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Cellphone & Tablet Core Chip Markets '13: Analysis of Markets of Baseband, Application Processor, RF & Power Management Chips

Notice
This publication has been discontinued on June 13, 2014.

From a cellphone standpoint the biggest market change last year (2012) was in the entry level "Smartphones," which have quickly taken over much of what was the less-expensive "feature phone" market segment. In addition, the multimode 3G/LTE smartphone growth was phenomenal. This down-market trend is largely because the Android operating system (O/S) has been enabled on less-expensive chip platforms. Consequently, in 2012 we saw Smartphones that range from $100 at the low end to $700 at the high end. This has led to price segmentation of the Smartphone market: Premium, Mainstream & Entry Level. We cover Smartphone vendor shipments and expand on Media Tablets which are also becoming significant markets for cellular chips.

Mobile Terminal Revenue By Type 2012

This report is an extensive (330-page) market study that covers the core integrated circuits that enable cellphones and media tablets. In this study, we don't just track basebands & application processors, we also track and forecast RF transceivers, power amplifiers, and power management units in great detail. The report provides 2012 vendor market shares for each of these core cellphone chip types and forecasts units, ASPs & revenues for all of them in detail through 2017. In addition, Smartphone and operating system shipments are also provided with market shares of each. This study explores the dynamics of each baseband types and profiles the chip providers and market shares for each of them. We forecast the cellular digital processor market in major categories:

  • Stand-alone Digital Baseband processors,
  • Stand-alone Application Processors
  • Communication Processors with apps processors + baseband in same package
  • Ultra-Low-Cost (ULC) basebands with RF transceivers on the same die.
  • RF Transceivers: The key to multi-band LTE; some with integral DSP

MM and SM FDD-LTE Baseband Shipments
2012: 47 Mil Units

This study explores the dynamics of all these devices and profiles the chip providers and market shares for each of them in every category.

Of course, most interest is now about 4G cellular, especially in the form of LTE (Long Term Evolution). We highlight the currently-available LTE chips and many of the handsets that employ them at the beginning of 2013. However, 3.5G HSPA devices are growing faster as many 2G and WCDMA networks are being updated.

To only forecast baseband processors separately from application processors would be unhelpful, since the two increasingly occupy the same die (or the same package). Stand-alone application processors currently account for 41% of that market, as illustrated, but will see that share diminish as technology and price pressures push for more integrated solutions.

Application Processor Market Distribution by Type 2012

The RF transceiver is a key component of mobile handsets. With high demand for high growth LTE/3G smartphones coupled with a globally fragmented LTE frequency space the RF transceiver has grown to a new complexity level.

The Power Amplifier (PA) and Front-end Module (FEM) suppliers are actively integrating PAs with duplexers, couplers and filters. This report covers PAs in depth.

Analog BB, PMU and Standalone RF Summary

All portable cellular devices (including handsets and tablets) require efficient Power Management Units (PMUs) devices as companions to all processors to ensure optimal system operation and, especially, long battery life. Because power management technology requires mixed-signal capability, analog baseband (ABB) and audio codecs are often integrated on the same die.

We believe that there is no other core cellphone chip market study available that has the breadth or depth of coverage of this one. You are invited to scan the extensive table of contents to get an idea of the full extent of this valuable study and all of the components and companies covered.

As with all of our reports, your satisfaction is guaranteed.

ABOUT THE AUTHOR:

Carter L. Horney, a recognized authority on microprocessors and DSPs in communications, is the author of this study. Mr. Horney is a Forward Concepts Associate and was formerly Division Planner for Rockwell International's Digital Communications Division and earlier Strategic Marketing manager for Rockwell's Semiconductor Products Division. Mr. Horney was responsible for the product planning, which led Rockwell (now Conexant Systems) to dominate the worldwide FAX and dial modem chip market. He was a Rockwell Engineering Fellow and has a B.S. in Mathematics and Physics and an M.S. in Mathematics from Western Illinois University.

ABOUT THE EDITOR:

Will Strauss, President of Forward Concepts, is an internationally-recognized authority on markets driven by DSP Technology (and wireless is the largest DSP market), and was a significant contributor to this study.

