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Substrates and Encapsulation for BIPV

Abstract

Summary

This report identifies the opportunities for encapsulation and substrate materials and systems in the emerging building-integrated PV (BIPV) market. NanoMarkets believes that the BIPV sector will be the fastest growing part of the solar industry in the next decade, but that demand patterns for encapsulation and substrate materials from this sector will be different from the traditional PV industry.

Even though glass will be the most widely used material for both encapsulation and substrates in the BIPV sector, special coatings may be required as the result of the use of novel absorber materials in BIPV. In addition, NanoMarkets believes that in the emerging BIPV market there will be a considerable trend toward flexible PV because of its ability to offer lightweight installation and improved aesthetics. On the one hand this means new opportunities for suppliers of special metal substrates. But it will also require cost effective flexible encapsulation systems.

With all this in mind, in this report, NanoMarkets quantifies the new business revenues that will be generated by novel substrates in the BIPV sector as well as by advanced multi-layer encapsulation systems, including the new breed of encapsulation system that makes use of atomic layer deposition (ALD). The report also discusses how, as monolithic integration becomes more common in BIPV, specialist encapsulation systems will be required to protect the relatively delicate CIGS, OPV and DSC absorber materials that will be used in such products.

Finally, the report takes a look at how the leading suppliers of encapsulation products are viewing BIPV as a market for their products. In addition, this report includes a granular eight-year forecast of the BIPV encapsulation and substrate markets in volume and value terms.

Table of Contents

Executive Summary

  • E.1 Emerging Opportunities for Rigid BIPV Encapsulation?
    • E.1.1 Glass Will Continue to Dominate
    • E.1.2 Advanced Encapsulation Systems Will Increasingly be Needed
  • E.2 What Changes in Demand for Flexible BIPV Encapsulation Will Occur in the Next Five Years?
    • E.2.1 The Growing Importance of Atomic Layer Deposition
    • E.2.2 Trends Towards Advanced Substrates
  • E.3 Future Trends and Opportunities in BIPV Glass Encapsulation
  • E.4 Niche Opportunities for Encapsulating CIGS, OPV, and DSC BIPV products
  • E.5 Key Firms to Watch
    • E.5.1 Glass Firms
    • E.5.2 Multilayer and ALD Barrier Firms
  • E.6 Reducing Costs and Creating Value in BIPV with Encapsulation Technology
  • E.7 Summary of the Eight-Year Forecasts of Encapsulation and Substrate Materials for BIPV
    • E.7.1 Rigid BIPV Substrates and Encapsulation
    • E.7.2 Flexible BIPV Encapsulation and Substrates
    • E.7.3 BIPV Glass Encapsulation and Substrates

Chapter One: Introduction

  • 1.1 Background to this Report
    • 1.1.1 Flexible Module Encapsulation Opportunities
    • 1.1.2 Rigid Module Encapsulation Opportunities
  • 1.2 Objectives and Scope of this Report
  • 1.3 Methodology of this Report
  • 1.4 Plan of this Report

Chapter Two: Current and Evolving Encapsulation Technologies for BIPV Markets

  • 2.1 Alternatives to Glass Encapsulation: Metals and Polymers
    • 2.1.1 Polymer Films: How Costs Can Come Down
    • 2.1.2 Metal Options: Steel and Aluminum
    • 2.1.3 Ceramic Films: Advantages and Disadvantages
  • 2.2 Flexible Encapsulants for BIPV
  • 2.3 The Dyad Option: Best of Both Worlds, But at What Cost?
  • 2.4 The Special Needs of CIGS and OPV/DSC BIPV
    • 2.4.1 CIGS and OPV/DSC in BIPV
    • 2.4.2 Current and Future Encapsulation Trends in CIGS and OPV/DSC BIPV
  • 2.5 Key Points Made in this Chapter

