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Market Research Report
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This publication has been discontinued on July 19, 2011.
US demand to grow 13.3% annually through 2008
Demand for electronic polymer products is forecast to expand 13.3 percent per
year to $4.5 billion in 2008. Production of these products will require 510
million pounds of resin valued at $2.2 billion. Growth will be driven by a
strong recovery in the semiconductor industry and a shift to new technologies
that are more intensive users of polymers. For example, direct chip attachment
is intensifying the need for new materials such as underfills and conductive
adhesives. This encourages close collaboration between chipmakers and backend
(packaging) operations and favors firms with US operations. These trends in
back-end technologies, and the general shift toward higher cost specialty
resins, will result in electronic polymer products outpacing gains in electronic
component shipments through 2008.
Area array, chip scale packages to spur gains
For electronic polymers used in fundamental applications such as printed
circuit board laminates and semiconductor packaging, the primary competitive
focus will be the continuing replacement of wire bonded packages by flip chip
and other types of area array and chipscale packaging in many applications.
Standard wire bonded packages will still predominate, but the move to area array
packaging will cause significant shifts in material requirements as formerly
niche materials become major segments of the industry. For instance, chip
underfills, used in flip chip assemblies, see annual growth of nearly 30 percent
per year through 2008. Conductive adhesives will also see strong gains as these
materials replace lead solders due to environmental factors and the use of less
expensive compounds in molded interconnect devices. Conversely, epoxy molding
compounds and die attach adhesives, both used traditional wire bonded packaging,
will post slower gains.
Low-k, liquid crystal, polysulfone polymers among best prospects
A few segments of the electronic polymer products market are expected to
experience particularly good growth. For example, annual gains for low-k
dielectric polymers are projected to reach $285 million in 2008 from less than
$10 million in 2003. Polymers with a low dielectric constant, such as Dow
Chemicalfs SILK and Rohm and Haasf ZIRKON materials, are challenging
traditional silicon dioxide (SiO2) in crucial ILD (interlayer dielectric)
applications in semiconductor fabrication. The primary competition for low-k
polymers, which are applied via a spin-on process, is from CVD (chemical vapor
deposition) processes utilizing carbondoped SiO2. The outcome of this
competition is likely to be a combination of spin-on polymers and CVD-applied
materials. Compounds made of high temperature thermoplastics such as liquid
crystal polymer and polyethersulfone used in molded interconnect devices are
another area of strong growth.
Study coverage
Electronic Polymers, a 302-page Freedonia study. It provides historical demand
data (1993, 1998, 2003) plus forecasts to 2008 and 2013 by resin, type and
end-use. It also presents company market share data and profiles 36 US industry
competitors.
TABLE OF CONTENTS
INTRODUCTION
I. EXECUTIVE SUMMARY
II. MARKET ENVIRONMENT
- General
- Macroeconomic Overview
- Population & Demographic Trends
- Personal Consumption Expenditures
- Manufacturing Sector Overview
- Electronic Product Shipments
- Electronic Component Shipments
- Semiconductors
- Passive Components
- Printed Circuit Boards
- Environmental & Regulatory Trends
III. TECHNOLOGY
- General
- Electronic Component Manufacturing
- Polycrystalline Silicon Production
- Silicon Wafer Fabrication
- Integrated Circuit Fabrication
- Interlayer Dielectrics
- Printed Circuit Board Production
- Packaging & Assembly Overview
- Wire-Bond Technology
- Surface Mount Technology
- Chip-on-Board Technology
- Multichip Module Technology
- Chip Scale Packaging
- Ball Grid Arrays
- Flip Chip Technology
IV. OVERVIEW
- General
- Industry Flow Chart
- Historical Growth & Cyclicality, 1993-2003
- Electronic Polymer Pricing Trends
- World Demand for Electronic Polymer Products
- World Demand by Region
- World Demand by Product
V. ELECTRONIC POLYMERS DEMAND BY RESIN
- General
- Thermoset Electronic Polymers
- Thermosets Demand by Resin
- Epoxies
- Demand by End Use & Application
- Suppliers & Products
- Polyimides
- Demand by End Use & Application
- Suppliers & Products
- Silicones
- Demand by End Use & Application
- Suppliers & Products
- Phenolics