Table of Contents

I. EXECUTIVE SUMMARY

  • A. Overview
  • B. Market Drivers
  • C. Baseband Processors
  • D. Application Processors
  • E. Radio Frequency (RF) Transceiver Chips
  • F. Power Amplifier Modules
  • G. Power Management Units

II. BASEBAND PROCESSORS

  • A. Overall Baseband Processor Market Shares
  • B. Digital Baseband Processor Forecast by Air Type
  • C. 3G/4G LTE Technology
  • D. LTE Technology Migration
  • E. LTE Operator Status and Global Bands of Deployment
    • 1. United States and Canada
    • 2. Europe
    • 3. Russian Federation
    • 4. South Korea
    • 5. Japan
    • 6. India
    • 7. China
    • 8. Other Asia Pacific
    • 9. Middle East and Africa
    • 10. Central and South America
  • F. LTE Smartphone Market Shares
  • G. Digital Baseband LTE Forecast
  • H. LTE Supplier Market Shares
  • I. LTE Baseband Supplier Profiles
    • 1. Altair Semiconductor Ltd.
    • 2. Broadcom (4G LTE UE Class 4 Baseband)
    • 3. Huawei-HiSilicon (LTE/3G Rel.9 baseband chip)
    • 4. Innofidei (P4 LTE and LTE/TD-SCDMA Modem)
    • 5. Intel Mobile Communications (LTE RF and 3G/LTE basebands)
    • 6. Leadcore Technology (LTE/TD-SCDMA Platform)
    • 7. GCT Semiconductor (GDM7240 LTE Cat3 Baseband/Transceiver)
    • 8. Marvell (PXA1802 multimode LTE/3G TD-SCDMA modem)
    • 9. MediaTek (TD-LTE + TD-SCDMA Com-processor)
    • 10. NVIDIA-ICERA (LTE and 21 Mbps HSPA+ platform)
    • 11. Qualcomm (MDM 9xxx LTE/ EVDO or DC-HSPA+ modem)
    • 12. Renesas Mobile Corp. (SP2530/31 LTE/3G DC-HSPA+ Modem)
    • 13. Samsung (CMC221 LTE Baseband only)
    • 14. Sequans Communications (LTE and WiMAX Baseband Chip only)
    • 15. Spreadtrum (LTE/TD-SCDMA/GSM baseband platform)
    • 16. ST-Ericsson (M7400 LTE 4/3G modem - DBB, ABB and RF)
  • J. WCDMA Baseband Market & Vendor Shares
  • K. WCDMA/HEDGE Standalone Baseband Chip Profiles
    • 1. Broadcom (7.2Mbps HSDPA / HSUPA Basebands)
    • 2. NVIDIA (21 Mbps HSPA+ Receive Diversity Modem)
    • 3. Intel (Release 7 diversity HSPA+ 21/11 Mbps Baseband Platform)
    • 4. MediaTek (MT6268/76 384/3.6 Kbps Othello WEDGE Platform)
    • 5. Qualcomm (Up to 42Mbps DC-HSPA+ Platforms)
    • 6. Qualcomm Gobi (Gobi MDM Series of Thin Modems)
    • 7. Renesas Mobile (SP2531 3G/LTE BB/RF Modem)
    • 8. ST-Ericsson (7.2 and 21 Mbps HSPA+ Connect Platforms)
  • L. CDMA Baseband Market & Vendor Shares
  • M. CDMA2000 Baseband Supplier Profiles
    • 1. VIA Telecom
    • 2. Qualcomm (CDMA2000 1x Advanced Chip Set)
    • 3. Qualcomm (CDMA2000 EV-DO Rel. 0 and Rel. A)
    • 4. Qualcomm (Tri-mode CDMA1x EV-DO Rev. A, HSPA+/EDGE)
  • N. TD-SCDMA Baseband Supplier Profiles
    • 1. Leadcore Technology Co Ltd. (TD-HSDPA IP)
    • 2. MediaTek (TD-SCDMA/TD-HSPA Baseband & 2 RFs)
    • 3. Marvell (TD-SCDMA, TD-HSPA Com -Processor)
    • 4. Spreadtrum (TD-HSPA DBB & RF, Triple-SIM)
    • 5. Spreadtrum (SC8810 TD-HSPA EDGE/GPRS/GSM Com-Processor
    • 6. Spreadtrum (LTE and TD-HSPA-SCDMA Baseband)
    • 7. ST-Ericsson- (T6718 TD-HSPA Baseband, RF, ABB)
  • O. TD-SCDMA Baseband Market & Vendor Shares
  • P. GSM/GPRS & EDGE Baseband Market & Vendor Shares
  • Q. GSM, GPRS & EDGE Baseband Supplier Profiles
    • 1. MediaTek (MT6236 312MHz ARM9 EDGE Platforms)
    • 2. Spreadtrum Communications (Multichip GSM/GPRS Baseband)
    • 3. ST-Ericsson (Quad GPRS or EDGE-RX monolithic modem)

