The Future of Organic Electronics Manufacturing

The Future of Organic Electronics Manufacturing published by NanoMarkets in January, 2009. This report consists of 115 Pages and the price starts from US $ 995.

Introduction

Abstract

This report examines the evolving set of printing and deposition technologies that are being redesigned for an organic electronics environment; ink-jet and organic vapor deposition, for example. It also analyzes the various manufacturing technologies that organic electronics firms are utilizing now and how well they are performing. Its product coverage ranges from emerging areas such as polymer memories to relatively established areas such as OLEDs, and it is especially focused on how the lessons in the established OLED plants are being extended to organic electronics more generally. A five-year capacity forecast is included in this report that is based on breakouts by type of manufacturing technology utilized and the type of device manufactured. We also profile the activities of firms and research groups that have developed novel equipment to meet the thermal and environmental needs of organic electronics materials.

Table of Contents

Executive Summary

• E.1 Summary of Organic Manufacturing Methods
  • E.1.1 Printing vs. Blanket Deposition
  • E.1.2 Major Deposition Methods
  • E.1.3 Major Device Categories and Requirements
• E.2 Opportunities for Equipment Producers
• E.3 Opportunities for Materials Suppliers
• E.4 Major Equipment Suppliers
• E.5 Summary of Capacity Forecasts for Organic Electronics

Chapter One: Introduction

• 1.1 Background to this Report
  • 1.1.1 Perspective #1: Availability of Equipment
  • 1.1.2 Perspective #2: Availability of Materials
  • 1.1.3 Perspective #3: Device and Process Readiness
  • 1.1.4 Perspective #4: Market Readiness
• 1.2 Objectives and Scope
• 1.3 Methodology
• 1.4 Plan of this Report

Chapter Two: Key Manufacturing Trends in Organic Electronics

• 2.1 Current and Future Manufacturing Technologies for Organic Electronics
  • 2.1.1 Classical and Novel Vapor Deposition Techniques
  • 2.1.2 Printing
  • 2.1.3 Patterning Techniques
  • 2.1.4 Other Relevant Techniques
  • 2.1.5 Note on Crystallinity
• 2.2 Manufacturing Requirements by Product Category
  • 2.2.1 OLED
  • 2.2.2 Organic Thin Film Transistors
  • 2.2.3 Organic Photovoltaics
  • 2.2.4 Organic Photodetectors
• 2.3 Enhancement of Stability
• 2.4 Key Points Made in This Chapter

Chapter Three: Organic Electronics Manufacturing Technologies

• 3.1 Introduction
• 3.2 OLEDs
  • 3.2.1 Evaporated Small Molecule (Kodak and UDC)
  • 3.2.2 Small Molecule Solution Processing (DuPont)
  • 3.2.3 Printed Polymer (CDT/Sumitomo)
  • 3.2.4 Roll-to-Roll Polymer (GE)
  • 3.2.5 Market Context, Competition
• 3.3 OTFT
  • 3.3.1 Pentacene-OLED Backplane (Sony)
  • 3.3.2 Pentacene-E-Paper Backplane (Polymer Vision)
  • 3.3.3 Printed Polymer-E Paper Backplane (Plastic Logic)
  • 3.3.4 Printed Organic RFID Chips (PolyIC, IMEC)
  • 3.3.5 Other Processes (Infineon, 3M, ORFID, etc.)
  • 3.3.6 Notes on Stability
  • 3.3.7 Competitors to OTFTs by Target Market Application
• 3.4 Solar Cells
  • 3.4.1 Printed Bulk Heterojunction (Konarka)
  • 3.4.2 Transparent Cell Technology (Solarmer)
  • 3.4.3 Printed Dye Solar Cells (G24i)
  • 3.4.4 Market Risk and Competitors
• 3.5 Photodetectors and Sensors
  • 3.5.1 X-Ray Detector (Siemens)
  • 3.5.2 Printed Biodetector (NANOIDENT)
  • 3.5.3 PARC
  • 3.6 Specialized Materials
  • 3.6.1 Substrates
  • 3.6.2 Semiconductors
  • 3.6.3 Barrier Materials
• 3.7 Equipment
  • 3.7.1 Generic Equipment
  • 3.7.2 Printers
• 3.8 Key Points Made in this Chapter

Chapter Four: Organic Semiconductor-Based Device Capacity Forecasts

• 4.1 Introduction and Forecasting Methodology
  • 4.1.1 Forecasting Capacity
  • 4.1.2 Forecasting Equipment
  • 4.1.3 Changes from Previous NanoMarkets Reports
  • 4.1.4 Data Sources
• 4.2 Eight-year Capacity Forecasts by Type of Device Produced
  • 4.2.1 Organic Light Emitting Diodes (OLEDs)
  • 4.2.2 Organic Thin-Film Transistors (OTFTs)
  • 4.2.3 Organic Photovoltaics (OPVs)
  • 4.2.4 Organic Photodetectors and Sensors (OPDs)
• 4.3 Eight-year Equipment Forecasts by Type of Device Produced
  • 4.3.1 Methodology
  • 4.3.2 OLED
  • 4.3.3 OTFT
  • 4.3.4 OPV
  • 4.3.5 OPD
• 4.4 Eight-year Capacity Forecasts by Type of Manufacturing Equipment Used
• Abbreviations and Acronyms Used in This Report

List of Exhibits

• Exhibit E-1: Worldwide Organic Manufacturing Capacity (million sq.meters/yr)
• Exhibit E-2: Worldwide Organic Manufacturing Equipment Outlay ($ millions/yr)
• Exhibit 4-1: Worldwide OLED Capacity
• Exhibit 4-2: Worldwide Capacity for OTFT-Based Backplanes
• Exhibit 4-3: Worldwide Capacity for OTFT-Based RFID
• Exhibit 4-4: Worldwide Capacity for OTFT-Based Backplanes and RFID
• Exhibit 4-5: Worldwide Capacity for OPV- and DSC- Based Solar
• Exhibit 4-6: Worldwide OPD Device Capacity
• Exhibit 4-7: OLED Display Process Comparison*
• Exhibit 4-8: Unit Operations Capacity Costs (US$ per square meter per year annual capacity)
• Exhibit 4-9: Capacity Demand for Benchmark Devices by Unit Operation
• Exhibit 4-10: Equipment Costs by Device (US$ per square meter per annual capacity)
• Exhibit 4-11: OLED Display Capital Expenditure
• Exhibit 4-12: OLED Lighting Capital Expenditure
• Exhibit 4-13: OTFT-based Backplanes Capital Expenditure
• Exhibit 4-14: OTFT-based RFID Capital Expenditure
• Exhibit 4-15: Worldwide OPV and DSC Capital Expenditure
• Exhibit 4-16: Worldwide Capacity by Equipment Type (Millions m2/yr)
• Exhibit 4-17: Worldwide Capital Expenditure by Equipment Type ($ Millions/yr)
• Exhibit 4-18: Worldwide Organic Manufacturing Capacity (million square meters/yr)
• Exhibit 4-19: Worldwide Organic Manufacturing Equipment Outlay ($ millions/yr)

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