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The Global MEMs Device, Equipment, and Materials Markets: Forecasts and Strategies for Vendors and Foundries

Abstract

A significant portion of MEMS manufacturing technology has come from the IC industry. MEMS devices can be made using silicon wafers and the manufacturing process can incorporates semiconductor manufacturing processes such as sputtering, deposition, etching and lithography. This report analyzes the market for MEMS devices and the equipment and materials to make them.

Table of Contents

Chapter - 1: Introduction

Chapter - 2: Forecast Of The Key Applications And Markets

  • 2.1 MEMS Device Market Forecast
    • 2.1.1 Ink Jet Head
    • 2.1.2 Pressure Sensor
    • 2.1.3 Silicon Microphone
    • 2.1.4 Accelerometer
    • 2.1.5 Gyroscope
    • 2.1.6 MOEMS
    • 2.1.7 Micro Display
    • 2.1.8 Microfluidics
    • 2.1.9 RF MEMS
    • 2.1.10 Micro Fuel Cells
    • 2.1.11 Emerging Applications
  • 2.2 MEMS System Market Forecast

Chapter - 3: Markets for Equipment and Materials Suppliers

  • 3.1 Introduction
  • 3.2 MEMS Equipment Markets
    • 3.2.1 Assembly
    • 3.2.2 Bonding
    • 3.2.3 Cleaning
    • 3.2.4 Deposition
    • 3.2.5 Dicing
    • 3.2.6 Etching
    • 3.2.7 Laser Micromachining
    • 3.2.8 Lithography
    • 3.2.9 Metrology/Inspection
    • 3.2.10 Testing
    • 3.2.11 Thermal Treatment
    • 3.2.12 Wafer Thinning
  • 3.3 MEMS Material Markets
    • 3.3.1 Chemicals
    • 3.3.2 Photomasks
    • 3.3.3 Substrates

Chapter - 4: MEMS Foundries

  • 4.1 Foundry Profiles and Strategies
    • 4.1.1 Advanced Custom Sensors, Inc.
    • 4.1.2 Advanced Microsensors
    • 4.1.3 ACSI
    • 4.1.4 Alpha Tech International
    • 4.1.5 Amkor
    • 4.1.6 APM
    • 4.1.7 Applied MEMS
    • 4.1.8 Asia Pacific Microsystems
    • 4.1.9 Beijing First MEMS
    • 4.1.10 Bosch
    • 4.1.11 Branchy
    • 4.1.12 China Resoources Semiconductor
    • 4.1.13 Canadian Microelectronics Corporation (CMC)
    • 4.1.14 Chipsense
    • 4.1.15 Colibrys
    • 4.1.16 Corning Intellisense
    • 4.1.17 Cronos (subsidiary of MEMSCAP)
    • 4.1.18 C2V
    • 4.1.19 Dalsa
    • 4.1.20 Delphi Delco
    • 4.1.21 Dai-Nippon
    • 4.1.22 ELMOS
    • 4.1.23 ELume Inc.
    • 4.1.24 Haleos
    • 4.1.25 Honeywell MEMSplus
    • 4.1.26 Infineon Technologies SensoNor As
    • 4.1.27 Institute of Microelectronics
    • 4.1.28 Innovative Micro Tech
    • 4.1.29 Integrated Sensing Systems Inc. (ISSYS)
    • 4.1.30 Intelligent Micro Patterning
    • 4.1.31 Jazz Semiconductor
    • 4.1.32 Kionix, New York
    • 4.1.33 LioniX
    • 4.1.34 MEMS Engineering and Material
    • 4.1.35 MEMSCAP
    • 4.1.36 MEMSIC
    • 4.1.37 MEMS OpticalMEMStech
    • 4.1.38 Metrodyne
    • 4.1.39 MicralynemicroFAB Bremen GmbH
    • 4.1.40 Micronit Microfluidics BV
    • 4.1.41 Microbase
    • 4.1.42 Midwest MicroDevices, LLC
    • 4.1.43 MOSIS
    • 4.1.44 Nanostructures Inc
    • 4.1.45 NetMotion, Inc.
    • 4.1.46 Norcada Inc.
    • 4.1.47 Olympus Optical
    • 4.1.48 Omron
    • 4.1.49 OptiSwitch Technology Corp. (OTC)
    • 4.1.50 Prodeo Technologies Inc
    • 4.1.51 Protochips, Inc.
    • 4.1.52 Proton Mikrotechnik
    • 4.1.53 Rogue Valley Microdevices
    • 4.1.54 SEMEFAB
    • 4.1.55 Semiconductor Complex Limited
    • 4.1.56 Sanyo
    • 4.1.57 Silex Microsystems
    • 4.1.58 SiWave, Inc.
    • 4.1.59 Sony
    • 4.1.60 Sporian, Colorado STMicroelectronics
    • 4.1.61 SVTC Technologies
    • 4.1.62 Taiwan Semiconductor Manufacturing Co Ltd (TSMC)
    • 4.1.63 Touch Microsystems
    • 4.1.64 TRONICS Microsystems
    • 4.1.65 TI
    • 4.1.66 Verimetra
    • 4.1.67 Walsin Lihwa
    • 4.1.68 X-Fab
    • 4.1.69 Yokogawa
  • 4.2 Segmentation of MEMS foundries

