The Worldwide Motherboard Application IC Market, 1Q 2013

Introduction

Abstract

This research report presents forecast and recent quarter review of the worldwide motherboard application IC market. The report includes motherboard shipment volume and breakdowns by CPU supplier, CPU connector type, chipset supplier, and chipset type. The content of this report is based on primary data obtained through interviews with motherboard component makers. This report finds that the industry's shipment volume posted a sequential growth but a year-on-year decline in the third quarter of 2012. Regarding CPU connector type, it is observed that the Socket 2011 is gradually replacing Socket 1366 since its launch in the fourth quarter of 2011. It is projected that the worldwide motherboard shipment volume will begin to drop sequentially in the fourth quarter of 2012, and will continue to be on the decline in the first and second quarter of 2013.

Table of Contents

Table of Contents

• Worldwide Motherboard Shipment Volume, 3Q 2010 - 2Q 2013
• Worldwide Motherboard Shipment Volume by CPU Supplier, 3Q 2010 - 2Q 2012
• Worldwide Motherboard Shipment Share by CPU Supplier, 3Q 2010 - 2Q 2012
• Worldwide Motherboard Shipment Volume by CPU Connector Type, 3Q 2010 - 2Q 2012
• Worldwide Motherboard Shipment Share by CPU Connector Type, 3Q 2010 - 2Q 2012
• Worldwide Motherboard Shipment Volume by Chipset Supplier, 3Q 2010 - 2Q 2012
• Worldwide Motherboard Shipment Share by Chipset Supplier, 3Q 2010 - 2Q 2012
• Worldwide Motherboard Shipment Volume by Chipset Type, 3Q 2010 - 2Q 2012
• Worldwide Motherboard Shipment Share by Chipset Type, 3Q 2010 - 2Q 2012
• Intelligence Insight
• Research Scope & Definitions

The Worldwide Motherboard Application IC Market, 1Q 2013 published by Market Intelligence & Consulting Institute (MIC) in April 24, 2013. This report consists of 17 Pages and the price starts from US $ 1750.

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