Market Research Report

The Worldwide IC Packaging Market, 2013 Edition

cover Published by New Venture Research
Published Product code 242228
Content info 425 Pages
Price
Not Available

This publication has been discontinued on May 14, 2013.

Introduction

The Most Comprehensive Report Available
On The Global IC Packaging Industry

Synopsis

While the integrated circuit (IC) market tends to be cyclical in nature, the general trend is for more Ics to be integrated into more products over time. While military was once the main driver of electronics, currently the market is being driven by demand for handheld consumer devices and the adjoining infrastructure. The automobile industry is also gaining steam, and vehicles are laden with semiconductor devices.

A year of unprecedented growth in 2010 (IC revenue grew 40.6% while units expanded 35.5%) followed the worst economic downturn since the great depression. The year 2012 saw a softening in the market, which is typical of U.S. Presidential election years. A steady climb is anticipated in the market for 2013 and beyond, although economic uncertainty in Europe and developments in unrest in the Middle East could hamper growth.

New Venture Research (NVR), in the 2013 Edition of ‘The Worldwide IC Packaging Market’, analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market. The report begins with an economic and industry overview, and historic and future unit and revenue graphs.

IC Unit Shipments(B)

Following this high-level review, the report presents forecasts for each semiconductor product type, and segments these products by package family and I/O count range. Packaging revenue figures are displayed for each segment, based on prices charged in the outsourced assembly and test (OSAT) market. The package families are then rolled up by I/O count and semiconductor product. In doing so, the report generates the total value of the IC packaging industry.

Next, the report presents NVR's continuing, extensive coverage of the OSAT market. OSATs will continue to assume a larger share of the world's IC packaging business. The report breaks the OSAT market down by package families and major product categories providing units and revenue for each category. To help you further assess this group of companies, the report profiles the activities of the world's largest OSAT companies and the packages they offer.

‘The Worldwide IC Packaging Market’, 2013 Edition continues NVR's leadership position in assessing the status and future of IC packaging.

Report Highlights

  • Industry Overview
    • Economic Overview
    • Semiconductor Industry Analysis
  • Worldwide IC Packaging Market Forecasts, 2011-2017
    • Units
    • Package Prices
    • Packaging Revenue
    • By Semiconductor Product
    • By Package Family
    • By I/O Range
  • OSAT IC Packaging Market Forecasts, 2011-2017
    • Units
    • Package Prices
    • Packaging Revenue
    • Competitive Rankings
    • Company Profiles

About the Author

Sandra L Winkler has been an industry analyst beginning in 1988, and since 1995, a staff member of Electronic Trend Publications, currently New Venture Research. She has produced numerous off-the-shelf and custom reports. Ms. Winkler began her analyst career in the telecommunications industry, with Frost and Sullivan. Since 1995, she has focused on the semiconductor packaging industry, and has authored more than 30 widely cited reports on the topic, including The Worldwide IC Packaging Market, Advanced IC Packaging Markets and Trends, and IC Packaging Materials. She also writes for Chip Scale Review magazine, Global SMT & Packaging News, and contributes to the IEEE/CPMT newsletter and other media. Ms. Winkler has an MBA from Santa Clara University. She is on the executive planning committee of the IEEE/CPMT Santa Clara Valley chapter, and serves as Luncheon Program Chair.

About New Venture Research

New Venture Research Corp. (NVR) was established in 1988 to provide advanced business research services for the high technology electronics sector.

NVR is a global provider of business intelligence, growth management and advisory services to companies in the information technology, telecommunications, consumer, scientific instrumentation and advanced electronics markets.