Chapter - 5: Factors for Foundry Success

  • 5.1.1 Achieving Economies Of Scale
  • 5.1.2 Competitive Advantages
  • 5.1.3 Core Strengths
  • 5.1.4 Employee Commitment
  • 5.1.5 Expansion Plans
  • 5.1.6 Financial Objectives:
  • 5.1.7 Groundbreaking MEMS Solutions
  • 5.1.8 In- House Expertise in MEMS Testing And Reliability
  • 5.1.9 Leadership in Technology
  • 5.1.10 1Manufacturing Excellence
  • 5.1.11 Manufacturing Process
  • 5.1.12 Mastering Process and Production Technology
  • 5.1.13 Patent Protection
  • 5.1.14 Partnerships
  • 5.1.15 Products
  • 5.1.16 Proprietary Development Processes
  • 5.1.17 Sales Organization
  • 5.1.18 Sales Process and Customer Base
  • 5.1.19 Strong Customer Relations
  • 5.1.20 Vision and Goal

Chapter - 6: Critical MEMS Issues

  • 6.1 3-D Interconnects and Packaging
  • 6.2 Wafer Size
  • 6.3 MEMS Testing
  • 6.4 Opportunities For Fabless MEMS Companies

LIST OF TABLES

  • 2.1 Ink Jet Head Sales Forecast 2007-2012
  • 2.2 Pressure Sensor Sales Forecast 2007-2012
  • 2.3 Automotive Inertial Sensors Sales Forecast 2007-2012
  • 2.4 Automotive Pressure Sensors Sales Forecast 2007-2012
  • 2.5 Automotive Flow Sensors Sales Forecast 2007-2012
  • 2.6 Automotive IR Sensors Sales Forecast 2007-2012
  • 2.7 Silicon Microphone Sales Forecast 2007-2012
  • 2.8 Accelerometer Sales Forecast 2007-2012
  • 2.9 Gyroscope Sales Forecast 2007-2012
  • 2.1 MOEMS Sales Forecast 2007-2012
  • 2.11 Micro Display Sales Forecast 2007-2012
  • 2.12 Microfluidics Sales Forecast 2007-2012
  • 2.13 RF MEMS Sales Forecast 2007-2012
  • 2.14 Micro Fuel Cells Sales Forecast 2007-2012
  • 2.15 Emerging Applications Sales Forecast 2007-2012
  • 3.1 Assembly Equipment Sales Forecast 2007-2012
  • 3.2 Bonding Equipment Sales Forecast 2007-2012
  • 3.3 Cleaning Equipment Sales Forecast 2007-2012
  • 3.4 Deposition Equipment Sales Forecast 2007-2012
  • 3.5 Dicing Equipment Sales Forecast 2007-2012
  • 3.6 Etching Equipment Sales Forecast 2007-2012
  • 3.7 Laser Micromachining Equipment Sales Forecast 2007-2012
  • 3.8 Lithography Equipment Sales Forecast 2007-2012
  • 3.9 Metrology/Inspection Equipment Sales Forecast 2007-2012
  • 3.1 Testing Equipment Sales Forecast 2007-2012
  • 3.11 Thermal Treatment Equipment Sales Forecast 2007-2012
  • 3.12 Wafer Thinning Equipment Sales Forecast 2007-2012
  • 3.13 Chemicals Sales Forecast 2007-2012
  • 3.14 Photomasks Sales Forecast 2007-2012
  • 3.15 Substrates Sales Forecast 2007-2012
  • 4.1 Ranking Of Top MEMS Foundries
  • 6.1 Forecast of Wafer Size

LIST OF FIGURES

  • 2.1 MEMS Markets (2007-2012)
  • 2.2 MEMS System Sales Forecast 2007-2012
  • 3.1 Discrete Assembly of MEMS
  • 6-1 Process For Capping Mems
  • 6-2 Examples Of Thermoplastic Cavity Packages
  • 6-3 Fluidic Packaging System
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