 81: Media Co-Processor Smartphone Forecast - ‘08 - ‘14
Table 82: MtekVision' s current lineup of MMP (Mobile Multimedia Platform) products
Table 83: Nvidia Standard-Definition Media Co-Processor Specifications
Table 84: Nvidia Low-Definition Media Co-Processor Specifications
Table 85: Toshiba T5G Specifications
Table 86: WCDMA Advanced Receiver Types
Table 87: 3G IP/Stack Source for Major UMTS Baseband Chip Suppliers
Table 88: Digital Baseband (Non-Integrated) Vendor Units Shipments and Market Share - ‘09
Table 89: RF Transceiver Vendor Market Share - ‘09
Table 90: Non-Integrated DBB Shipments/Forecast by Air-Interface Technology - ‘08-‘14
Table 91: RF Transceiver Shipments/Forecast by Air-Interface Technology - ‘08-‘14
Table 92: Non-Integrated Cellular Baseband Supplier Overview
Table 93: RF Transceiver Supplier Overview
Table 94: Bluetooth Penetration Rates in Smartphones by Vendor
Table 95: Bluetooth Vendor Unit Shipments and Market Share - ‘09
Table 96: Bluetooth Standalone and Combination Shipments/Forecast - ‘08-‘14
Table 97: WLAN Smartphone Unit Shipments and Penetration by OEM - ‘09
Table 98: WLAN Vendor Unit Shipments and Market Share - ‘09
Table 99: Stand-alone & Combo Wi-Fi Chipset Forecast ‘08-‘14
Table 100: WLAN Stand-alone and Combo Chipset Supplier Overview
Table 101: GPS Chipset Vendor Shipments and Market Share- ‘09
Table 102: GPS Chipset Forecast ‘08-‘14
Table 103: GPS Smartphone Unit Shipments and Penetration by OEM - ‘09
Table 104: SiRF GPS Chipset Overview
Table 105: FM Unit Shipments and Penetration Rate in Smartphones by OEM - ‘09
Table 106: Stand-alone and Combo FM Chipset Vendor Unit Shipments and Market Share - ‘09
Table 107: Stand-alone and Combo FM Chipset Shipment Forecast - ‘08-‘14
Table 108: Stand-alone and Combo FM Chipset Supplier Overview
Table 109: Mobile TV Smartphone Vendor Shipments and Market Share - ‘09
Table 112: Mobile TV Penetration by Smartphone OEM
Table 111: Mobile TV Multicast Chipset and Subscriber Forecast by MTV Standard (‘09 - ‘14)
Table 113: Mobile TV Demodulators & Tuners Product Overview
Table 114: Telegent Low-Power Analog TV and DVB-T/H Receiver Chip Sets
Table 115: Touchscreen Technology Comparison
Table 116: Capacitive Full Touch Screen Controller Market Share - ‘09
Table 116: Resistive Full-Touch Screen Controller Market Share - ‘09
Table 117: Resistive & Capacitive Full-Touch Screen Controller Forecast - ‘08-‘14
Table 118: Analog Devices' 4-wire Resistive Touch-screen Controllers
Table 119: Cypress TrueTouch Capacitive Controller Characteristics
Table 120: ELANTECH Capacitive Full-Screen Multi-Touch Modules
Table 121: ELANTECH Capacitive Single-Touch Controllers
Table 122: Maxim' s Line of Resistive Touchscreen Controllers
Table 123: Primary and Secondary Image Sensor Unit Shipments and Market Share - ‘09
Table 124: Image Sensor Shipment/Revenue Forecast - ‘08-‘14
Table 125: Image Sensor Supplier Overview
Table 126: Toshiba Dynastron 1.75μm pixel size CMOS Image Sensors
Table 127: Accelerometer/Gyroscope Market Forecast ‘08-‘14
Table 128 ADI' s line of iMEMS Low g (up to ±18 g) accelerometers:
Table 129: Smartphone Mobile RAM Forecast by Applications - ‘08-‘14
Table 130: Smartphone Discrete NOR, Managed NAND and Hybrid NAND Flash Forecast - ‘08-‘14
Table 131: Smartphone OLED Penetration by OEM - ‘09
Table 132: Smartphone Display Penetration by Size and OEM - ‘09
Table 133: Smartphone Display Forecast by Size - ‘08-‘14