Chapter Three: Current and Evolving Encapsulation Technologies for BIPV Markets

  • 3.1 The Limits of Glass Encapsulation for BIPV
    • 3.1.1 Changing Requirements for Rigid BIPV Encapsulation
    • 3.1.2 Changing Requirements for Flexible BIPV Encapsulation
    • 3.1.3 Changing Requirements for BIPV Glass Encapsulation
  • 3.2 New Opportunities for Glass in BIPV Encapsulation
    • 3.2.1 Opportunities for Flexible Glass in BIPV
  • 3.3 The Future of Plastic Film and Other Advanced Encapsulation Systems in BIPV
  • 3.4 Encapsulation of BIPV on Sheet Steel and Aluminum
  • 3.5 Encapsulation of BIPV on Other Roofing and Siding Materials
  • 3.6 A Roadmap for Encapsulation in BIPV
  • 3.7 Key Points Made in this Chapter

Chapter Four: Eight-Year Forecasts of Encapsulation and Substrate Markets for Building Integrated Photovoltaics

  • 4.1 Forecasting Methodology
    • 4.1.1 Information Sources
    • 4.1.2 Scope of the Forecast
  • 4.2 Forecasts for BIPV Substrates and Encapsulation
    • 4.2.1 Forecast for Rigid BIPV Module Substrates
    • 4.2.2 Forecast for Rigid BIPV Module Encapsulation
    • 4.2.3 Forecast for Flexible BIPV Module Substrates
    • 4.2.4 Forecast for Flexible BIPV Module Encapsulation
    • 4.2.5 Forecasts of BIPV Glass Substrates and Encapsulation
  • 4.3 Summary of Forecasts
  • Acronyms and Abbreviations Used In this Report
  • About the Author

List of Exhibits

  • Exhibit E-1: Total BIPV Substrate and Encapsulant Revenues by BIPV Module Type
  • Exhibit 4-1: Substrate Materials for Crystalline Silicon Rigid BIPV Cells
  • Exhibit 4-2: Cost for Substrates Used in PV ($ per square meter)
  • Exhibit 4-3: Substrate Materials for TF-Si Rigid BIPV Cells
  • Exhibit 4-4: Substrate Materials for TF CdTe Rigid BIPV Cells
  • Exhibit 4-5: Substrate Materials for TF CIGS Rigid BIPV Cells
  • Exhibit 4-6: Substrate Materials for TF OPV/DSC Rigid BIPV Cells
  • Exhibit 4-7: Total Rigid BIPV Substrate Material Revenues by Material Type
  • Exhibit 4-8: Encapsulation Materials for Rigid BIPV c-Si PV Cells
  • Exhibit 4-9: Encapsulation Materials for Rigid BIPV Thin-Film Si PV Cells
  • Exhibit 4-10: Encapsulation Materials for Rigid BIPV CdTe PV Cells
  • Exhibit 4-11: Encapsulation Materials for Rigid BIPV CIGS PV Cells
  • Exhibit 4-12: Encapsulation Materials for Rigid BIPV OPV/DSC PV Cells
  • Exhibit 4-13: Total Rigid BIPV Encapsulation Material Revenues by Material Type
  • Exhibit 4-14: Substrate Materials for TF Si Flexible BIPV Cells
  • Exhibit 4-15: Substrate Materials for TF CdTe Flexible BIPV Cells
  • Exhibit 4-16: Substrate Materials for TF CIGS Flexible BIPV Cells
  • Exhibit 4-17: Substrate Materials for TF OPV/DSC Flexible BIPV Cells
  • Exhibit 4-18: Total flexible BIPV Substrate Material Revenues by Material Type
  • Exhibit 4-19: Total Flexible BIPV Encapsulation Material Revenues by Material Type
  • Exhibit 4-20: Substrate Materials for BIPV Glass Cells by Absorber Type
  • Exhibit 4-21: Encapsulation Materials for BIPV Glass c-Si PV Cells
  • Exhibit 4-22: Encapsulation Materials for BIPV Glass Thin-Film Si PV Cells
  • Exhibit 4-23: Encapsulation Materials for BIPV Glass CdTe PV Cells
  • Exhibit 4-24: Encapsulation Materials for BIPV Glass CIGS PV Cells
  • Exhibit 4-25: Encapsulation Materials for BIPV Glass OPV/DSC PV Cells
  • Exhibit 4-26: Total BIPV Glass Encapsulation Material Revenues by Material Type
  • Exhibit 4-27: Total BIPV Substrate and Encapsulation Revenue by BIPV Module Type
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