- Demand by End Use & Application
- Suppliers & Products
- Polyurethanes
- Other Thermoset Electronic Polymers
- Thermoplastic Electronic Polymers
- Thermoplastics Demand by Resin
- Polysulfone & Polyethersulfone
- Liquid Crystal Polymer
- Nylon
- Polyphenylene Sulfide
- Polybutylene Terephthalate
- Polyethylene Terephthalate
- Other Thermoplastic Electronic Polymers
VI. ELECTRONIC POLYMER PRODUCTS DEMAND BY TYPE
- General
- Electronic Laminates
- Electronic Laminates by Resin
- Epoxy-Based Electronic Laminates
- Polyimide-Based Laminates
- Phenolic-Based Electronic Laminates
- Other Thermoset Electronic Laminates
- PET-Based Electronic Laminates
- LCP-Based Electronic Laminates
- Other Thermoplastic Electronic Laminates
- Electronic Laminates Suppliers & Market Share
- Packaging Materials
- Encapsulants
- Packaging Molding Compounds
- Other Packaging Materials
- Packaging Materials Suppliers & Market Share
- Connector Molding Compounds
- Polysulfone & Polyethersulfone Molding Compounds
- Liquid Crystal Polymer Molding Compounds
- Nylon Molding Compounds
- Polyphenylene Sulfide Molding Compounds
- Polybutylene Terephthalate Molding Compounds
- Other Connector Molding Compounds
- Connector Molding Compounds Suppliers & Market Share
- Electronic Adhesives & Underfill
- Die Attach Adhesives
- Assembly & Surface Mount Adhesives
- Conductive Adhesives
- Underfill
- Adhesives & Underfill Suppliers & Market Share
- Other Electronic Polymer Products
- Conformal Coatings
- Low-k Dielectric Polymers
- All Other Electronic Polymer Products
- Other Electronic Polymer Products Suppliers & Market Share
VII. ELECTRONIC POLYMER PRODUCTS DEMAND BY END USE
- General
- Printed Circuit Boards
- Semiconductors
- Passive Components
VIII. INDUSTRY STRUCTURE
- General
- Suppliers & Market Share
- Isola (Ruetgers)
- DuPont
- Cookson
- General Electric
- National Starch and Chemical (ICI)
- Rogers
- Park Electrochemical
- Henkel Loctite
- Other
- Acquisitions, Divestitures & Industry Restructuring
- Joint Ventures & Cooperative Agreements
- Research & Development
- Competitive Strategies
- Marketing & Distribution
- Company Profiles
- Ablestik Laboratories, see Imperial Chemical Industries
- Acheson Colloids, see Imperial Chemical Industries
- Air Products and Chemicals Incorporated
- Arch Chemicals Incorporated
- Arlon Incorporated, see Bairnco Corporation
- Ashland Incorporated
- Bairnco Corporation
- Bakelite AG, see Ruetgers AG
- BASF AG
- Bayer AG
- Celanese AG
- ChemFirst Incorporated, see DuPont (EI) de Nemours
- Chevron Phillips Chemical Company LLC
- Conap Incorporated, see Cytec Industries Incorporated
- Cookson Group plc
- CPChem, see ChevronPhillips Chemical Company LP
- Cytec Industries Incorporated
- Dainippon Ink and Chemicals Incorporated
- Degussa AG
- Dow Chemical Company
- Dow Corning Corporation
- DuPont (EI) de Nemours
- Durez Corporation, see Sumitomo Chemical
- Eastman Chemical Company
- Emerson & Cuming, see Imperial Chemical Industries plc
- EMS-Chemie Holding AG
- Epoxy Technology Incorporated
- GE Plastics, see General Electric Company
- General Electric Company
- HD MicroSystems LLC, see DuPont and Hitachi Limited
- Henkel KGaA
- Hitachi Limited
- Honeywell International Incorporated
- Honeywell Plastics, see BASF AG
- Huntsman Corporation
- Imperial Chemical Industries plc
- Isola Laminate Systems Corporation, see Ruetgers AG
- Loctite Corporation, see Henkel KGaA
- Lord Corporation
- Matsushita Electric Works Limited
- National Starch and Chemical, see Imperial Chemical (ICI)
- Park Electrochemical Corporation
- Polyclad Laminates Incorporated, see Cookson Group plc
- PPG Industries Incorporated
- Promerus LLC, see Sumitomo Chemical Company Limited
- Reichhold Incorporated, see Dainippon Ink and Chemicals
- Resolution Performance Products LLC
- Rogers Corporation
- Rohm and Haas Company
- Ruetgers AG
- Shin-Etsu Chemical Company Limited
- Shipley Company LLC, see Rohm and Haas Company
- Solvay SA
- Sumitomo Chemical Company Limited
- Ticona LLC, see Celanese AG
- Tra-Con, see Imperial Chemical Industries plc
- Vantico AG, see Huntsman Corporation
- Wacker-Chemie GmbH
- Other Companies in the Electronic Polymers Industry
LIST OF TABLES
SECTION I -- EXECUTIVE SUMMARY
- Summary Table
SECTION II -- MARKET ENVIRONMENT
- 1 Macroeconomic Indicators
- 2 Population Trends
- 3 Personal Consumption Expenditures
- 4 Manufacturers' Shipments
- 5 Electronic Product Shipments
- 6 Electronic Component Shipments by Product
- 7 Semiconductor Shipments by Type
- 8 Passive Component Shipments by Type
- 9 Printed Circuit Board Shipments by Type
SECTION IV -- OVERVIEW
- 1 Electronic Polymer Products Demand
