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The Worldwide Motherboard Application IC Market, 3Q 2013

This research report presents forecast and recent quarter review of the worldwide motherboard application IC market. The report includes motherboard shipment volume and breakdowns by CPU supplier, CPU connector type, chipset supplier, and chipset type. The content of this report is based on primary data obtained through interviews with motherboard component makers. This report finds that the industry's shipment volume is anticipated to peak at around 36.3 million units in the third quarter of 2013, up 8.0% sequentially. However, it is projected that the industry's shipment volume will begin to dwindle sequentially in the fourth quarter of 2013, and will continue its decline in the first half of 2014.

Table of Contents

  • Worldwide Motherboard Shipment Volume, 3Q 2011 - 2Q 2014
  • Worldwide Motherboard Shipment Volume by CPU Supplier, 3Q 2011 - 2Q 2013
  • Worldwide Motherboard Shipment Share by CPU Supplier, 3Q 2011 - 2Q 2013
  • Worldwide Motherboard Shipment Volume by CPU Connector Type, 3Q 2011 - 2Q 2013
  • Worldwide Motherboard Shipment Share by CPU Connector Type, 3Q 2011 - 2Q 2013
  • Worldwide Motherboard Shipment Volume by Chipset Supplier, 3Q 2011 - 2Q 2013
  • Worldwide Motherboard Shipment Share by Chipset Supplier, 3Q 2011 - 2Q 2013
  • Worldwide Motherboard Shipment Volume by Chipset Type, 3Q 2011 - 2Q 2013
  • Worldwide Motherboard Shipment Share by Chipset Type, 3Q 2011 - 2Q 2013
  • Research Scope & Definitions
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