Table of Contents

Table of Contents

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: The State of the Industry

  • Economic Overview
  • Industry Overview

Chapter 4: IC Package Forecast by Product

Device Types:Package Types:I/O Count:
  • MPU
  • MCU
  • DSP
  • DRAM
  • Flash
  • SRAM
  • ROM/EPROM
  • EEPROM/Other
  • Digital Bipolar
  • Standard Logic
  • Gate Arrays
  • Standard Cell/PLD
  • Display Drivers
  • DIP
  • SOT
  • SO
  • TSOP
  • DFN
  • CC
  • QFP
  • QFN
  • PGA
  • BGA
  • FBGA
  • WLP
  • DCA
  • 004-018
  • 020-032
  • 034-100
  • 104-304
  • 308-999
  • 1,000 +
  • Special Purpose Logic and Analog - All Segments

Chapter 5: IC Package Forecast by Package Family

IC Package Forecast by Package Family

  • DIP
  • SOT
  • SO
  • TSOP
  • DFN
  • CC
  • QFP
  • QFN
  • PGA
  • BGA
  • FBGA
  • WLP
  • DCA

I/O Count Range

  • 004-018
  • 020-032
  • 034-100
  • 104-304
  • 308-999
  • 1,000+

Chapter 6: Packaging OSAT Market

  • Market Overview
  • Contractor Rankings
  • Unit, Revenue, Pricing Forecasts by Package Family
    • DIP
    • SOT
    • SO
    • TSOP
    • DFN
    • CC
    • QFP
    • QFN
    • PGA
    • BGA
    • FBGA
    • WLP
  • OSAT Ranking

Chapter 7: Company Profiles

  • Amkor
  • Anst China
  • ASE
  • Azimuth
  • Carsem
  • ChipMOS
  • Cirtek
  • CORWIL Technology
  • Deca Technologies
  • FlipChip Int'l
  • Hana Microelectronics
  • Hana Micron
  • I2A
  • J-Devices
  • Jiangsu Changjiang
  • Lingsen Precision
  • Millennium Microtech
  • NANIUM
  • Nantong Fujitsu
  • OSE
  • Powertech
  • Shinko Electric
  • Signetics
  • Sigurd
  • Siliconware
  • SPEL
  • STATS ChipPAC
  • Teramikros
  • Tianshui Huatian Tech
  • Unisem
  • UTAC
  • Vigilant Technology
  • XinTec

Appendix A: OSAT Package Guide

Appendix B: OSAT Website Guide

Appendix C: Glossary

List of Figures and Tables(Partial)

  • IC Unit Forecast
  • IC Revenue Forecast
  • IC Packaging Revenue Forecast
  • Price per I/O by Package Family
  • Package Price Forecasts
  • IC Product Forecasts
    • MPU
    • MCU
    • DSP
    • DRAM
    • Flash
    • SRAM
    • ROM and EPROM
    • EEPROM/Other Memory
    • Digital Bipolar
    • Standard Logic
    • Gate Arrays
    • Cell-Based and PLD
    • Display Drivers
    • Custom Logic
    • Amplifiers
    • Interfaces
    • Voltage Regulators
    • Data Converters
    • Custom Analog
  • DIP Forecasts-3 I/O Ranges
  • SOT Forecasts
  • SO Forecasts-3 I/O Ranges
  • TSOP Forecasts-3 I/O Ranges
  • DFN Forecasts-2 I/O Ranges
  • CC Forecasts-2 I/O Ranges
  • QFP Forecasts-2 I/O Ranges
  • QFN Forecasts-4 I/O Ranges
  • PGA Forecasts-2 I/O Ranges
  • BGA Forecasts-4 I/O Ranges
  • FBGA Forecasts-6 I/O Ranges
  • WLP Forecasts-4 I/O Ranges
  • DCA Forecasts-5 I/O Ranges
  • Total IC Packaging Revenue
  • OSAT Total Forecast
  • OSAT DIP Forecast
  • OSAT SOT Forecast
  • OSAT SO Forecast
  • OSAT TSOP Forecast
  • OSAT DFN Forecast
  • OSAT CC Forecast
  • OSAT QFP Forecast
  • OSAT QFN Forecast
  • OSAT PGA Forecast
  • OSAT BGA Forecast
  • OSAT FBGA Forecast
  • OSAT WLP Forecast
  • Packaging OSAT Rankings
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