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Comprehensive Cellphone & Tablet Chip Markets 2014: Market Analysis of all Significant Cellular Handset & Tablet IC's

This report provides a detailed market analysis of all significant cellular handset & tablet ICs from modems, application processors and RF transceivers to power amplifiers, and much more. Forecasts are provided (2012-2018) for both revenue and units for all covered products (excluding memory). Market shares for all vendors for each product type are included and 2014 market prospects for key vendors are discussed.

Our forecast model uses ongoing shifts in OEM share, technology (e.g., transition to integrated Wi-Fi) and product categories (e.g., tablet computers, after-market modems, MiFi hotspots) to forecast which chip suppliers will benefit and which will not. Where applicable, vendor market shares are provided for many sub-categories, like air interface (2G, 3G, TD-SCDMA, TD-LTE, and FDD-LTE).

Standalone Baseband Sales
2013: $9.2 Bil, 1.1 Bil Units($ 8.20)

In addition, the report provides quarterly unit shipments and YOY market shares in revenue for the top ten equipment suppliers and their preliminary 2014 positioning as suppliers of mobile handsets, smartphones, tablets, and 3G/4G modems/hotspots. The report provides revenue and unit consumption by smartphones versus non-smart handsets as well as consumption by geographical region.

Smartphone consumption reached 51% of the cellphone market (800 million units), followed by mid-range, budget and feature phones at 24% 13% and 12%, respectively. We believe that two of the leading analysts have over-estimated smartphone shipments by some 150 million units in 2013. The report details why.

Intel, the 2nd leading supplier of 3G thin modems in 2013 - will likely become the 2nd leading supplier of 3G/4G thin modems in 2014. Their focus will be on winning 3G/4G modem orders for notebooks and tablets. They will be challenged by Marvell's 3G/4G PXA802 TD- LTE modem, which also supports TD-HSPA+ and is already shipping to ZTE.

2013 was the first year that application processors surpassed 1 billion units with 44.5% of them as standalone units. We expect standalone consumption among smartphones to decline further in 2014 as more apps processors become part of com-processors.

The report is an extensive (478-page) market study that covers all of the key chips that enable cellular handsets and media tablets. We believe that there is no other cellphone chip market study available that has the breadth or depth of coverage of this one. You are invited to scan the extensive table of contents to get an idea of the full extent of this valuable study and all of the components and companies covered.

FORECASTS FOR ALL KEY CELLPHONE CHIP TYPES

Supplier 2013 Market Shares and Chip Forecasts through 2018:

  • Digital Baseband Processors (DBB)
  • RF Transceivers
  • RF Power Amplifiers/Modules
  • Application Processors (Apps)
  • Communication Processors (DBB+Apps)
  • Power Management Units (PMICs)
  • Bluetooth Chips
  • Camera/Image Sensors
  • Combo Chips (Wi-Fi, BT, FM, GPS & NFC)
  • GPS Chips
  • MEMS of several types
  • NFC/NFC-SIM Chips
  • Sensors of several types
  • Touch-Screen Controllers
  • Ultra-Low-Cost Modems with RF
  • Wi-Fi Chips

ABOUT THE AUTHOR:

Carter L. Horney, a recognized authority on microprocessors and DSPs in communications, is the author of this study. Mr. Horney is a Forward Concepts Associate and was formerly Division Planner for Rockwell International's Digital Communications Division and earlier Strategic Marketing manager for Rockwell's Semiconductor Products Division. Mr. Horney was responsible for the product planning, which led Rockwell (now Conexant Systems) to dominate the worldwide FAX and dial modem chip market. He was a Rockwell Engineering Fellow and has a B.S. in Mathematics and Physics and an M.S. in Mathematics from Western Illinois University.

Table of Contents

I. EXECUTIVE SUMMARY

  • A. Overview
  • B. Major Component Growth Summary
  • C. Baseband Processors
  • D. Connectivity Devices
  • E. Sensors: Image, Touch, MEMS Microphones and Sensors
  • F. ABB/PMU, RF and Power Amplifiers Chips

II. MOBILE MARKET

  • A. Mobile Phones
    • 1. Quarterly/YOY Handset Unit Market Share from 2012-2013
    • 2. Top Thirteen Supplier Revenue for 2013
    • 3. Mobile Phone Forecast by Type from 2013-2018
  • B. Smartphones
    • 1. Global Distribution of Smartphones by Region
    • 2. Top 30 Smartphone Market Share Leaders 2012-2013
    • 3. LTE Smartphone Market Leaders
    • 4. Entry-level Smartphone Trends
    • 5. Smartphone Supplier Profiles
      • a) Apple
      • b) Samsung
      • c) LG
      • d) Sony
      • e) Huawei Devices
      • f) ZTE Mobile Devices
      • g) Lenovo
      • h) Nokia
      • i) Xiaomi
      • j) TCL Communications Technology Holdings
    • 6. Smartphone Five Year Forecast by Geographical Region
    • 7. Smartphone Five Year Forecast by Classification
    • 8. Smartphone Five Year Forecast by Operating System Type
    • 9. Smartphone Baseband Market Share Supplier Summary
  • C. Tablets
    • 1. The White Box Tablet Movement
    • 2. Tablet Quarterly and YOY Market Share from 2012-2013
    • 3. Tablet Shipments by Operating Systems
    • 4. Tablet Manufacturing Sources Statistics
    • 5. Top 10 Tablet Suppliers
      • a) Apple
      • b) Samsung Electronics
      • c) ASUS
      • d) Amazon
      • e) Acer
      • f) Lenovo
      • g) Hewlett Packard
      • h) Toshiba
      • i) Windows 8 Suppliers
      • j) Microsoft RT
      • k) ZTE
    • 6. Five-Year Media Tablet Forecast
    • 7. Embedded Tablet Quarterly Shipments
  • D. Chromebook Forecast
  • E. Modem Hotspots and USB Modem Sticks
    • 1. LTE and LTE VoLTE Hotspot Routers
    • 2. USB Modem Sticks
    • 3. 4G Sticks, Hotspots, Tablet/Notebook Modem Forecast
    • 4. The Market & Supplier Profiles
      • a) Huawei Device Division (Cat 5 Mobile HotSpot
      • b) Novatel Wireless (MIFI Home with VoLTE)
      • c) Sierra Wireless (Express Cards)
      • d) Samsung Electronics
      • e) ZTE Mobile
      • f) Franklin Wireless