III. INTEGRATED BASEBAND & RF CHIPS

  • A. ULC Modem Market Size & Vendor Shares
  • B. ULC Modem Market Forecast
  • C. Ultra-Low-Cost (BB/RF) Modem Supplier Profiles
    • 1. Broadcom (65nm Monolithic EDGE Modem, H.264)
    • 2. Intel (65nm Monolithic GSM and EDGE, MPEG4)
    • 3. MediaTek, Inc. (GSM/GPRS 1-SIP RF, 2-Die hybrid MCP)
    • 4. MediaTek, Inc (EDGE/GPRS/GSM-TRx + MCP)
    • 5. RDA Microelectronics (Single-Chip GSM/GPRS DBB +BT/FM)
    • 6. Spreadtrum Communications (GSM/GPRS 1SIP RFx, 2 die MCP)
    • 7. ST-Ericsson (Monolithic GSM/GPRS and EDGE DSDS)
    • 8. Qualcomm (WCDMA/HSDPA Single-Package Modems)
    • 9. Qualcomm (WCDMA/HSUPA 10Mbps/5.76 MCP Modem)
    • 10. Qualcomm (CDMA 1x Single-Chip & MCP Modems)

IV. STAND-ALONE APPLICATION PROCESSORS

  • A. Overview
  • B. Smartphone Market Share and Forecast
    • 1. Smartphone Forecast and Segmentation
    • 2. Smartphone Consumption by Operating System
    • 3. Global Distribution of Smartphones by Region
    • 4. LTE Smartphone Distribution by Geographical Region
    • 5. Smartphone Market Share Leaders
  • C. Media Tablet Market Share and Forecast
    • 1. Media Tablet Statistics
    • 2. Tablet Market Share by Operating Systems
    • 3. Media Tablet Market Shares
  • D. Application Processor Trends
    • 1. Screen Size, Resolution and 1080P Video
    • 2. High Dynamic Range Photography
    • 3. Wireless Connectivity Integration Opportunities
    • 4. Application Processor Differentiation
    • 5. GPU Comparison and Trends
    • 6. CPU Advancements
    • 7. Process Technology Access
  • E. Com-Processor vs. Standalone Processor
  • F. Application Processor Market & Vendor Shares
  • G. Application Processor and Com-Processor Forecast
  • H. Stand-alone Application Processor Suppliers
    • 1. Apple A5 (1.0 GHz Single Core Cortex A8 SGX543MP)
    • 2. Apple A5X (1.0 GHz dual-core Cortex A8 SGX543MP)
    • 3. Apple A6 (1.3 GHz dual-core Cortex Swift SGX543MP3)
    • 4. Apple A6X (1.4 GHz dual-core Cortex Swift SGX544MP4)
    • 5. Freescale (imX535 1.0 GHz Single Core Cortex A8)
    • 6. Freescale (1.2 GHz Single, Dual and Quad-core Cortex A9)
    • 7. Fuzhou Rockchip Electronics
    • 8. Huawei (HiSilicon K3, MW-Mobile 6.5 Professional)
    • 9. Huawei (HiSilicon K3V@ 1.2-1.5 GHz K3V2Quad Cortex A9, 720P)
    • 10. Intel (Z2460 x86HT processor, SGX540 GPU HD 1080P)
    • 11. Intel (Z2420 1.2GHz x86HT processor, SGX540 GPU HD 1080P)
    • 12. Intel (Z2760 Dual Processor, SGX544MP2 GPU HD 1080P)
    • 13. Intel (Z2580 1.8MHz Dual Processor, SGX544MP GPU, HD 1080P)
    • 14. Marvell (ARMADA Applications Processors)
    • 15. Nufront (Dual Cortex A9+Mali400 Applications Processor)
    • 16. NVIDIA (Tegra2 Dual A9 Standalone Applications Processor)
    • 17. NVIDIA (Tegra3 Quad Cortex A9-12core GeForce Processor)
    • 18. NVIDIA (Tegra4 Quad Cortex A15-72 Core GPU Processor, 1440P)
    • 19. Qualcomm (APQ8060A and APQ8064 S4 dual-core krait)
    • 20. Renesas (APE5R Dual Cortex-A9, SGX543 GPU, 1080P codec)
    • 21. Renesas Mobile (MP6530 dual Cortex A15/dual Cortex A7+SGX544 Processor)
    • 22. ST-Ericsson (Nova A9500 dual Cortex-A9s and A15)
    • 23. Samsung Exynos3 (Single1 GHz Cortex-A8 Mali400 Processor)
    • 24. Samsung Exynos4 (1.2 GHz Dual Cortex-A9+ Mali400 1080P)
    • 25. Samsung Exynos4 (1.4 GHz Quad Cortex A9+Mali400, 1080P
    • 26. Samsung Exynos 5 (1.7 GHz Dual Cortex A15+ Mali-T604GPU)
    • 27. Samsung Exynos 5 Octa (1.7 GHz Quad Cortex 15+ SGX544MP3)
    • 28. Telechips (1.2 GHz Single Core Cortex A8+ Mali400)
    • 29. Texas Instruments OMAP3 (Cortex A8-SGX530 Processors)
    • 30. Texas Instruments OMAP4 (Dual-A9+2M3 CPU+SGX544, 1080P)
    • 31. Texas Instruments OMAP5 (2GHz dual-Cortex-A15 + SGX544MP2)
    • 32. VIA Technologies/Wonder Media