- 2 Electronic Polymer Products Demand: Historical Growth & Cyclicality,
1993-2003
- 3 Electronic Polymers Pricing Trends
SECTION V -- ELECTRONIC POLYMERS DEMAND BY RESIN
- 1 Electronic Polymers Demand
- 2 Thermoset Electronic Polymers Demand by End Use & Application
- 3 Thermoset Electronic Polymers Demand by Resin
- 4 Epoxies Demand in Electronic Components by End Use & Application
- 5 Polyimides Demand in Electronic Components by End Use & Application
- 6 Silicones Demand in Electronic Components by End Use & Application
- 7 Phenolics Demand in Electronic Components by End Use & Application
- 8 Polyurethanes Demand in Electronic Components by End Use &
Application
- 9 Other Thermoset Polymers Demand in Electronic Components by End Use
& Application
- 10 Thermoplastic Electronic Polymers Demand by End Use & Application
- 11 Thermoplastic Polymers Demand by Resin
- 12 Polysulfone & Polyethersulfone Demand in Electronic Components by
End Use & Application
- 13 Liquid Crystal Polymer Demand in Electronic Components by End Use &
Application
- 14 Nylon Demand in Electronic Components by End Use & Application
- 15 Polyphenylene Sulfide Demand in Electronic Components by End Use &
Application
- 16 PBT Demand in Electronic Components by End Use & Application
- 17 PET Demand in Electronic Components by End Use & Application
- 18 Other Thermoplastic Polymers Demand in Electronic Components by End Use
& Application
SECTION VI -- ELECTRONIC POLYMER PRODUCTS DEMAND BY TYPE
- 1 Electronic Polymer Products Demand by Type
- 2 Electronic Laminates Demand
- 3 Electronic Laminate Demand by Resin
- 4 Epoxy-Based Electronic Laminates Demand
- 5 Polyimide-Based Electronic Laminates Demand
- 6 Phenolic-Based Electronic Laminates Demand
- 7 Other Thermoset Electronic Laminates Demand
- 8 PET-Based Electronic Laminates Demand
- 9 LCP-Based Electronic Laminates Demand
- 10 Other Thermoplastic Electronic Laminates Demand
- 11 US Electronic Laminate Sales by Company, 2003
- 12 Packaging Materials Demand by Type
- 13 Encapsulants Demand
- 14 Packaging Molding Compound Demand
- 15 Other Packaging Materials Demand
- 16 US Electronic Packaging Material Sales by Company, 2003
- 17 Connector Molding Compound Demand
- 18 Polysulfone & Polyethersulfone Connector Molding Compounds Demand
- 19 Liquid Crystal Polymer Connector molding Compounds Demand
- 20 Nylon Connector Molding Compound Demand
- 21 Polyphenylene Sulfide Connector Molding Compound Demand
- 22 Polybutylene Terephthalate Connector Molding Compound Demand
- 23 Other Connector Molding Compound Demand
- 24 US Connector Molding Compounds Sales by Company, 2003
- 25 Adhesives & Underfill Demand by Type
- 26 Die Attach Adhesives Demand
- 27 Assembly & Surface Mount Adhesives Demand
- 28 Conductive Adhesives Demand
- 29 Underfill Demand
- 30 US Electronic Adhesives & Underfill Sales by Company, 2003
- 31 Other Electronic Polymer Products Demand by Type
- 32 Conformal Coatings Demand
- 33 Low-k Dielectric Polymers Demand
- 34 All Other Electronic Polymer Products Demand
- 35 US Other Electronic Polymer Products Sales by Company, 2003
SECTION VII -- ELECTRONIC POLYMER PRODUCTS DEMAND BY END USE
- 1 Electronic Polymer Products Demand by End Use
- 2 Printed Circuit Board Applications for Electronic Polymer Products by
Product & PCB Type
- 3 Semiconductor Applications for Electronic Polymer Products by Product
& Packaging Type
- 4 Passive Components Applications for Electronic Polymer Products
SECTION VIII -- INDUSTRY STRUCTURE
- 1 US Electronic Polymer Product Sales by Company, 2003
- 2 Selected Acquisitions & Divestitures in the Electronic Polymers
Industry, 2002-2003
- 3 Selected Cooperative Agreements in the Electronic Polymers Industry
- 4 Research & Development Expenditures: Selected Electronic Polymer
Suppliers
LIST OF CHARTS
SECTION IV -- OVERVIEW
- 1 Electronic Polymers Flowchart
- 2 Electronic Polymer Products Demand: Historical Growth & Cyclicality,
1993-2003
- 3 World Electronic Polymer Products Demand by Region, 2003
- 4 World Electronic Polymer Products Demand by Product, 2003
SECTION VI -- ELECTRONIC POLYMER PRODUCTS DEMAND BY TYPE
- 1 Electronic Laminates -- US Market Share by Supplier, 2003
- 2 Electronic Packaging Materials -- US Market Share by Supplier, 2003
- 3 Connector Molding Compounds -- US Market Share by Supplier, 2003
- 4 Electronic Adhesives & Underfill -- US Market Share by Supplier,
2003
- 5 Other Electronic Polymer Products -- US Market Share by Supplier, 2003
SECTION VIII -- INDUSTRY STRUCTURE
- 1 Electronic Polymer Products -- US Market Share by Supplier, 2003
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