III. BASEBAND PROCESSORS

  • A. Overall Baseband Processor Market Shares
  • B. Digital Baseband Processor Forecast by Air Type
  • C. LTE Technology Movements
    • 1. LTE Voice Technology Transition
    • 2. VoLTE Operator Movement
    • 3. Carrier Aggregation
    • 4. LTE Global Operator Status and Deployment Bands
    • 5. LTE Frequency Bands and Channel Bandwidths
    • 6. Global LTE Network Deployment Trends
  • D. LTE Five Year Forecasts
    • 1. LTE Forecast by Global Regions
    • 2. TD-LTE Five-Year Forecast by Frequency Band
    • 3. LTE & 3G/LTE Baseband Five-Year Forecast
  • E. LTE Supplier Market Shares
  • F. LTE Baseband Supplier Profiles
    • 1. Altair Semiconductor Ltd.
    • 2. Huawei-HiSilicon (LTE/3G Rel.9 baseband chip)
    • 3. Innofidei (LTE & LTE/TD-SCDMA Modems)
    • 4. Intel Mobile Communications (FD-LTE RF and 3G/LTE basebands)
    • 5. GCT Semiconductor (GDM7240 LTE Cat3 Baseband/Transceiver)
    • 6. Marvell (PXA1802 LTE/3G + TD-SCDMA thin modem)
    • 7. MediaTek (TD-LTE + TD-SCDMA Com-processor)
    • 8. NVIDIA-Icera (LTE & 21 Mbps HSPA+ platform)
    • 9. Qualcomm (MDM 9x25 LTE/ EVDO or MC-HSPA+ modem)
    • 10. Qualcomm MDM9x35 20nm Cat. 6 LTE/3G/2G Thin Modem
    • 11. Qualcomm (64-bit Single-Core S410)
    • 12. Qualcomm (64-bit S615/S610 OCTA/QUAD ARMv8)
    • 13. Samsung (CMC221 LTE Baseband only)
    • 14. Sequans Communications (LTE Baseband/RF modem)
    • 15. Spreadtrum (LTE/TD-SCDMA/GSM baseband platform)
    • 16. Ericsson (M7400 LTE 4/3G modem - DBB, ABB and RF)
  • G. 3G HSPA+ Enhancements in 3GPP R10 and R11
  • H. WCDMA Baseband Market & Vendor Shares
  • I. WCDMA/HEDGE Baseband Chip Profiles
    • 1. Broadcom (7.2Mbps HSDPA / HSUPA Basebands)
    • 2. NVIDIA (21 Mbps HSPA+ Receive Diversity Modem)
    • 3. Intel (Release 7 diversity HSPA+ 21/11 Mbps Baseband Platform)
    • 4. Marvell (PXA R81202 DC-HSPA+, PXA180x with R9 LTE)
    • 5. MediaTek (MT6268/76M WEDGE Platform)
    • 6. Qualcomm (Gobi MDM Series of Thin Modems)
    • 7. ST-Ericsson (7.2 and 21 Mbps HSPA+ Connect Platforms)
  • J. CDMA Baseband Market & Vendor Shares
  • K. CDMA2000 Baseband Supplier Profiles
    • 1. VIA Telecom
    • 2. Qualcomm (CDMA2000 1x Advanced Chip Set)
    • 3. Qualcomm (CDMA2000 EV-DO Rel. 0 and Rel. A)
    • 4. Qualcomm (Tri-mode CDMA1x EV-DO Rev. A, HSPA+/EDGE)
  • L. TD-SCDMA Baseband Supplier Profiles
    • 1. Leadcore Technology Co Ltd. (TD-HSPA)
    • 2. MediaTek (TD-SCDMA/TD-HSPA Baseband & 2 RFs)
    • 3. Marvell (TD-SCDMA, TD-HSPA Com -Processor)
    • 4. Spreadtrum (TD-HSPA DBB & RF, Triple-SIM)
    • 5. Spreadtrum (LTE and TD-HSPA-SCDMA Baseband)
  • M. TD-SCDMA Baseband Market & Vendor Shares
  • N. GSM/GPRS & EDGE Baseband Market & Vendor Shares
  • O. GSM, GPRS & EDGE Baseband Supplier Profiles
    • 1. MediaTek (MT6236 312MHz ARM9 EDGE Platforms)
    • 2. Spreadtrum Communications (Multichip GSM/GPRS Baseband)
    • 3. ST-Ericsson (Quad GPRS or EDGE-RX monolithic modem)

IV. INTEGRATED BASEBAND & RF CHIPS

  • A. ULC Modem Market Size & Vendor Shares
  • B. ULC Modem Market Forecast
  • C. Ultra-Low-Cost (BB/RF) Modem Supplier Profiles
    • 1. Broadcom (65nm Monolithic EDGE Modem, H.264)
    • 2. Intel (65nm Monolithic EDGE, BT4.0/FM, 5MP)
    • 3. MediaTek, Inc. (GSM/GPRS 1-SIP RF, 2-Die hybrid MCP)
    • 4. MediaTek, Inc (EDGE/GPRS/GSM-TRx + MCP)
    • 5. RDA Microelectronics (Single-Chip GSM/GPRS DBB +BT/FM)
    • 6. Spreadtrum Communications (GSM/GPRS 3 die MCP)
    • 7. ST-Ericsson (Monolithic GSM/GPRS and EDGE DSDS)
    • 8. Qualcomm (WCDMA/HSDPA Single-Package Modems)
    • 9. Qualcomm (WCDMA/HSUPA 10Mbps/5.76 MCP Modem)
    • 10. Qualcomm (CDMA 1x & 1X EVDO MCP Modems)

V. STAND-ALONE APPLICATION PROCESSORS

  • A. Overview
  • B. Cellphone vs. Tablet Apps Processors
  • C. Com-Processor vs. Standalone Processor
  • D. New Video Codecs: H.265 versus VP9
  • E. Application Processor Trends
  • F. Application Processor Market & Vendor Shares
    • 1. Smartphone Application Processor Vendor Market Shares
    • 2. Tablet Application Processor Market & Vendor Shares
  • G. Application Processor and Com-Processor Forecast
  • H. Stand-alone Application Processor Suppliers
  • I. Stand-Alone Application Processor Supplier Profiles
    • 1. Allwinner (A31x ARM quad-core Cortex-A7 & SGX544MP2).
    • 2. Allwinner (A80 OctaCore 4x Cortex A15+4x CortexA7)
    • 3. Amlogic (1.2 GHz Single Core Cortex A9 & Dual 2.5D & 3D GPU)
    • 4. Amlogic (M802 1.5 GHz 4x Cortex A9r + Mali450MP6)
    • 5. Apple A6 (1.3 GHz dual-core Cortex Swift SGX543MP3)
    • 6. Apple A6X (1.4 GHz dual-core Cortex Swift SGX544MP4)
    • 7. Apple A7 (1.4 GHz dual-core Cortex Cyclone S5L8960X.)
    • 8. Freescale (iMX6 1.2 GHz Single, Dual and Quad-core Cortex A9)
    • 9. Huawei (HiSilicon K3V3 1.8/1.2Ghz Dual Cortex A15/1.2GHz A7)
    • 10. Huawei (HiSilicon K3V2 1.5 GHz Quad Cortex A9, 720P)
    • 11. Intel (Z2420 1.2GHz x86HT processor, SGX540 GPU HD 1080P)
    • 12. Intel (Z2760 Dual Processor, SGX544MP2 GPU HD 1080P)
    • 13. Intel (Z2580 1.8MHz Dual Processor, SGX544MP GPU, HD 1080P)
    • 14. Intel (Z3770 Quad-Core, Intel HD graphics)
    • 15. Intel (Z34/Z35: Merrifield/Moorefield, Power VR6 graphics)
    • 16. Marvell (ARMADA Applications Processors)
    • 17. Marvell (PXA986 1.2GHz 2x Cortex A9/Vivante GC1000/720P30)
    • 18. Marvell (PXA2128 1.2 GHz Dual ARMv7 /Vivante GPU)
    • 19. MediaTek (MT8125/8389 Quad Cortex A7/PVR5/HD 1080P)
    • 20. MediaTek (MT8377 1GHZ Dual Cortex A9+SGX531, HD1080p)
    • 21. MediaTek (MT8135 2x A15+2xA7+SGX Rogue/FHD 1080p
    • 22. MediaTek (MT8132 1.5GHz 64-bit Cortex A53+MaliT760)
    • 23. MediaTek (MT6732 1.5GHz Quad 64-bit Cortex A53 with LTE)
    • 24. MediaTek (MT6752 Octa Cortex A53/T760 GPU Standalone)
    • 25. MediaTek (MT6595 4xA17+4xA7 Octa-Rogue S6)
    • 26. MediaTek (MT6752 64-bit Octa Cortex A53 with 3G/LTE)
    • 27. Nufront (Dual Cortex A9+Mali400 Applications Processor)
    • 28. NVIDIA (Tegra3 Quad Cortex A9-12core GeForce Processor)
    • 29. NVIDIA (Tegra4 Quad Cortex A15 72-Core GPU)
    • 30. Nvidia Tegra5 (Quad Cortex A15 192-Core GPU)
    • 31. Qualcomm (1.9 GHz Quad APQ8064T S600 Krait 300/320GPU/HD)
    • 32. Qualcomm (1.7GHZ Dual APQ8030 S400 Krait 300/305GPU/HD)
    • 33. Qualcomm (2.5 GHz Quad APQ8084 Krait450/ 420GPU/UHD (4K)
    • 34. Rockchip (RK2918 ARM Cortex-A8+ GC800GPU)
    • 35. RockChip (RK3066 2x Cortex A9+ Mali400MP4 GPU)
    • 36. Rockchip (RK3188 2x Cortex-A9+Mali400MP4)
    • 37. Rockchip (RK3288 4x Cortex-A12+MaliT764+H.265 decoder)
    • 38. Samsung Exynos4 (1.2 GHz Dual Cortex-A9+ Mali400 1080P)
    • 39. Samsung Exynos4 (1.4 GHz Quad Cortex A9+Mali400, 1080P)
    • 40. Samsung Exynos 5 (1.7 GHz Dual Cortex A15+ Mali-T604GPU)
    • 41. Samsung Exynos 5 Octa-core (1.7 GHz Quad Cortex A15+ SGX544MP3)
    • 42. Samsung (Exynos 5460 Hexa and Exynos 5422 Octa)
    • 43. Texas Instruments OMAP5 (2GHz dual-Cortex-A15 + SGX544MP2)
    • 44. Via/Wonder Media (Dual-Core Cortex-A7)

