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Market Research Report

Current Status and Development of Chinese Mobile Phone IC Design Houses

Published by Market Intelligence & Consulting Institute (MIC)
Published October, 2007 Product code 57866
Content info 23 pages
Price
US $ 1860 PDF by E-mail (Single User License)
US $ 3720 PDF By E-mail (2-100 User License)
US $ 4650 PDF By E-mail (100+ User License)


Current Status and Development of Chinese Mobile Phone IC Design Houses published by Market Intelligence & Consulting Institute (MIC) in October, 2007. This report consists of 23 pages and the price starts from US $ 1860.

Introduction

Abstract

With strong domestic demand and support from the Chinese government, Chinese mobile phone IC design houses such as Spreadtrum, Vimicro, and RDA have seen substantial growth and expanded from value-line multimedia applications to baseband and RFIC designs. This report analyzes the current status and development of Chinese mobile phone IC design houses.

Table of Contents

List of Topics

Current status and development of mobile phone IC design houses based in China, covering baseband IC providers and developers, RFIC designers, as well as multimedia application processor IC designers; analysis of respective product portfolios and clienteles.

  • Industry Overview
  • Baseband IC Design Houses
    • Spreadtrum
    • T3G
    • Commit
    • Other Baseband-Related Companies
  • RFIC Design Houses
    • RDA Microelectronics
    • Comlent
    • Rising Micro-Electronics
    • SWID
  • Multimedia Application Processor IC Design Houses
    • Vimicro
    • Fangtek
    • Chipnuts
    • Anyka
    • Shanghai Jade Tech
  • MIC Perspective
  • Appendix

ADI, Agere Systems, Akkord, Amoi, Anyka, ARM, ASAT Holdings, ASE, Beijing Huahong IC Design, BenQ, Bird, Broadcom, CATT, CECT, CEVA, China Netcom, Chipnuts, Chongqing Chongyou Information Technology, Chongqing University of Posts and Telecommunication, Comlent, Commit, Datang Mobile, Datang Xinwei , DC Wireless, DFI, EMP, Fangtek, Freescale, Fujitsu, Haier, Hisense, Hongtaili, HP, Huizhou Qiao Xing Celbon Communication Technology, Hynix, Infineon, Inventec, JAZZ, Kesheng, Konka, Kyocera, Lenovo, LG, LSI, Maxim, MediaTek, Microsoft, Motorola, Nokia, NXP, OKI, Pantech, Philips, Potevio, Qualcomm, RDA Microelectronics, RFMD, Rising Micro Electronics, ROHM, Samsung, Sendo, Shanghai Jade Tech, Skyworks, SMIC, Spreadtrum, STC, SWID, Synopsys, T3G, TCL, TechFaith,TI, Tianwei, Tonieco, TSMC, UTAC, Vimicro, Yamaha, ZTE

List of Tables

  • Table 1 Other Chinese Mobile Phone Baseband IC Developers
  • Table 2 RDA' s Product Lines
  • Table 3 Comlent' s Product Lines
  • Table 4 Vimicro' s Series 8 Products for Mobile Phones
  • Table 5 Chipnuts' Single-chip Coprocessor Products
  • Table 6 Anyka' s Mobile Phone IC Products

List of Figures

  • Figure 1 T3G' s TD-SCDMA IC Design Projects
  • Figure 2 Fangtek' s Product Roadmap
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