V. COMMUNICATION PROCESSORS

  • A. Com-Processor Statistics
  • B. Communications Processor Market Share Leaders
  • C. Communications Processor Forecasts
  • D. Communications Processor Supplier Profiles
    • 1. Broadcom (BCM2157 500MHz ARM11 HSDPA-Processor)
    • 2. Broadcom (BCM21553 832MHz ARM11 Mbps HSPA-Processor)
    • 3. Broadcom (BCM2164 832MHz CortexA9/A4+VC4 HSUPA-Processor)
    • 4. Broadcom (BCM28155 1.2GHz dual A9+VC4 HSPA+ with 1080P)
    • 5. Leadcore Technology LC1810 (CortexA9+ Mali400 LTE/TD-SCDMA-processor)
    • 6. MediaTek MT6516 (416MHz ARM926 GSM/EDGE-processor)
    • 7. MediaTek MT6573 (650MHz ARM11+SGX523 HSPA-Processor with QHD video)
    • 8. MediaTek MT6575 (1GHz A9+SGX531 HSUPA-720P Processor)
    • 9. MediaTek MT6577 (1GHz DualA9+SGX531 HSPA-720P Processor)
    • 10. MediaTek MT6583 (1.2GHz DualA9 HSPA+SGX544 720P)
    • 11. MediaTek MT6589 (1.0GHz Quad-A7+SGX544 HSPA+ 720P Processor)
    • 12. MediaTek MT6517 (1GHz A9+SGX531-720P TD-SCDMA Processor)
    • 13. Marvell (PXA930 1GHz ARMv7+Vivante HEDGE-Processor-1080P)
    • 14. Marvell (PXA920H 1GHz ARMv7+Vivante TD-SCDMA-Processor with 720P)
    • 15. Renesas Mobile (MP5225 1.2 GHz dual A9- SGX543MP HSPA+/LTE-processor)
    • 16. Renesas (MP5232 LTE-Cat4/DC-HSPA+SGX543MP Com-Processor)
    • 17. Renesas (MP6530 DualA15/DualA7-SGX544 LTE-Cat4/3G Processor)
    • 18. Qualcomm (MSM7x30 800 MHz S2 HSPA-Processor with 720P)
    • 19. Qualcomm (QSD8x50A 1.2 GHz S1 HSPA - HD Com-Processor)
    • 20. Qualcomm (MSM7x27 600 MHz ARM11 HSPA WQVGA Video
    • 21. Qualcomm (MSM7x27A 1 GHz Cortex A5 HSUPA 480P)
    • 22. Qualcomm (MSM7x25A 800 MHz Cortex A5 HSDPA 480P)
    • 23. Qualcomm (MSM8x25Q Quad Cortex A5 HSPA 720P)
    • 24. Qualcomm (MSM8930 1.2 GHz Dual Krait LTE/HSPA+/EVDO with 1080P)
    • 25. Qualcomm (MSM8x55 1.2 GHz S2 Scorpion HSPA+ with 720P)
    • 26. Qualcomm (MSM8x60 1.2-1.7 GHz DualS3 HSPA+ with 1080P)
    • 27. Qualcomm (MSM8x60A 1.7GHz DualS4 DC-HSPA+/SVDO 1080P)
    • 28. Qualcomm (MSM8960T 1.7GHz Dual S4 DC-HSPA+/SVDO 1080P)
    • 29. Spreadtrum (SC8810 1GHz Cortex A5+Mali400 TD-SCDMA HD video)
    • 30. ST-Ericsson (L8530 LTE/HSPA+ Dual A9+SGX544 Com-Processor
    • 31. ST-Ericsson (L8580 LTE/HSPA+ Dual-A9+SGX544 Com-Processor
    • 32. ST-Ericsson (U8500 Dual A9+Mali400 HSDPA+ Com-Processor)