VI. COMMUNICATION PROCESSORS

  • A. Com-Processor Growth Trends
  • B. Supplier Positioning
    • 1. MediaTek
    • 2. Spreadtrum Communications
    • 3. Broadcom
    • 4. Nvidia
    • 5. Marvell
    • 6. STMicroelectronics (ex ST-Ericsson)
    • 7. Qualcomm
  • C. Communications Processor Market Share Leaders
  • D. Communications Processor Five Year Forecast
  • E. Communications Processor Supplier Profiles
    • 1. Broadcom (BCM21553 832MHz ARM11 R6/7 HSPA-Processor)
    • 2. Broadcom (BCM21654G 1GHz CortexA9 R7 HSPA-720P Processor)
    • 3. Broadcom (BCM28145/155 1.2GHz Dual A9+VC4 R8 HSPA+ with 720p/1080P)
    • 4. Broadcom (BCM23550 1.2GHz 4x CA7/1080P+ R8 HSPA+)
    • 5. Broadcom (MP5232 CA9/GSX543, LTE/DC-HSPA-Processor)
    • 6. Broadcom (MP6530 DualA15/DualA7-SGX544 LTE-Cat4/3G Processor)
    • 7. Broadcom (M320 2x Cortex CA9+HSPA+/LTE)
    • 8. Leadcore Technology LC1810 (CortexA9+ Mali400 LTE/TD-SCDMA-processor)
    • 9. MediaTek MT6516 (416MHz ARM926 GSM/EDGE-processor)
    • 10. MediaTek MT6575 (1GHz A9+SGX531QHD-720P HSDPA- Processor)
    • 11. MediaTek MT6577 (1GHz 2x-A9+SGX531, qHD 720P HSUPA- Processor)
    • 12. MediaTek MT6583/2 (1.2GHz 2x A7 TDSDMA+SGX544 720P)
    • 13. MediaTek MT6589 (1.2GHz 4x-A7+SGX544 HSPA+/TD-SCDMA 720P)
    • 14. MediaTek MT6517 (1GHz A9+SGX531-720P TD-SCDMA)
    • 15. MediaTek MT6572 (1.2 GHz 2x CA7, Mali400, qHD720P TD-SCDMA/HSPA
    • 16. MediaTek MT6592 (1.7 GHz Octa CA7, 4x Mali450, FHD-1080P
    • 17. MediaTek MT6595 (4xA17+4xA7 Rogue Octa Core)
    • 18. Marvell (PXA930/40 1GHz ARMv7+Vivante HEDGE-Processor-1080P)
    • 19. Marvell (PXA920H 1GHz ARMv7+Vivante, TD-SCDMA-Processor with 720P)
    • 20. Marvell (PXA986/988 1.2GHz 2x A9, Vivante, HD-720P, R7 HSPA+/TD-HSPA)
    • 21. Marvell (PXA1088 1.2GHz 4x Cortex A7, GPU, R7 FD/TD HSPA+
    • 22. Marvell (PXA1088L 1.2GHz 4x Cortex A, GPU, R7 FD/DT HSPA+/LTE
    • 23. Marvell (PXA1928 1.5GHZ 64-bit Quad A53/GC5000 5 mode LTE)
    • 24. Nvidia (Tegra 4i 4x CA9-R4,HD1080P, HSPA+/TD-HSPA/ LTE)
    • 25. Qualcomm (MSM7x27A 1 GHz Cortex A5, 480P, HSUPA)
    • 26. Qualcomm (MSM7x25A 800 MHz A5 480P, HSUPA)
    • 27. Qualcomm (MSM8x25 Dual Cortex A5 720P HSUPA/EVDO)
    • 28. Qualcomm (MSM8x25Q 1.2GHz 4x Cortex A5, 720P, HSPA/CDMA)
    • 29. Qualcomm (MSM8930 1.2 GHz 2x K200, HD1080P LTE/HSPA+/1XEVDO)
    • 30. Qualcomm (MSM8x30AB 1.7GHz 2xK300, HD1080P LTE CAT3/HSPA+/EVDO)
    • 31. Qualcomm (MSM8230 1.2 GHz 2x K200, 1080P HSPA+/EVDO)
    • 32. Qualcomm (MSM8630 1.2 GHz 2x K200, 1X EVDO)
    • 33. Qualcomm (MSM8626 1.2 GHZ 4x CA7, HD1080P 1xEVD)/HSPA+).
    • 34. Qualcomm (MSM8x60A 1.7GHz 2x S4 1080p, DC-HSPA+/SVDO processor)
    • 35. Qualcomm (MSM8960T 1.7GHz 2x K200 1080P DC-HSPA+/SVDO Processor)
    • 36. Qualcomm (MSM8974 2.3GHz 4XK400, 2160P R9 HSPA+/TD-HSPA/1xEVDO)
    • 37. Spreadtrum (SC6810/20 1 GHz Cortex A5/GSM/EDGE)
    • 38. Spreadtrum (SC8825 1GHz 2x CortexA5/Mali400/WVGA 720p HSPA/TD-HSPA)
    • 39. Spreadtrum (SC8735S 1GHz Cortex7/Mali400MP4, HD1080p, HSPA+, TDSCDMA/HSPA+
    • 40. Spreadtrum (SC7710 1GHz Cortex A7/Mali400/WVGA 720P HSPA+)
    • 41. Spreadtrum (SC8810 1GHz Cortex A5+Mali400 TD-SCDMA HD video)
    • 42. Spreadtrum (SC9620 TD-SCDMA/TD-LTE)
    • 43. ST-Ericsson (U8500 2xA9/Mali400, HSPA/TDHSPA-HD1080P)

