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Market Research Report

Phase Change Memory Enters a New Phase 2nd Edition

Published by Forward Insights
Published October, 2009 Product code 100444
Content info 78 Pages
Price
US $ 4399 PDF by E-mail (Local License)
US $ 4999 PDF by E-mail (Global License)


Phase Change Memory Enters a New Phase 2nd Edition published by Forward Insights in October, 2009. This report consists of 78 Pages and the price starts from US $ 4399.

Introduction

Abstract

Phase Change Memory Enters a New Phase outlines the challenges phase change memory faces as it vies to compete with mainstream charge-based memories. The report provides thorough analysis of PCM versus current mainstream semiconductor memories such as SRAM, DRAM, NOR flash and NAND flash. An update on the PCM activities of major vendors as well as a market and price forecast out to 2015 based on a detailed roadmap is also provided.

Table of Contents

CONTENTS

LIST OF FIGURES

LIST OF TABLES

TERMINOLOGY

EXECUTIVE SUMMARY

MEMORY OVERVIEW

  • Introduction
  • The Memory Hierarchy
  • SRAM
    • Concept
    • Technology Evolution
  • DRAM
    • Concept
    • Technology Evolution
  • NOR Flash
    • Concept
    • Technology Evolution
  • NROM
    • Concept
    • Technology Evolution
  • NAND Flash
    • Concept
    • Technology Evolution

PHASE CHANGE MEMORY

  • Introduction
  • Phase Change Material
  • Memory Cell Concept
  • Basic Operation
  • Memory Cell Variations
  • Selection Device
  • PCM Characteristics
    • Set Time
    • Reset Current
    • Endurance
    • Memory Comparison
  • Multi-level Cell PCM
  • Device Layout
  • PCM Reliability
  • PCM Cost Drivers
    • Die Size
    • Process Complexity
  • Technology Scaling
    • Scaling Parameters
    • Roadmap

PCM DEVELOPMENT STATUS

  • PCM Development Status
  • ATMI, Inc.
  • BAE Systems
  • CAMELS
  • Elpida
  • Hynix Semiconductor
  • IBM
  • IMEC
  • ITRI
  • Macronix International
  • Nanochip
  • Numonyx (Intel/ST)
  • NXP Semiconductors
  • Ovonyx
  • Qimonda AG
  • Renesas Technology
  • Samsung Electronics
  • STMicroelectronics
  • ULVAC

MARKET FORECAST

  • PCM as a NOR Replacement
  • PCM as a Non-volatile RAM
  • PCM as a Storage Class Memory
  • Applications
  • Embedded PCM
  • Market

REFERENCES

ABOUT THE AUTHOR

ABOUT FORWARD INSIGHTS

  • Services
  • Contact

REPORT OFFERINGS

List of Figures

  • Figure 1. Memory Hierarchy
  • Figure 2. SRAM Cell Layout
  • Figure 3. 3D SRAM Technology
  • Figure 4. DRAM Cell
  • Figure 5. DRAM Cell Transistor Evolution
  • Figure 6. DRAM Cell Capacitor Trend
  • Figure 7. NOR Flash Cell
  • Figure 8. NOR Architecture
  • Figure 9. NOR Flash Cell
  • Figure 10. NOR Flash Technology Evolution
  • Figure 11. Drain Bias Margin
  • Figure 12. NROM Cell Concept
  • Figure 13. NROM Architecture
  • Figure 14. NROM Cell
  • Figure 15. NROM Technology Evolution
  • Figure 16. Bit Disturb (“Second Bit Effect”)
  • Figure 17. NAND Flash Cell Concept
  • Figure 18. NAND Architecture
  • Figure 19. NAND Cell String
  • Figure 20. NAND Flash Technology Evolution
  • Figure 21. NAND Flash Memory Gap Fill
  • Figure 22. Electrons Stored on the Floating Gate
  • Figure 23. Samsung 32Gb CTF Memory
  • Figure 24. Timeline of Phase Change Memory
  • Figure 25. Periodic Table
  • Figure 26. GST Composition
  • Figure 27. Basic PCM Cell Structure
  • Figure 28. Set Operation
  • Figure 29. Reset Operation
  • Figure 30. Phase Change Memory I-V Curve
  • Figure 31. Memory Array Operation
  • Figure 32. μTrench and Lance Structures
  • Figure 33. Lance and pore structure
  • Figure 34. Phase Change Bridge Memory
  • Figure 35. MOS and BJT Selector
  • Figure 36. Diode Selector
  • Figure 37. Set Time Trend
  • Figure 38. Dependence of Reset Current on Contact Area
  • Figure 39. Reset Current Reduction with Ta2O5 Interfacial Layer
  • Figure 40. Reset Current Trend
  • Figure 41. PCM Endurance
  • Figure 42. Read Access Time Comparison
  • Figure 43. Write Throughput
  • Figure 44. Program Performance Comparison
  • Figure 45. MLC Write Approaches
  • Figure 46. MLC Distribution
  • Figure 47. Multi-level States as a Function of Pulse Tail
  • Figure 48. 16-Level and 4-Level PCM
  • Figure 49. Samsung Phase Change Memory Device Evolution
  • Figure 50. Samsung 90nm 512Mb PRAM Layout
  • Figure 51. ST/Intel Phase Change Memory Device Evolution
  • Figure 52. NOR Flash and PCM Architecture
  • Figure 53. Intel 256Mb 130nm 28F256L18 StrataFlash Organization
  • Figure 54. 128Mb (256Mb MLC) PCM Organization
  • Figure 55. Endurance as a function of Energy per Pulse
  • Figure 56. PCM vs. NOR Flash
  • Figure 57. Phase Change Memory Technology Evolution
  • Figure 58. Samsung PRAM Cell Size Evolution
  • Figure 59. SABEC Process
  • Figure 60. PRAM Module
  • Figure 61. 180nm Process μTrench PCM Process
  • Figure 62. Phase Change Memory with μTrench Cell
  • Figure 63. Scaling Parameters
  • Figure 64. PCM Scaling Challenges
  • Figure 65. Memory Roadmaps
  • Figure 66. Bit Size Trend
  • Figure 67. Density Trend
  • Figure 68. Areal Density Trend
  • Figure 69. Embedded PCM Roadmap
  • Figure 70. U.S. PCM Patents from 1990 to January 2007
  • Figure 71. Radition-hard C-RAM
  • Figure 72. Memory Device Characteristics - 2012
  • Figure 73. PCM in the Memory System
  • Figure 74. Hybrid FTL for NAND/PCM
  • Figure 75. SCM Target Specifications
  • Figure 76. Enterprise Data Systems Memory & Storage
  • Figure 77. SCM Address Translation
  • Figure 78. PCM as an Unified Memory
  • Figure 79. PCM in the Memory Hierarchy
  • Figure 80. $/MB Forecast
  • Figure 81. PCM NOR Replacement Rate
  • Figure 82. Enterprise DRAM TAM
  • Figure 83. Memory Revenue Forecast

List of Tables

  • Table 1. Memory Comparison
  • Table 2. PCM Development Status
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