VI. RADIO TRANSCEIVERS

  • A. Overview
  • B. LTE Radio Technology Evolution
  • C. Overall RF Transceiver Market Shares
  • D. GSM/GPRS and EDGE Transceiver Market Shares
  • E. CDMA Transceiver Market Shares
  • F. WCDMA/UMTS Transceiver Market Shares
  • G. TD-SCDMA Transceiver Market Shares
  • H. LTE Transceiver Market Shares
  • I. Radio Transceiver Forecast
  • J. 2G/3G/4G RF Transceiver Supplier Profiles
    • 1. AKM (Tri-band WCDMA/HSDPA Xceiver)
    • 2. MediaTek (TD-SCDMA and WCDMA Xceiver
    • 3. MediaTek (CMOS quad GSM/GPRS Xceiver)
    • 4. Broadcom (BCM2085 Polar EDGE Xceiver & EDGE ULC)
    • 5. Broadcom (BCM2091 Bands I-X WCDMA/HSPA/EDGE Xceiver
    • 6. Fujitsu (90nm 10-band HSPA/ EDGE RF Subsystems)
    • 7. GCT Semiconductor (CMOS CDMA2000 Xceiver)
    • 8. Intel (130nm CMOS WEDGE & LTE Xceivers)
    • 9. ST-Ericsson (3GPP Rel 6 WCDMA/HSPA Xceiver)
    • 10. ST-Ericsson (Cat 7/8 GSM/GPRS/EDGE/WCDMA Xceiver)
    • 11. ST-Ericsson (130nm dual-band CMOS TD-SCDMA Xceiver)
    • 12. Qualcomm (CMOS Diversity WEDGE Xceiver + GLONASS GPS)
    • 13. RDA Microelectronics (CMOS GSM/GPRS and EDGE Xceivers)
    • 14. RDA Microelectronics (CMOS TD-SCDMA, TD-HSUPA Xceivers)
    • 15. Renesas (SOI BiCMOS 8-band HEDGE & EDGE Xceiver)
    • 16. Skyworks Solutions (WEDGE & EDGE Xceivers)
    • 17. Icera (CMOS 7-band WCDMA/HEDGE Xceiver)
    • 18. Sony Semiconductor (SiGe BiCMOS WCDMA/HSPA Xceiver)
    • 19. Spreadtrum (7-band CMOS WEDGE, TD-SCDMA Xceiver)
  • K. 4G LTE RF Transceiver Chip Suppliers
    • 1. Altair Semiconductor (1.9-2.7 GHz CMOS Transceiver)
    • 2. Broadcom (LTE/3G Baseband and Transceiver)
    • 3. Fujitsu Semiconductor (LTE FDD1-17, TDD-34, 38 Transceiver)
    • 4. Fujitsu Semiconductor (Simultaneous LTE/3G Transceiver)
    • 5. Fujitsu Semiconductor (Multiband, multimode LTE/3G/2G Xceiver)
    • 6. GCT Semiconductor (R8 FDD Multiband +700 MHz)
    • 7. Intel (LTE/3GPP Rel. 7/8, 1-IX band Transceiver)
    • 8. Maxim-GenAsic (2.3-2.7 GHz TD-LTE Transceiver)
    • 9. Maxim (2.3-2.7 GHz TD-LTE Transceiver)
    • 10. NVIDIA (FDD LTE/HSPA+ Transceiver)
    • 11. Qualcomm (LTE/3G/2G Cat 4 Transceivers)
    • 12. Renesas (FD LTE Cat4 / HSPA+/GSM/GPRS/EDGE)
    • 13. Silicon Motion (FD LTE Cat3 and LTE/CDMA Cat3 Transceiver)
    • 14. Spreadtrum Communications (4G TD LTE/3G TD-SCDMA/WEDGE)
    • 15. ST-Ericsson (LTE 4/HSPA+Transceiver)

VII. CELLPHONE POWER AMPLIFIERS

  • A. Overview
  • B. Cellphone Power Amplifier Market Share Leaders
  • C. Cellphone Power Amplifier Segmentation
  • D. Mobile Power Amplifier Five Year Forecast
  • E. Cellular PA Supplier Profiles
    • 1. Anadigics
    • 2. Avago Technologies
    • 3. Black Sand Technologies
    • 4. Maxim Semiconductor (CDMA, PDC and AMP)
    • 5. Mitsubishi Electronic Devices (GaAs Hybrid CDMA and WCDMA)
    • 6. Renesas Technology Corp
    • 7. RF Micro Devices
    • 8. RDA Microelectronics (Quad GSM & TD-SCDMA 1800)
    • 9. Skyworks
    • 10. TriQuint Semiconductor
  • F. LTE PA Supplier Profiles
    • 1. Anadigics (FDD 1, 2, 7, 8, 20, 3/4/9/10, 5/6/18/19, 12/17, 13/14; TDD 38, 40)
    • 2. Mitsubishi Electric (Six LTE-Compliant Power Amplifiers)
    • 3. Skyworks (FDD 1, 4/9, 5/6, 7, 8, 9, 13/14, 12/17 and TDD 38/40)
    • 4. Nujira
    • 5. RFMD (LTE Single bands 3, 4,7,11,13,17,20 and 21)
    • 6. TriQuint Semiconductor (band 13, 17 of the USA 700 MHz)