VII. RADIO TRANSCEIVERS

  • A. Overview
  • B. LTE Radio Technology Evolution
  • C. Overall RF Transceiver Market Shares
  • D. GSM/GPRS & EDGE Transceiver Market Shares
  • E. CDMA Transceiver Market Shares
  • F. WCDMA/UMTS Transceiver Market Shares
  • G. TD-SCDMA Transceiver Market Shares
  • H. LTE Transceiver Market Shares
  • I. Radio Transceiver Forecast
  • J. 2G/3G/4G RF Transceiver Supplier Profiles
    • 1. MediaTek (TD-SCDMA and WCDMA Xceiver)
    • 2. Broadcom (BCM2091 Bands I-X WCDMA/HSPA/EDGE Xceiver
    • 3. GCT Semiconductor (CMOS CDMA2000 Xceiver)
    • 4. Intel (130nm CMOS WEDGE & LTE Xceivers)
    • 5. Nvidia/Icera (CMOS 7-band WCDMA/HEDGE Xceiver)
    • 6. ST-Ericsson (130nm dual-band CMOS TD-SCDMA Xceiver)
    • 7. Qualcomm (CMOS Diversity WEDGE Xceiver + GLONASS GPS)
    • 8. RDA Microelectronics (CMOS GSM/GPRS/EDGE Xceivers)
    • 9. RDA Microelectronics (CMOS TD-HSUPA Xceivers)
    • 10. Spreadtrum (7-band CMOS WEDGE, TD-SCDMA Xceiver)
  • K. 4G LTE RF Transceiver Chip Suppliers
    • 1. Altair Semiconductor (1.9-2.7 GHz CMOS Transceiver)
      • Altair is inside Verizon's private-branded LTE tablet.
    • 2. Broadcom (BCM2095 LTE Cat4 / HSPA+/ GSM/ EDGE)
    • 3. GCT Semiconductor (R8 FDD Multiband +700 MHz)
    • 4. Intel (XMM7160 LTE/3G R9 HSPA Multiband Transceiver)
    • 5. Intel (XMM7260 R10 LTE/3G R9 DCHSPA/TD-SCDMA Transceiver
    • 6. Intel (XMM7260 LTE-Advanced)
    • 7. NVIDIA (FDD LTE/HSPA+ Transceiver)
    • 8. Qualcomm (LTE/3G/2G Cat 4 Transceivers)
    • 9. Silicon Motion (FD LTE Cat3 and LTE/CDMA Cat3 Transceiver)
    • 10. Spreadtrum Communications (4G TD LTE/3G TD-SCDMA/WEDGE)
    • 11. ST-Ericsson (LTE 4/HSPA+ Transceiver)

VIII. CELLPHONE POWER AMPLIFIERS

  • A.Overview
  • B. Cellphone Power Amplifier Market Share Leaders
  • C. Mobile Power Amplifier Five Year Forecast
  • D. Frequency Bands
  • E. Cellular PA Supplier Profiles
    • 1. Anadigics
    • 2. Avago Technologies
    • 3. Black Sand Technologies (CMOS)
    • 4. Javelin (CMOS)
    • 5. Murata-Renesas Technology Corp
    • 6. Peregrine Semiconductor ( Reconfigurable PA Front End)
    • 7. Qualcomm (RF360 PA Front End System)
    • 8. RF Micro Devices
    • 9. RDA Microelectronics (Quad GSM & TD-SCDMA 1800)
    • 10. Skyworks
    • 11. TriQuint Semiconductor
  • F. LTE PA Supplier Profiles
    • 1. Anadigics (FDD 1, 2, 7, 8, 20, 3/4/9/10, 5/6/18/19, 12/17, 13/14; TDD 38, 40)
    • 2. Mitsubishi Electric (Six LTE-Compliant Power Amplifiers)
    • 3. Skyworks (FDD 1, 4/9, 5/6, 7, 8, 9, 13/14, 12/17 and TDD 38/40)
    • 4. Nujira (Envelope Tracking Chip)
    • 5. Qualcomm (QFE1100 RF/Envelope Tracking PA.)
    • 6. RFMD (LTE Single bands 3, 4,7,11,13,17,20 and 21)
    • 7. TriQuint Semiconductor (band 13, 17 of the USA 700 MHz)

IX. POWER MANAGEMENT UNITS

  • A. Overview
  • B. PMU Audio Codec/Speakerphone Drivers
    • 1. AKM Semiconductor (CMOS 24-bit Audio)
    • 2. Cirrus Logic (CMOS Audio Codec)
    • 3. Texas Instruments (Audio Codec+ USB and miniDSP)
    • 4. Maxim (Stereo Audio Codec)
    • 5. Qualcomm (WCD9310 Audio DAC)
    • 6. Wolfson (WM8994E Multichannel Audio Codec)
    • 7. Wolfson Microelectronics (Stereo Codec with SPKR drivers and Class W headphone)
  • C. PMU Market Shares
  • D. PMU Five-Year Forecast
  • E. PMU Company Profiles
    • 1. Anpec Electronics (Battery charge management)
    • 2. Broadcom
    • 3. Dialog Semiconductor (CMOS PMU/Audio subsystem)
    • 4. Intel (RF-Baseband Power Management)
    • 5. Linear Technology (Energy Management)
    • 6. Maxim Integrated Products (System PMUs)
    • 7. Maxim Integrated (Compact1S/2S Fuel Gauge)
    • 8. Micrel (BiCMOS, discrete specific PMUs)
    • 9. Qualcomm (Cellular Power Management)
    • 10. Texas Instruments (Processor PMUs)

X. Wi-Fi and Wi-Fi Combinations

  • A. Overview
  • B. Wi-Fi Trends by Standard
  • C. Cellular and Tablet Wi-Fi Market & Vendor Shares
  • D. Wi-Fi Direct Certified Standard
  • E. MiFi Hotspot
  • F. IEEE 802.11 Standards
    • 1. IEE802.11b
    • 2. IEE802.11g
    • 3. IEEE802.11a 5GHz
    • 4. IEEE802.11n (2.4 and 5GHz)
    • 5. IEE802.11ac (5 GHz)
  • G. Wi-Fi Five-Year Forecast
  • H. Wi-Fi Chip Suppler Profiles
    • 1. Qualcomm (Embedded 802.11acgn Wi-Fi, BTv2.1 EDR & FM)
    • 2. Broadcom (802.11abgn/Bluetooth 4.0 + HS/FM 802.11n)
    • 3. Broadcom (40nm Wi-Fi 802.11acbgn, BT4.0, FM Txcvr)
    • 4. Broadcom (BCM4354 5G Wi-Fi 802.11ac, 2x2 MIMO)
    • 5. Samsung Electronics (Wi-Fi/BT/FM Rx/Tx inside Exynos)
    • 6. Marvell (55nm 2X2 MIMO 802.11abg+ BTv2.1)
    • 7. Marvell (Dual-band 2-Steam 802.11ac/BT4.0/NFC)
    • 8. MediaTek (MT6620 4in1 802.11abgn, BT3.0, V4.0/GNSS/FM Rx/Tx)
    • 9. MediaTek (MT6630 5-in-1 Wi-Fi ac/BT4.1/FM/GLONASS/NFC)
    • 10. MediaTek (MT6628T 3-in 1 802.11bgn, FMRx and BT4.0)
    • 11. MediaTek (MT6628Q 4-in1 802.11bgn, BT 3.0, FMRx and GPS)
    • 12. MediaTek (MT7612x 3 in one Wi-Fi 802.11ac, BT4.0 and FMRx)
    • 13. Qualcomm (Wi-Fi 802.11ac/BT4.0/FM)
    • 14. ST-Ericsson (Wi-Fi 802.11bgn, or abgn)
    • 15. Redpine Signals (Wi-Fi-802.11abgn/ac+BT4.0)
    • 16. RDA Microelectronics (Wi-Fi 802.11bg.BT2.1/FM Rx/Tx)
    • 17. Texas Instruments (Wi-Fi 802.11bgn/BT/FM/ GPS)
    • 18. Texas Instruments (Wi-Fi 802.11abgn/BT 4.0 LE, FMRxTx)

