Market Research Report - 234294
The Worldwide Semiconductor and Manufacturing Assembly Markets - 2012 Edition
|Published by||New Venture Research|
|Published||Content info||32 Pages|
|The Worldwide Semiconductor and Manufacturing Assembly Markets - 2012 Edition|
|Published: February 28, 2012||Content info: 32 Pages||
A Unique Database of the Semiconductor and PCB Manufacturing Assembly Value for 47 Unique Product Applications, Forecasted from 2011 - 2016
The Worldwide Semiconductor and Manufacturing Assembly Markets - 2012 Edition is a special report consisting of an Excel database and Word document discussion. The report examines the total assembly costs of 47 different electronics products starting with their semiconductor value, non-IC related costs, assembly of printed circuit board (PCB) and final box assembly. As such, it provides a unique understanding of the total cost of goods sold (COGS) for leading electronics products. New Venture Research (NVR) has followed the electronics assembly industry for over 20 years with numerous research reports that focus on semiconductor packaging, printed circuit board assembly, as well as the EMS subcontracting markets. This latest report, The Worldwide Semiconductor and Manufacturing Assembly Markets - 2012 Edition, is designed to help our customers understand the true cost of electronics manufacturing within seven critical electronics market segments including:
Within these seven market segments are 47 unique product categories (detailed next page) that are quantified for their electronics assembly value. The following production data is provided for each individual product category in terms of units shipped, average selling prices (ASPs), and assembly revenue:
A separate Word document provides a discussion of each market segment, leading and emerging products, and dominant trends. High growth products are examined for their market leadership and impact on the semiconductor, PCB and Box assembly markets.
The Worldwide Semiconductor and Manufacturing Assembly Markets - 2012 Edition will provide the critical information you need to understand electronics COGS assembly. The Excel and Word files are delivered by email with a singleuser license priced at $2,995. An extra single user license is $250 and a corporate license is $1000.
Randall Sherman is the president and principal analyst of New Venture Research Corp., a technology market research and business consulting firm focused on the EMS and OEM electronics manufacturing industries. Mr. Sherman has more than 25 years' experience in technology and business research. He began his career as a telecom network design engineer and holds an undergraduate degree in Astrophysics. He has held senior positions at various market research firms, including Creative Strategies, Frost and Sullivan, and BIS Strategic Decisions. Mr. Sherman performed his undergraduate work in Astrophysics and holds an MSEE from the University of Colorado and an MBA from the Edinburgh School of Business.