VIII. POWER MANAGEMENT UNITS

  • A. Overview
  • B. PMU Audio Codec/Speakerphone Drivers
    • 1. AKM Semiconductor (CMOS 24-bit Audio)
    • 2. Cirrus Logic (CMOS Audio Codec)
    • 3. Texas Instruments (Audio Codec+ USB and miniDSP)
    • 4. Maxim (Stereo Audio Codec)
    • 5. Wolfson Microelectronics (Stereo Codec with SPKR drivers and Class W headphone)
  • C. PMU Market Shares
  • D. PMU Five-Year Forecast
  • E. PMU Company Profiles
    • 1. Anpec Electronics (Battery charge management)
    • 2. Broadcom
    • 3. Dialog Semiconductor (CMOS PMU/Audio subsystem)
    • 4. Intel (RF-Baseband Power Management)
    • 5. Linear Technology (Energy Management)
    • 6. Maxim Integrated Products
    • 7. MediaTek (Baseband)
    • 8. Micrel (BiCMOS, discrete specific PMUs)
    • 9. National Semiconductor
    • 10. Qualcomm (Cellular Power Management)
    • 11. Ricoh Electronic Devices (7 channel PMU + white LED driver)
    • 12. ST-Ericsson (Application Processor PMU)
    • 13. Texas Instruments (Processor PMUs)
    • 14. Wolfson Microelectronics (Audio Codec, MEMS Mics)