XI. BLUETOOTH

  • A. Overview
  • B. The Bluetooth Standards
    • 1. Bluetooth 2.0 EDR
    • 2. Bluetooth 2.1
    • 3. Bluetooth 3.0
    • 4. Bluetooth Low Energy (BTLE)
  • C. Cellphone Bluetooth Market Shares
  • D. Cellphone Bluetooth Forecast
  • E. Cellphone Bluetooth Supplier Profiles
    • 1. MediaTek (Bluetooth +FM RDS/RBDS)
    • 2. Broadcom (65nm Bluetooth 3.0, RDS FM Rx/Tx)
    • 3. IC Plus (Bluetooth v1.1 and v 1.2)
    • 4. Qualcomm (130nm CMOS BT 3.0 + EDR)
    • 5. RDA (CMOS BT 2.1+ EDR +FM receiver)
    • 6. STMicroelectronics (45nm CMOS v3.0 +HS & FM Rx/Tx)
    • 7. Texas Instruments (65nm CMOS Bluetooth 4.0+)

XII. GPS

  • A. New GPS Enhancements & Market Changes
    • 1. GLONASS, Galileo & Chinese Compass Satellite Status
    • 2. GNSS Augmentation System
    • 3. Assisted GPS and Location Awareness Growth
    • 4. Simultaneous GPS (S-GPS)
    • 5. The Indoor Positioning System (IPS) Movement
  • B. GPS Market Vendor Shares
  • C. GPS Forecast
  • D. GPS Supplier Profiles
    • 1. Broadcom (65nm GPS/GLONASS, BT V3.0, FM RX/Tx )
    • 2. Intel (GPS Receiver device)
    • 3. MediaTek (65nm GPS/QZSS/SBAS Monolithic Receiver)
    • 4. Qualcomm (3G RF transceiver and GNSS support)
    • 5. Silicon Motion (RF transceiver and GPS receiver)
    • 6. ST-Ericsson (GNSS, BTv3.0/v4.0 and FM Rx/Tx)
    • 7. Texas Instruments (Wi-Fi +GPS+BTv2.1+FM Rx/Tx)
    • 8. u-Blox (GPS receiver)

XIII. NEAR FIELD COMMUNICATIONS (NFC)

  • A. Overview
  • B. Alternatives to NFC
    • 1. Bluetooth Proximity Beacon Technology
    • 2. Goodx-MediaTek Hotknot Projected Capacitive Interfaces
  • C. NFC Technology Standard Overview
    • 1. Three Signaling Standards
    • 2. Four Mandated Tags Standards
    • 3. NFC Forum Modes of Operation
    • 4. NFC Forum NCI Logical Interface Standard
  • D. FeliCa Technology Standard, emerging NFC-F
  • E. Security
  • F. Single Wireless Protocol Standard UICC
  • G. NFC Chip Market Share
  • H. NFC and FeliCa Chip Forecast
  • I. NFC Chip Supplier Profiles
    • 1. Broadcom Corporation (NFC Controller + Secure element)
    • 2. Fudan Microelectronics Co., Ltd. (Controller+ Secure Element)
    • 3. Infineon (Secure Element and MIFARE Classic 1K)
    • 4. Inside Secure (Controller & Infineon Secure Element)
    • 5. NXP Semiconductor N.V. (NFC Controller +Secure element)
    • 6. MediaTek (SWP/NCI NFC Chip- secure elements )
    • 7. MStar (NFC Controller - No Secure Element)
    • 8. Qualcomm (NFC Controller-Secure element, dual SIMS)
    • 9. Renesas Electronics (NFC/FeliCa Controller+ secure element)
    • 10. Samsung Electronics (NFC/Felica Controller+ Secure Element)
    • 11. Sony (NFC Type3 FeliCa with AES Secure Element)
    • 12. STMicroelectronics (NFC Controller and Secure Element)

XIV. CAMERAS & IMAGE PROCESSORS

  • A. Overview
  • B. Image Sensor Consumption Smartphones and Tablets
  • C. Image Sensor Distribution by Resolution
  • D. Image Sensor Market & Vendor Shares
  • E. Camera Imaging Market Forecast
  • F. Camera Image Sensor Supplier Profiles
    • 1. Aptina (FSI 1.75-2.2μm, VGA, 1.3-, 2-, 3.1, 5MP)
    • 2. Galaxycore (VGA to UXGA resolution)
    • 3. Himax Imaging (1,4μm FSI: VGA, 1.3-, 2- 3- 5-MP)
    • 4. Hynix Semiconductor (FSI 1.4μm, VGA, 1.3- 2-, -3, 5MP, WLO)
    • 5. OmniVision (1.4μm BSI; VGA, 1.3-, 2-, 3.2- & 5-MP; WLO)
    • 6. OmniVision (2μm BSI; 4MP HD Video at 90fps)
    • 7. Samsung (1.4μm FSI, VGA, 1.3; 2,3, 5 and 8MP EDOF)
    • 8. SETi (2.25μm FSI, VGA, 1.3 MP and 2MP CIS Chips)
    • 9. Sony (5, 8, 12, -16MP CMOS 1.1μm2 BSI Image Modules)
    • 10. STMicroelectronics (1.1μ BSI plan, 2, 3, 5 and 8MP FSI modules)
    • 11. Toshiba Electronic Components (1.12μm BSI 2, 3, 5, 8,13 MP)

XV. TOUCH CONTROLLERS

  • A. Overview
  • B. PCAP Full Touch Controller Trends
  • C. Touch Screen Sensor Technology Overview
    • 1. Haptics Touchscreens
    • 2. Resistive Touch Screens
    • 3. Capacitive Touch Screens
    • 4. Optical Touch Technology
  • D. Touch Controller Vendor Market Shares
  • E. Touch Screen Controller Forecast
  • F. Touch Controller Suppliers
    • 1. Analog Devices (Resistive only)
    • 2. Asahi Kasei Microsystems (Resistive controller)
    • 3. Atmel (Capacitive-touch controllers)
    • 4. Broadcom (Full panel custom Capacitive)
    • 5. Cypress Semiconductor (Capacitance Key and Full TSP)
    • 6. Cypress (Optical Track Pad)
    • 7. ELAN Microelectronics (Capacitive multi-touch Module & chip)
    • 8. eGalax EETI (Capacitive Controller)
    • 9. FocalTech Systems (Capacitive Touch Controller)
    • 10. Fudan Microelectronics Co., Ltd (Capacitive Controller)
    • 11. ILI Technology (Complete Capacitive Controller line)
    • 12. Melfas (Capacitive Controllers and touch modules)
    • 13. Renesas Electronics (Capacitive Touch Controller)
    • 14. Silicon Labs (Multitouch Capacitive Controller)
    • 15. Sitronix Technology (Multitouch voltage-driven)
    • 16. STMicroelectronics (Full Screen Capacitive)
    • 17. Synaptics (Cap Arrays and Full Screen Capacitive)
    • 18. Texas Instruments (Custom Capacitive Controller)

