PUBLISHER: Information Network | PRODUCT CODE: 1266870
PUBLISHER: Information Network | PRODUCT CODE: 1266870
Advanced wafer-level packaging technologies hold the key to meeting future technology needs, from mobile devices to automotive applications, to those required for enabling the IoT. Flip chip technology is slowly replacing wire bonding for many high-performance chips. Flip Chip (FC) is not a specific package (like SOIC), or even a package type (like BGA). Flip Chip describes the method of electrically connecting the die to the package carrier whereby the interconnection between the die and carrier is made through a conductive "bump" or copper pillar that is placed directly on the die surface. The bumped die is then "flipped over" and placed face down, with the bumps connecting to the carrier directly.
This technology can be applied on application processor, baseband, PMIC, memory devices, etc. products. For mobile communications, flip chip development is driven by increased device performance and package miniaturization trends, particularly for the CPU or so called applications processor that powers smart phones and media tablets.
To meet the needs of thinner mobile devices, Wafer Level Packages (WLPs) have been developed. They differ from flip-chip packages primarily in that the die is mounted directly on the PCB. The reduced form factor provided by mounting the die directly on the PCB has vaulted WLP to the leading position for smartphones and other products where space is at a premium.
This report analyzes the technology for flip chip technology and WLPs, presenting forecasts for packages by type and application.