The markets for cellular handset & tablet chips grew 24% in 2012 to reach $59 billion (excluding memory). Although digital basebands, application processors and com-processors (basebands paired with application processors) accounted for almost a third (31%) of this market, there are many other chips that serve this rapidly growing market, as illustrated in the graphic below.
Cellular Handset & Tablet Component Market
2012:$59 Bill(excluding memory)
The bigger companies dominate that third of the market offering little opportunity for new entrants, but there are many growth opportunities for other chip companies in the other two-thirds of the market. This report details the markets for those chips as well and explores the market dynamics and the vendors that serve the greater cellular terminal chip market. 2012 vendor market shares are provided for these market segments.
The report is an extensive (641-page) market study that covers virtually all of the chips that enable cellular handsets and media tablets. The report builds on our earlier study of the "core" cellular chips that define a cellular handsets and tablets (basebands, application processors, RF transceivers, power amplifiers and power management chips). This expanded report provides 2012 vendor market shares for virtually every cellphone chip type and forecasts units, ASPs & revenues for them through 2017.
Of course, most interest is now about 4G cellular, especially in the form of LTE (Long Term Evolution). We highlight the currently-available LTE chips and many of the handsets that employ them at the beginning of 2013.
Carter L. Horney, a recognized authority on microprocessor and DSP implementation in telecommunications, is the author of this report. Mr. Horney is an independent consultant and Forward Concepts Associate specializing in semiconductor product strategy and market planning. He was formerly Division Planner for Rockwell International's Digital Communications Division and earlier Strategic Marketing manager for Rockwell's Semiconductor Products Division. Mr. Horney was responsible for the product planning, which led Rockwell (now Conexant Systems) to dominate the worldwide FAX and highspeed modem chip market. He was appointed a Rockwell Engineering Fellow and received many commendations for outstanding achievement in Computer Architecture, Engineering, Technical Marketing, Product Planning and Customer Relations. Mr. Horney has a B.S. in Mathematics and Physics and an M.S. in Mathematics from Western Illinois University.
Will Strauss, President of Forward Concepts, is the editor and significant contributor for this report. Mr. Strauss is internationally recognized as the leading authority on markets driven by digital signal processing (DSP), and wireless is the largest market for DSP technology.