XVI. MEMS and SENSORS

  • A. Market Leaders
    • 1. MEMS and Sensor Forecast
  • B. MEMS Gyroscopes
    • 1. Gyro Consumption by OEMs
    • 2. Gyro Market Share by Supplier
    • 3. Gyro Supplier Profiles
      • a) Bosch (30.4mm3, 3-axis Gyro+3-axis Accelerometer)
      • b) Epson Toyocom (30.4mm3, 3-axis Gyro+3-axis Accelerometer)
      • c) InvenSense (16mm3 3- axis yaw and pitch Gyros)
      • d) InvenSense (ICM0278 Gyro/Accelerometer/Proximity Sensor)
      • e) Kionix-ROHM (14.4mm3 3- Axis Gyro)
      • f) Kionix-ROHM (9mm2, 9- Axis Gyro, Acc, and magnetometer)
      • g) Maxim- Sensor Dynamics AG (Combo Accelerometer and Gyro)
      • h) Panasonic (single axis Yaw Vibration-based Gyros)
      • i) Sony (2-Axis Gyros)
      • j) STMicroelectronics (16mm2 3-axis pitch, roll and yaw Gyro)
      • k) Virtus Advanced Sensors (22.4mm3 SOI 3-Axis Accelerometer)
      • l) Murata-VTI (12.7mm2 3-axis Gyro, 4 mm2 3-axis ACC)
  • C. Accelerometers & Supplier Profiles
    • 1. MEMS Accelerometer Consumption By OEMs
    • 2. Accelerometer Market Share Leaders
    • 3. MEMS Accelerometer Supplier Profiles
      • a) Analog Devices (MEMS Accelerometers)
      • b) Bosch Sensortec (9mm3 3-axis Accelerometer)
      • c) Freescale (9mm3 capacitive 3-axis Accelerometer)
      • d) Hokuriku Electric Industry (9mm3 3-axis Accelerometer)
      • e) Kionix-Rohm (MEMS 3 axis-Capacitive Accelerometer)
      • f) MEMSIC (3-Axis 88mm3 CMOS thermal- Accelerometers)
      • g) Lapis Semiconductor (28.7mm3 3-axis Piezoresistive ACC)
      • h) Murata-VTI Technologies (3- Axis Piezoresistive)
      • i) VTI Technologies (19.8mm3 3- axis Capacitive Accelerometer)
      • j) STMicroelectronics (9mm3 Accelerometer, 16mm3 Gyros)
  • D. Magnetometers (eCompass)
    • 1. MEMS Magnetometer Market Share Leaders
    • 2. Consumption by Tablet and Smartphone OEMs
    • 3. MEMS Digital Compass Supplier Profiles
      • a) AKM (19.5 mm3, 6 axis Compass and Accelerometer)
      • b) Bosch Sensortec (8.55mm3 6 axis Magnetometer and ACC)
      • c) MEMSIC (9 mm2 Magnetometer)
      • d) Honeywell Microelectronics (8.1mm3, Magnetoresistive (AMR))
      • e) STMicroelectronics (15mm3 6-axis Compass + Accelerometer)
      • f) Yamaha (4mm2 3-axis geomagnetic sensor chip)
  • E. Light and Proximity Sensors
    • 1. Consumption by Tablet and Smartphone OEMs
    • 2. MEMS Proximity and Light Sensor Market Share Leaders
    • 3. MEMS Proximity & Light Sensor Profiles
      • a) Analog Devices (Proximity sensor))
      • b) ams-TAOS (ALS and ALS/PS combo)
      • c) Intersil (2.8mm3 Digital PS and ALS)
      • d) Capella Microsystems (ALS/PS/IRLED), RGB sensor)
      • e) OSRAM Opto Semiconductor (13mm3 PS and 2.8mm3 ALS)
      • f) Lapis-Rohm Semiconductor (Optical ALS/Proximity combo)
      • g) Sharp Optronics (PS/ALS combo)
      • h) Maxim Integrated (RGB, Temperature, Infrared Proximity Sensor)
      • i) Silicon Laboratories (PS or PS/ALS Combo)
  • F. MEMS Pressure Sensors
    • 1. Pressure Sensors Market Share Leaders
    • 2. Consumption of Pressure Sensors by OEMS
    • 3. MEMS Pressure Sensor Supplier Profiles
      • a) Murata-VTI Technologies (1.67mm3 Pressure Sensor)
      • b) Freescale (16.5mm3 Pressure Sensor)
      • c) Bosch Sensortec (12.7mm3 Barometric Pressure Sensor
      • d) STMicroelectronics (9.0mm3 Piezio Barometric Pressure Sensor)
  • G. Humidity-Temperature Sensor
    • 1. Sensirion
    • 2. STMicroelectronics
  • H. Biometric and Optical Chip Company Profiles
    • 1. Atmel (Thermo Fingerprint Sensor)
    • 2. Avago Technologies (Optical Finger Navigator Chip/Sensor)
    • 3. AuthenTec (64mm3 Secure Finger Swipe Sensor)
    • 4. CrucialTec (Biometric Multi Finger Sensor)
    • 5. Cypress (Optical Track PAD
    • 6. Fingerprint Cards AB (CMOS Touch or Swipe Finger sensors.
    • 7. Precise Biometrics ( Algorithm Sofware)
  • I. MEMS Microphones and Supplier Profiles
    • 1. MEMS Microphone Consumers
    • 2. Silicon Microphone Market Share Leaders
    • 3. MEMS Microphone Supplier Profiles
      • a) AAC Acoustics Technologies, (MEMS Microphones)
      • b) Analog Devices ( Hi performance Silicon Microphone)
      • c) Bosch-Akustica MEMS (CMOS Single chip Microphone)
      • d) BSE
      • e) GoerTek Acoustics, China (MEMS Microphones)
      • f) Knowles Electronics (11.5mm2 MEMS Microphones)
      • g) STMicroelectronics (16mm2 high performance Microphone)
      • h) Wolfson Microelectronics (22 mm3, silicon Microphones)
      • i) Omron (14.6mm3, MEMS Microphone)
      • j) MEMSensing Microsystems (MEMS Microphones)
      • k) Solid State Systems (Single-die MEMS Microphone)
      • XVII. HDMI & MHL for Mobile (MHDI)
  • A. HDMI (High-Definition Multimedia Interface)
  • B. MHL™ Standard Overview
    • 1. HDMI 1.1
    • 2. HDMI 1.2
    • 3. HDMI 1.2a
    • 4. HDMI 1.3
    • 5. HDMI 1.4
  • C. Transmitter Supplier Market Shares
  • D. HDMI/MHL Five Year Forecast
  • E. HDMI/MHL Transmitter Supplier Profiles
    • 1. Analog Devices (1080P HDMI 1.4 Tx)
    • 2. Chrontel (1080P HDMI Tx)
    • 3. Explore Microelectronics (HDMI TV-out Interface Device)
    • 4. NXP Semiconductor (Low Power 1.4 Compliant HDMI Tx)
    • 5. Parade Technologies (Display Port/HDMI Dual mode Tx)
    • 6. Silicon Image (1080P MHL TV Interface)
    • 7. Sunplus Technology
    • 8. Texas Instruments (LVDS Transmitter)
    • 9. Texas Instruments (HDMI Companion interface with 5 volt booster)