IX. APPENDIX

  • A. WIRELESS & MULTIMEDIA ACRONYMS & ABBREVIATIONS

FIGURES

  • Figure 1: Mobile Terminal Revenue by Type: 2012
  • Figure 2: Cellphone Unit Shipments by Type: 2012
  • Figure 3: Growth of Mobile Phones & Computing Tablets
  • Figure 4: Handset Shipments by Region: 2012
  • Figure 5: Smartphone Shipments by Region: 2012
  • Figure 6: Growth of 3G/4G Cellular Basebands by Standard
  • Figure 7: 3G & 4G Shipments by Geographical Region: 2012.
  • Figure 8: LTE Smartphone Global Shipments by Region: 2012
  • Figure 9: Global Growth of LTE by Region
  • Figure 10: Cellphone Digital Processor Summary Forecast
  • Figure 11: APPS-DBB Integrated Com-Processor Market Shares: 2012
  • Figure 12: Standalone Smartphone Application Processor Market Shares: 2012
  • Figure 13: Standalone Tablet Application Processors by Vendor: 2012
  • Figure 14: Application Processor and Co- Processor Forecast
  • Figure 15: LTE Frequency Band Growth (by band count)
  • Figure 16: Analog Baseband, RF and Power Amplifier Chip Revenue Forecast
  • Figure 17: Total Baseband Processor Market by Category: 2012
  • Figure 18: Distribution of Non-Smart Handset Shipments: 2012
  • Figure 19: Digital Baseband Vendor Market Shares: 2012
  • Figure 20: Stand-Alone Baseband Market Revenue by Cellular Standard: 2012
  • Figure 21: China's Domestic Handset Consumption by Standard: 2012
  • Figure 22: CDMA Handset Shipments by Region.
  • Figure 23: UMTS Baseband Shipments by Specific Air Standard: 2012
  • Figure 24: Forecast of Handset Shipments by Air Interface: ‘11-‘17
  • Figure 25: LTE/3G Smartphone Consumption by region: 2012
  • Figure 26: LTE Mobile Baseband Growth by Region
  • Figure 27: Forecast of LTE Baseband Processors in Asia
  • Figure 28: LTE Baseband Shipments by Type: 2012.
  • Figure 29: Standalone vs. Com Processor LTE Shipment Detail: 2012
  • Figure 30: Distribution of CPU Type in LTE Smartphones: 2012.
  • Figure 31: Multi- and Single-mode FDD-LTE Baseband Suppliers: 2012
  • Figure 32: WCDMA/HSPA/TD-SCDMA Baseband Vendor Market Shares: ‘12
  • Figure 33: Renesas G4 Cortex-A8 DBB Com-Processor
  • Figure 34: CDMA Stand-Alone Baseband Vendor Market Shares: ‘12
  • Figure 35: Spreadtrum SC800G TD-SCDMA Baseband Block Diagram
  • Figure 36: Spreadtrum's SC8810 Com-Processor Chip Block Diagram
  • Figure 37: DBB/AP TD-SCDMA Integrated Com-Processor Vendor Shares: ‘12
  • Figure 38: Standalone TD-SCDMA Baseband Vendor Market Shares: ‘12
  • Figure 39: TD-SCDMA DBB & integrated APs Com-Processor Vendor Shares: ‘12
  • Figure 40: Chinese Handset Production by Air Type: 2012
  • Figure 41: GSM/GPRS Baseband Market by Vendor: ‘12
  • Figure 42: GSM/GPRS/EDGE Baseband Market by Vendor: ‘12
  • Figure 43: Cellular Monolithic BB/RF Modem Chip Market by Vendor: ‘12
  • Figure 44: Cellular Monolithic BB/RF Modem Unit Shipments by Vendor: ‘12
  • Figure 45: Monolithic Baseband/RF Sales by Cellular Standard: 2012
  • Figure 46: Dual-SIM, Dual-Standby Shipment Growth: ‘12-‘17
  • Figure 47: Distribution of Mobile Phones by Cellular Standard: 2012
  • Figure 48: ULC Unit Shipment Growth by Technology: ‘11-‘17
  • Figure 49: Mobile Phone Market by Type: 2012
  • Figure 50: Mobile Phone Market by Type: 2016
  • Figure 51: Spreadtrum's SC6530 Baseband MCP Block Diagram
  • Figure 52: ST-ER G4852 GPRS/EDGE Modem Block Diagram
  • Figure 53: Smartphone Growth versus other Handsets: 2011-2017
  • Figure 54: Segmentation of the Smartphone Market: -‘10-‘17
  • Figure 55: Estimated Smartphone Shipments by Operating System: ‘12
  • Figure 56: Smartphone Consumption by Geographical Region: 2012
  • Figure 57: LTE/3G Smartphone Shipments by Geographical Regions
  • Figure 58: Top Twenty Smartphone Suppliers: 2012.
  • Figure 59: Samsung Smartphone Shipments by Model: 2012
  • Figure 60: Application Processors by Core Count in Tablets: 2012
  • Figure 61: Primary Camera Pixel Support in Media Tablets: 2012
  • Figure 62: Percentage of Media Tablets with 1080P Video Recording
  • Figure 63: Tablet Market Share by OS Standard: 2012
  • Figure 64: Estimated Tablet Shipments by Vendor: 2012
  • Figure 65: Top 10 Media Tablet Suppliers: 2012
  • Figure 66: GLBenchmark Comparison of Qualcomm Adreno GPUs
  • Figure 67: Com-Processor vs. Apps Processor Revenues: ‘12
  • Figure 68: Standalone Application Processor vs. Com-Processor Growths
  • Figure 69: Integrated Com-processor Growth by Cellular Standard: -‘11-‘17
  • Figure 70: Standalone Application Processor Vendor Market Shares: ‘12
  • Figure 71: Tablet Application Processor Vendor Market Shares: ‘12
  • Figure 72: Intel's Single-core Z2460 Mobile Application Processor
  • Figure 73: NEC Mobile Application Processor Migration Plan
  • Figure 74: Renesas Mobile MP6530 Platform Diagram
  • Figure 75: Exynos3 Application Processor Block Diagram
  • Figure 76: Telechips TCC88xx Application Processor Block Diagram
  • Figure 77: TI OMAP44x Block Diagram
  • Figure 78: Block Diagram of OMAP5430 Standalone Application Processor
  • Figure 79: Smartphone Segmentation Growth Trends: -‘10-‘17
  • Figure 80: Digital Baseband Com-Processors by Air Interface: 2012
  • Figure 81: Digital Baseband Com-Processors by Air Interface: 2017
  • Figure 82: LTE/3G Standalone versus Com Processor Usage in 2012
  • Figure 83: LTE/3G Smartphones by Core Count: 2012
  • Figure 84: Com-processor Growth by Air-Type: -‘11-‘17
  • Figure 85: Communications Processor Vendor Market Shares: ‘12
  • Figure 86: TD-SCDMA Communications Processor Market Shares: ‘12
  • Figure 87: Leadcore Technology TD-SCDMA Com-Processor Block Diagram
  • Figure 88: Renesas MP5232 LTE Communication Processor Diagram
  • Figure 89: ST-Ericsson U8500 HSPA Dual Com-Processor
  • Figure 90: Overall Cellular RF Transceiver Market by Vendor: ‘12
  • Figure 91: GSM/GPRS RF Transceiver Shipments by Vendor: ‘12
  • Figure 92: CDMA/1xEV-DO Radio Transceiver Shipments by Vendor: ‘12
  • Figure 93: WCDMA RF Transceiver Shipments by Vendor: ‘12
  • Figure 94: TD-SCDMA RF Transceiver Shipments by Vendor: ‘12
  • Figure 95: TD-SCDMA RF Transceiver Shipments by Vendor: ‘12
  • Figure 96: Fujitsu's MB86L01A: Multiband WCDMA/EDGE Radio Block Diagram
  • Figure 97: Cellphone Power Amplifier Market by Vendor: 2012
  • Figure 98: 3G/4G Cellular Handset Growth: -‘11-‘17
  • Figure 99: Cellular Terminal Growth by Type: -‘11-‘17
  • Figure 100: TI Stereo Audio Codec Block Diagram
  • Figure 101: PMU Revenue by Type ABB, CPU, Battery Charge, and Audio Hub: ‘12
  • Figure 102: PMU Revenue Market Share Leaders: 2012

