ICs with Multiple Wireless Functionality - 2009 Edition

ICs with Multiple Wireless Functionality - 2009 Edition published by IMS Research in April, 2009. This report consists of 150 PAGES (including 41 tables and 33 figures) and the price starts from US $ 6120.

Introduction

Description

ICs with multiple wireless functionality (combination ICs) are increasingly seen as a means of enabling end-equipment manufacturers to include additional functionality within their devices, with reduced cost, silicon size and power requirements, and without the coexistence issues commonly associated with the use of multiple standalone wireless ICs. This is the second edition of the report ‘ICs with Multiple Wireless Functionality - World Market' . This report includes over 60 tables and figures, with market estimates and forecasts for 9 key combination ICs from 2008-2013 (including ASPs and revenues), along with forecasts for the size of eight key markets for combination ICs.

Combination ICs forecast within this report include:

• Bluetooth/FM
• Bluetooth/GPS
• Bluetooth/FM/GPS
• Bluetooth/WLAN
• Bluetooth/FM/WLAN
• Bluetooth/FM/WLAN/GPS
• Bluetooth/WLAN/GPS
• Bluetooth/FM/GPS/NFC
• Bluetooth/FM/WLAN/NFC

The report also provides forecasts for Bluetooth low energy, Bluetooth high speed over 802.11 and Bluetooth high speed over UWB in combination ICs. Forecasts of the key combination ICs (along with the Bluetooth breakdowns) are provided for the following end-device markets:

• Smartphones
• Feature Rich Handsets
• Basic Feature Handsets
• Laptop PCs
• Digital Cameras
• Personal Navigation Devices
• Personal Media Players
• Portable Gaming Devices
• Fixed Gaming Devices
• Add-in Cards & Dongles

• Pages: 150
• Tables: 41
• Figures: 33

Chapter 1 - Introduction, Scope and Methodology

Chapter 2 - Technology Review

• 2.0 Introduction
  • 2.1 Bluetooth Technology
    • 2.1.1 Introduction
    • 2.1.2 Technical Specification
    • 2.1.3 Standards Evolution
    • 2.1.4 Markets served with Classic Bluetooth
  • 2.2 Bluetooth high speed
    • 2.2.1 Introduction
    • 2.2.2 Specification and Standards Evolution
    • 2.2.3 Markets served by Bluetooth hs
  • 2.3 Bluetooth low energy
    • 2.3.1 Introduction
    • 2.3.2 Bluetooth low energy Specification
    • 2.3.3 Standards Evolution
    • 2.3.4 Markets served by Bluetooth LE
  • 2.4 WLAN
    • 2.4.1 Introduction
    • 2.4.2 Specification and Standards Evolution
    • 2.4.3 Markets served with WLAN
  • 2.5 UWB
    • 2.5.1 Introduction
    • 2.5.2 Technical Specification
    • 2.5.3 Standards Evolution
    • 2.5.4 Markets Served with UWB
  • 2.6 GPS
    • 2.6.1 Introduction
    • 2.6.2 Technical Specification
    • 2.6.3 Standards Evolution
    • 2.6.4 Markets served with GPS
  • 2.7 NFC
    • 2.7.1 Introduction
    • 2.7.2 Technical Specification
    • 2.7.3 Standards Evolution
    • 2.7.4 Markets served with NFC
  • 2.8 Combination ICs
    • 2.8.1 Advantages of Combination ICs
    • 2.8.2 Disadvantages of Combination ICs

Chapter 3 - Competitive Environment and Supplier Industry

• 3.0 Introduction
  • 3.1 Competitive Environment
    • 3.1.1 Introduction
    • 3.1.2 Impact of Current Global Economic Situation
    • 3.1.3 Converged Future - Competitive Environment
  • 3.2 Summary of Technologies Addressed
  • 3.3 Summary of Standards/Industry Body Involvement
  • 3.4 Alereon
  • 3.5 Atheros
  • 3.6 AzureWave Technologies
  • 3.7 Broadcom
  • 3.8 CSR
  • 3.9 GCT Semiconductor
  • 3.10 Infineon
  • 3.11 Intel Corporation
  • 3.12 Laird Technologies
  • 3.13 Marvell
  • 3.14 Qualcomm
  • 3.15 Renesas Technology Corporation
  • 3.16 SiGe Semiconductor, Inc.
  • 3.17 SiRF Technology, Inc.
  • 3.18 ST-Ericsson
  • 3.19 Staccato
  • 3.20 Stonestreet One
  • 3.21 TDK Electronics
  • 3.22 Texas Instruments
  • 3.23 U-Blox
  • 3.24 Wipro
  • 3.25 Wisair

Chapter 4 - Market Forecasts and Analysis

• 4.0 Introduction
  • 4.1 Combination IC Forecasts
    • 4.1.1 Introduction
    • 4.1.2 Bluetooth Shipment Volumes
    • 4.1.3 Combination IC Shipment Volumes and Revenues
  • 4.2 Combination IC Forecasts by Application
    • 4.2.1 Cellular Handsets
      • 4.2.1.1 Wireless Technologies in Cellular Handsets
      • 4.2.1.2 Key Drivers/Barriers for Combination ICs in Cellular Handsets
      • 4.2.1.3 Market Forecasts and Assumptions
    • 4.2.2 Digital Cameras
      • 4.2.2.1 Wireless Technologies in Digital Cameras
      • 4.2.2.2 Key Drivers/Barriers for Combination ICs in Digital Cameras
      • 4.2.2.3 Market Forecasts and Assumptions
    • 4.2.3 Laptop PCs
      • 4.2.3.1 Wireless Technologies in Laptop PCs
      • 4.2.3.2 Key Drivers/Barriers for Combination ICs in Laptop PCs
      • 4.2.3.3 Market Forecasts and Assumptions
    • 4.2.4 Personal Media Players (PMPs)
      • 4.2.4.1 Wireless Technologies in PMPs
      • 4.2.4.2 Key Drivers/Barriers for Combination ICs in PMPs
      • 4.2.4.3 Market Forecasts and Assumptions
    • 4.2.5 Personal Navigation Devices (PNDs)
      • 4.2.5.1 Wireless Technologies in PNDs
      • 4.2.5.2 Key Drivers/Barriers for Combination ICs in PNDs
      • 4.2.5.3 Market Forecasts and Assumptions
    • 4.2.6 Add-in Cards and Dongles
      • 4.2.6.1 Wireless Technologies in Add-in Cards and Dongles
      • 4.2.6.2 Key Drivers/Barriers for Combination ICs in Add-in Cards and Dongles
      • 4.2.6.3 Market Forecasts and Assumptions
    • 4.2.7 Gaming Devices
    • 4.2.7.1 Wireless Technology in Gaming
    • 4.2.7.2 Key Drivers/Barriers for Combination ICs in Gaming
    • 4.2.7.3 Market Forecasts and Assumptions

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