FIGURES

  • Figure 1: Cellular Handset & Tablet Component Markets by Type: 2013
  • Figure 2: 2G/3G and 3G/4G Baseband Sales by Type: 2013
  • Figure 3: Application Processors - integrated and Standalone
  • Figure 4: Digital Baseband Processor Forecast Summary
  • Figure 5: Wireless Connectivity Device Forecast Summary
  • Figure 6: Sensor Revenue Split: Image, Touch & Microphones
  • Figure 7: Imaging, Touch Capacitance and MEMS Forecast Summary
  • Figure 8: PMU, RF & Power Amplifier Revenues: 2013
  • Figure 9: Analog BB, PMU & Standalone RF Forecast: '12-'18
  • Figure 10: Distribution of Mobile Handsets by Type: 2013
  • Figure 11: Distribution of Mobile Cellular Devices by Type: 2013
  • Figure 12: Distribution of Cellular Modems by Air Standard: '13
  • Figure 13: Mobile Cellular Device Growths: 2012 to 2018
  • Figure 14: Smartphone Growth Patterns by Type: '12-'18
  • Figure 15: Smartphone Shipments by Geographical Region: '13
  • Figure 16: Non-Smart Handset Shipments by Geographical Region: '13
  • Figure 17: LTE Smartphone Shipments by Geographical Region: '13
  • Figure 18: Smartphone Market Shares by OS: 2013
  • Figure 19: Smartphone Market Shares by OS: 2018
  • Figure 20: 2G, 3G, 3G/4G Smartphone Baseband Market Shares
  • Figure 21: 3G, 3G/4G Thin Baseband Vendor Market Shares for Smartphones: '13
  • Figure 22: 2G/3G, 3G/4G Smartphone App Processor Market Shares: '13
  • Figure 23: Chromebook Market Share Suppliers in 2013.
  • Figure 24: LTE USER Device Segmentation in Units from 2011-2013
  • Figure 25: Mobile Device Shipments by Market Segment: 2013
  • Figure 26: Handset Shipments by Major Region: 2013
  • Figure 27: Total Baseband Processor Market by Category: 2013
  • Figure 28: Global Distribution of Non-Smart Handset Shipments: 2013
  • Figure 29: Standalone Baseband Vendor Market Shares: 2013
  • Figure 30: Integrated AP & Baseband Vendor Market Shares: 2013
  • Figure 31: All Digital Baseband Shipments by Cellular Standard: '13
  • Figure 32: CDMA Handset Shipments by Region: 2013
  • Figure 33: LTE Baseband Shipments by Region: 2013
  • Figure 34: Forecasted Growth of 3G Basebands: '12-‘18
  • Figure 35: Forecasted Growth of 3G/LTE and LTE Basebands: ‘12-'18
  • Figure 36: Standalone vs. Com-Processor LTE Shipment Detail: '13
  • Figure 37: Multi- and Single-mode FDD-LTE Baseband Supplier Shares: 2013
  • Figure 38: WCDMA/HSPA/HSPA+ Baseband Vendor Market Shares: '13
  • Figure 39: CDMA Stand-Alone Baseband Vendor Market Shares: '13
  • Figure 40: DBB/AP TD-SCDMA Integrated Com-Processor Vendor Shares: '13
  • Figure 41: Standalone TD-SCDMA Baseband Vendor Market Shares: '13
  • Figure 42: TD-SCDMA DBB integrated APs Com-Processor Vendor Shares: '13
  • Figure 43: GSM/GPRS Baseband Market by Vendor: '13
  • Figure 44: GSM/GPRS/EDGE Integrated AP Baseband Market by Vendor: '13
  • Figure 45: Cellular Monolithic BB/RF Modem Chip Market by Vendor: '13
  • Figure 46: Cellular Monolithic BB/RF Modem Unit Shipments by Vendor: '13
  • Figure 47: ULC Basebands by Cellular Standard: 2013
  • Figure 48: Spreadtrum's SC6530 Baseband MCP Block Diagram
  • Figure 49: Com-Processor vs. Apps Processor Revenues: ‘13
  • Figure 50: Smartphone Application Processor Market Shares: '13
  • Figure 51: Smartphone Application Processor Unit Distribution: '13
  • Figure 52: Tablet Application Processor Vendor Revenue Market Shares: ‘13
  • Figure 53: Tablet Application Processor Unit Distribution/Shares '13
  • Figure 54: Intel Atom Z34/Z35 (Merrifield/Moorefield) Block Diagram
  • Figure 55: Block Diagram MT6595 OCTA-core A17/A7 Com-Processor
  • Figure 56: Smartphone Growth Trends by Segment: '12-'18
  • Figure 57: Digital Baseband Com-Processors by Air Interface: 2013
  • Figure 58: Digital Baseband Com-Processors by Air Interface: 2018
  • Figure 59: Com-processor Growth by Air-Type: '11-'18
  • Figure 60: Communications Processor Vendor Market Shares: '13
  • Figure 61: TD-SCDMA Communications Processor Market Shares: '13
  • Figure 62: WCDMA/HSPA Com-Processor Market Shares: ‘13.
  • Figure 63: 3G/LTE Com-Processor Market Shares: ‘13.
  • Figure 64: Renesas MP5232 LTE Communication Processor Diagram
  • Figure 65: Overall Cellular RF Transceiver Market by Vendor: ‘13
  • Figure 66: GSM/GPRS RF Transceiver Shipments by Vendor: '13
  • Figure 67: CDMA/1xEV-DO Radio Transceiver Shipments by Vendor: '13
  • Figure 68: WCDMA RF Transceiver Shipments by Vendor: '13
  • Figure 69: TD-SCDMA RF Transceiver Shipments by Vendor: '13
  • Figure 70: LTE RF Transceiver Shipments by Vendor: '13
  • Figure 71: Cellphone Power Amplifier Market by Vendor: '13
  • Figure 72: Basic Digital Audio System Block Diagram
  • Figure 73: PMU Revenue Market Share Leaders: '13
  • Figure 74: Wi-Fi Combo Shipment Forecast Growth: '12-'18
  • Figure 75: Wi-Fi Chip Market & Vendor Shares: '13.
  • Figure 76: Cellphone Bluetooth Market & Vendor Shares: '13
  • Figure 77: GPS Growth by Cellphones & Combos: '12-'18
  • Figure 78: GPS Dedicated Chip Market & Vendor Shares: '13
  • Figure 79: NXP Identification Group Growth: '10-'14
  • Figure 80: NFC Architecture Embedded in a Mobile Phone & Standards Employed
  • Figure 81: NFC Market Shares by Vendor: '13
  • Figure 82: STMicroelectronics Secure Element Chip for NFC
  • Figure 83: Imager Consumption by Cellular Product: ‘13
  • Figure 84: Primary Image Sensor Size Consumption: ‘13
  • Figure 85: Sales Distribution of CIS by type: '13.
  • Figure 86: Imager Unit Growth by Pixel Sizes: '12-'18
  • Figure 87: Second Image Sensor Unit Growth by Pixel Sizes: '12-'18
  • Figure 88: Image Chip Vendor Unit Shares: '13
  • Figure 89: Image Chip Vendor Shares by Revenue: '13
  • Figure 90: Touch Overlay Growth by Phone Type: '12-'18
  • Figure 91: Touch Overlay Growth by Touch Technology: '12-'18
  • Figure 92: Capacitance Touch Controller Vendor Market Shares: '13
  • Figure 93: MEMS Sales Categories as Percent of Sales: '13
  • Figure 94: MEMS Sensor Shipments by Type: '13
  • Figure 95: MEMS Shipment Growth by Type: '12-'18
  • Figure 96: Sensor Shipment Growth by Type: 12-'18
  • Figure 97: MEMS Gyro Market by Vendor: '13
  • Figure 98: MEMS Accelerometer Market by Vendor: '13
  • Figure 99: MEMS Compass (Magnetometer) Vendor Market Shares: '13
  • Figure 100: MEMS Proximity/ALS Vendor Market Shares: '13
  • Figure 101: Lapis Semiconductor Proximity & ALS Sensor Block Diagram
  • Figure 102: Pressure Sensor Market Leaders
  • Figure 103: MEMS Microphone Market Share Leaders
  • Figure 104: HDMI/MHL Market by Vendor: 2013
  • Figure 105: Functional Block Diagram of ADI HDMI/DVI Transmitter