TABLES

  • Table 1: Migration of Baseband Modems from 2G to 4G+
  • Table 2: DBB Processor Forecasts by Air Type: ‘12-‘17
  • Table 3: Comparison of 4G Technologies: WiMAX versus Cat 2-LTE
  • Table 4: TDD Exclusive features
  • Table 5: LTE Spectrum and Active Global Operator Summary
  • Table 6: LTE/3G Smartphone Supplier Quarterly Shipments: 2011 & 2012.
  • Table 7: Standalone LTE Digital Baseband Forecasts by Type: ‘12-‘17
  • Table 8: LTE/3G Baseband Application Processor Forecasts: ‘12-17
  • Table 9: Qualcomm's Thin Modem Lineup
  • Table 10: Integrated BB/Radio Chip Forecast: ‘12-‘17
  • Table 11: Comparison of Single-Chip GSM & EDGE Modems
  • Table 12: Comparison of Multi-Chip, Single-Package GSM, & EDGE Modems
  • Table 13: Comparison of Single-Chip GSM & EDGE Modems
  • Table 14: Five-Year Forecast for Smartphone and Media Tablets
  • Table 15: Smartphone Forecast by Segment from 2011-2017
  • Table 16: Top 40 Smartphone Supplier Unit Market Shipments by Qtr. -‘11-‘12
  • Table 17: Media Tablet Forecast: 2012-2017
  • Table 18: Tablets Supplier Shipments and Market Shares -‘11-‘12
  • Table 19: Most Popular Video Screen Sizes & Screen Ratios
  • Table 20: Resolutions of Common 4K Video Formats
  • Table 21: Enhancements of Snapdragon S3 CPU 28nm over Cortex A9 Licensees
  • Table 22: GPU Comparison Performance in Multiply & Adds
  • Table 23: Brief Comparison of CPUs Used In Application Processors
  • Table 24: ARM CPU Usage by Application Processor Vendors
  • Table 25: Application & Com-Processor 5-Year Forecast by Type: ‘12-‘17
  • Table 26: High Performance Standalone Application Processors
  • Table 27: High Performance Standalone Application Processors (Continued)
  • Table 28: Standalone Application Processor Features & Usage
  • Table 29: Stand-alone Application Processor Features & Usage (continued 1)
  • Table 30: Stand-alone Application Processor Features & Usage (continued 2)
  • Table 31: NVIDIA Tegra 250 Applications Processor Features
  • Table 32: NEC EMMA ARM-based Application Processor Family
  • Table 33: TI OMAP34x, OMAP36x & OMAP44x Applications Processors
  • Table 34: Communication Processor Forecast ‘12-‘17
  • Table 35: Single, Dual and Quad-core Communications Processors
  • Table 36: Single, Dual and Quad-core Communications Processors (continued)
  • Table 37: 3G DBB Communication Processor Capability
  • Table 38: 3G DBB Communication Processor (Continued)
  • Table 39: Qualcomm Snapdragon Communication Processors
  • Table 40: LTE Spectrum FDD Bands 1-20 and Region of Usage
  • Table 41: LTE FDD Spectrum Bands 21-28 and Regions of Usage
  • Table 42: LTE TDD Spectrum Bands 33-44
  • Table 43: Radio Transceiver 5-Year Forecast by Wireless Technology
  • Table 44: 2G/3G/4G RF Transceiver Supplier Profiles
  • Table 45: Frequency Bands & Channel Widths for LTE
  • Table 46: Qualcomm Cellular Baseband/Transceiver Modes Supported
  • Table 47: Global UMTS-FDD Paired bands and Regions of Coverage
  • Table 48: Cellular Power Amplifier Unit Forecast by Air Technology: ‘12-‘17
  • Table 49: Smartphone Band Usage for Apple and Samsung During 2012
  • Table 50: Cellular Power Amplifier Unit Forecast by Handset Type: ‘12-‘17
  • Table 51: Cellular Power Amplifier (PA & PAM) Forecast by Type: ‘12-‘17
  • Table 52: Anadigics Amplifier Modules for CDMA, GSM & HSPA
  • Table 53: Avago's Lineup of CDMA & WCDMA Power Amplifiers
  • Table 54: Mitsubishi GaAs Hybrid Devices for CDMA & WCDMA
  • Table 55: RFMD's 3G WCDMA/HSPA and CDMA EV-DO Power Amplifiers
  • Table 56: Skyworks' Cellular 2G & 3G PA/FEM Product Line
  • Table 57: TriQuint's Lineup of WCDMA/HSUPA & HEDGE Power Amplifiers
  • Table 58: RFMD 3G/4G LTE Most Recent Power Amplifiers
  • Table 59: Cellphone Power Management Unit Forecast by Type: ‘12-‘17
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