TABLES

  • Table 1: Component Growth by Segment: '10-'13
  • Table 2: Component Sales Growth by Major Categories: '10-‘13
  • Table 3: Five-Year 3G and 4G Subscriber Growth Rates by Geographical Regions
  • Table 5: Sales & ASP of Tablet, Smartphone & Non-Smartphone Segments: 2013
  • Table 6: Handset Supplier Market Share Positions YOY
  • Table 7: Top Thirteen OEM Handset & Tablet Sales Rank: 2013
  • Table 8: Mobile Handset & Tablet Unit Forecasts by Type: '12-'18
  • Table 9: Smartphone Comparisons by Price Category
  • Table 1: Smartphone Suppliers YOY/Quarterly Market Shares: '12 & '13
  • Table 11: LTE/3G Smartphone Quarterly Shipments by Vendor: '12 & '13.
  • Table 12: Revenues of Top Thirteen Suppliers of Handsets and Tablets by Type
  • Table 13: Smartphone Five-Year Forecast by Global Regions
  • Table 14: Global Smartphone Five-Year Forecast by Classification
  • Table 15: Smartphone Five-Year Forecast by Operating System Usage
  • Table 16: Tablet Quarterly Supplier Growth YOY: '12 to '13
  • Table 17: Tablet Shipments by O/S: '12-'13
  • Table 17: Media Tablet and Attached Modem Forecast: '12-'18
  • Table 18: 3G & LTE/3G Tablet Shipments by Vendor: 2012 & 2013.
  • Table 19: Chromebook Growth Compared to Ultra and Standard Notebooks
  • Table 20: Embedded Modems & Mobile Hotspots Forecast: '12-'18
  • Table 21: 3G HSPA Speed and Basic Features Compared to LTE
  • Table 22: DBB Processor Forecasts by Air Type: '12-'18
  • Table 23: HSPA and LTE Comparisons
  • Table 24: LTE Spectrum & Active Operator Summary
  • Table 25: LTE Spectrum and Active Operator Summary (continued)
  • Table 26: LTE Operator Frequency Band Usage in the Americas
  • Table 27: LTE FDD Frequency Band Usage: Europe, Asia, MEA & Oceania
  • Table 28: TDD LTE Band Usage - Europe, Asia, MEAF, Oceania
  • Table 29: LTE Frequency Bands & Channel Bandwidths
  • Table 30: LTE TDD Frequency Bands & Channel Bandwidths
  • Table 31: LTE Subscriber Forecast by Major Regions: '12-'18
  • Table 32: TD-LTE Forecast by Frequency Bands from 2012-2018
  • Table 33: Standalone LTE Baseband Forecasts by Type: '12-'18
  • Table 34: LTE/3G Baseband Application Processor Forecasts: '12-18
  • Table 35: HSPA+ Continues to Evolve
  • Table 36: Marvell's Thin Mobem Linup
  • Table 37: Qualcomm's Thin Modem Lineup
  • Table 38: Integrated BB/Radio Chip Forecast: '12-'18
  • Table 39: Comparison of Single-Chip GSM & EDGE Modems
  • Table 40: Comparison of Multi-Chip, Single-Package GSM, & EDGE Modems
  • Table 41: Comparison of Single-Chip GSM & EDGE Modems
  • Table 42: Application & Com-Processor 5-Year Forecast by Type: '12-'18
  • Table 43: Application Processors by Vendor
  • Table 44: Samsung Galaxy S3, S3 Mini, S4, S4 Mini Comparison
  • Table 45: Feature Comparison of MediaTek's 28nm Cortex A7 Lineup
  • Table 46: Communication Processor Forecast '13-‘18
  • Table 47: Single-, Dual-, Quad- and Octa-core Communications Processor Profiles
  • Table 48: LTE Spectrum FDD Bands 1-20 and Region of Usage
  • Table 49: LTE FDD Spectrum Bands 21-28 and Regions of Usage
  • Table 50: LTE TDD Spectrum Bands 33-44
  • Table 51: Radio Transceiver 5-Year Forecast by Wireless Technology
  • Table 52: 2G/3G/4G RF Transceiver Supplier Profiles
  • Table 53: Qualcomm Cellular Baseband/Transceiver Modes Supported
  • Table 54: Cellular Power Amplifier Unit Forecast by Air Technology: '13-'18
  • Table 55: Cellular Power Amplifier Forecast by Type: '13-'18
  • Table 56: FDD Frequency Band Summary
  • Table 57: TDD LTE Bands
  • Table 58: Suppler of Multi Mode, 3G/LTE Penta Band PAMs
  • Table 59: Anadigics Amplifier Modules for CDMA, GSM & HSPA
  • Table 60: Avago's Lineup of CDMA & WCDMA Power Amplifiers
  • Table 61: Black Sand's PA Product Lineup
  • Table 62: RFMD's 3G WCDMA/HSPA & CDMA EV-DO Power Amplifiers
  • Table 63: Skyworks' Cellular 2G & 3G PA/FEM Product Line
  • Table 64: TriQuint's Lineup of WCDMA/HSUPA & HEDGE Power Amplifiers
  • Table 65: RFMD 3G/4G LTE Most Recent Power Amplifiers
  • Table 66: Cellphone Power Management Unit Forecast by Type: '12-'18
  • Table 67: 802.11 ac Device Comparisons
  • Table 68: 802.11 Performance Standards
  • Table 69: Available 802.11 ac Chip Sets
  • Table 70: 802.11 Data Rate Performance Standards for Handsets
  • Table 71: Cellular Wi-Fi Chip Penetration by Standard: '12-'18
  • Table 72: Cellular Wi-Fi Chip Five-Year Forecast: '12-'18
  • Table 73: Wi-Fi Vendors by Standard and Connectivity Options
  • Table 74: Texas Instruments 802.11ac Family of Device Features
  • Table 75: Bluetooth Data Rates
  • Table 76: Comparison of BLTE vs. Standard Bluetooth Protocol
  • Table 77: Bluetooth Forecast with Wi-Fi: '12-'18
  • Table 78: Qualcomm Bluetooth Integrated & Standalone Capabilities
  • Table 79: GPS Chip Five-Year Forecast: '12-'18
  • Table 80: NFC-Related Standards
  • Table 81: Various SIM Standards & Dimensions
  • Table 82: NFC Controller Forecast by Handset and Tablet Consumption
  • Table 83: SIM, NFC-SIM, NFC/NFC-F MPU & Bridge Forecast: '12-'18
  • Table 84: Cellular Camera Image Sensor Forecast: '12-'18
  • Table 85: Aptina's 1.7μm, 2.2 μm CIS Line up
  • Table 86: Galaxycore Imaging Product Lineup
  • Table 87: Himax Imaging Product Lineup
  • Table 88: OmniVision's CIS Lineup
  • Table 89: Samsung's Lineup of Camera Sensors & SoC Options
  • Table 90: Toshiba's Dynastron™ CIS Dies
  • Table 91: Touch Screen Technology Comparisons
  • Table 92: Touch Screen Controller Five-Year Forecast
  • Table 93: Touch Controller Chip Vendors & their Customer Bases
  • Table 94: Cypress Programmable SoC Touch Controller Family Migration
  • Table 95: Cypress Capacitive Touch Controller Lineup
  • Table 96: Ilitek Capacitive Touch Screen Controller Family of Devices
  • Table 97: Silicon Labs Capacitive Small Array Touch Family
  • Table 98: STM's Small Array Capacitive Touch Family
  • Table 99: STM Full Touch Capacitive Controllers
  • Table 100: MEMS Device Supplier Shipments: 2012-2013
  • Table 101: MEMS Five Year Forecast by Type: '12-'18
  • Table 102: Gyro Consumption by OEMs
  • Table 103: Characteristics of competing tri-axis Gyro Devices
  • Table 104: MEMS Accelerometer Consumption by OEMs: '12-'13
  • Table 105: Bosch Sensotec Accelerometer family
  • Table 106: MEMSIC Thermal-Based vs. Capacitive Accelerometers
  • Table 107: Compass Device Consumption by OEM: '12-'13
  • Table 108: Comparison of Competing 6-Axis Compass/Accelerometers
  • Table 109: Top Consumers of ALS, RGB and Proximity Sensors: '12-'13
  • Table 110: Pressure Sensor Shipments by Vendors '12-'13
  • Table 111: Largest Consumers of MEMS Microphones by Units: '12-'13
  • Table 112: Wolfson Microelectronics MEMS Microphone Product Line-up
  • Table 113: HDMI & MHL Transmitter Chip Comparisons
  • Table 114: HDMI & MHL Transmitter Usage by Major OEMs: '12
  • Table 115: HDMI/MHL Forecast: '12-'18
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