This publication has been discontinued on May 14, 2013.
The Most Comprehensive Report Available
On The Global IC Packaging Industry
Synopsis
While the integrated circuit (IC) market tends to be cyclical in nature, the
general trend is for more Ics to be integrated into more products over time.
While military was once the main driver of electronics, currently the market
is being driven by demand for handheld consumer devices and the adjoining
infrastructure. The automobile industry is also gaining steam, and vehicles
are laden with semiconductor devices.
A year of unprecedented growth in 2010 (IC revenue grew 40.6% while units
expanded 35.5%) followed the worst economic downturn since the great
depression. The year 2012 saw a softening in the market, which is typical of
U.S. Presidential election years. A steady climb is anticipated in the market
for 2013 and beyond, although economic uncertainty in Europe and developments
in unrest in the Middle East could hamper growth.
New Venture Research (NVR), in the 2013 Edition of ‘The Worldwide IC Packaging
Market’, analyzes the semiconductor industry and uses this analysis to forecast
the future of the global IC packaging market. The report begins with an
economic and industry overview, and historic and future unit and revenue
graphs.
IC Unit Shipments(B)
Following this high-level review, the report presents forecasts for each
semiconductor product type, and segments these products by package family and
I/O count range. Packaging revenue figures are displayed for each segment,
based on prices charged in the outsourced assembly and test (OSAT) market. The
package families are then rolled up by I/O count and semiconductor product. In
doing so, the report generates the total value of the IC packaging industry.
Next, the report presents NVR's continuing, extensive coverage of the OSAT
market. OSATs will continue to assume a larger share of the world's IC
packaging business. The report breaks the OSAT market down by package families
and major product categories providing units and revenue for each category. To
help you further assess this group of companies, the report profiles the
activities of the world's largest OSAT companies and the packages they offer.
‘The Worldwide IC Packaging Market’, 2013 Edition continues NVR's leadership
position in assessing the status and future of IC packaging.
Report Highlights
- Industry Overview
- Economic Overview
- Semiconductor Industry Analysis
- Worldwide IC Packaging Market Forecasts, 2011-2017
- Units
- Package Prices
- Packaging Revenue
- By Semiconductor Product
- By Package Family
- By I/O Range
- OSAT IC Packaging Market Forecasts, 2011-2017
- Units
- Package Prices
- Packaging Revenue
- Competitive Rankings
- Company Profiles
About the Author
Sandra L Winkler has been an industry analyst beginning in 1988, and since
1995, a staff member of Electronic Trend Publications, currently New Venture
Research. She has produced numerous off-the-shelf and custom reports. Ms.
Winkler began her analyst career in the telecommunications industry, with
Frost and Sullivan. Since 1995, she has focused on the semiconductor packaging
industry, and has authored more than 30 widely cited reports on the topic,
including The Worldwide IC Packaging Market, Advanced IC Packaging Markets and
Trends, and IC Packaging Materials. She also writes for Chip Scale Review
magazine, Global SMT & Packaging News, and contributes to the IEEE/CPMT
newsletter and other media. Ms. Winkler has an MBA from Santa Clara
University. She is on the executive planning committee of the IEEE/CPMT Santa
Clara Valley chapter, and serves as Luncheon Program Chair.
About New Venture Research
New Venture Research Corp. (NVR) was established in 1988 to provide advanced business research services for the high technology electronics sector.
NVR is a global provider of business intelligence, growth management and advisory services to companies in the information technology, telecommunications, consumer, scientific instrumentation and advanced electronics markets.
Table of Contents
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: The State of the Industry
- Economic Overview
- Industry Overview
Chapter 4: IC Package Forecast by Product
| Device Types: | Package Types: | I/O Count: |
- MPU
- MCU
- DSP
- DRAM
- Flash
- SRAM
- ROM/EPROM
- EEPROM/Other
- Digital Bipolar
- Standard Logic
- Gate Arrays
- Standard Cell/PLD
- Display Drivers
|
- DIP
- SOT
- SO
- TSOP
- DFN
- CC
- QFP
- QFN
- PGA
- BGA
- FBGA
- WLP
- DCA
|
- 004-018
- 020-032
- 034-100
- 104-304
- 308-999
- 1,000 +
|
- Special Purpose Logic and Analog - All Segments
Chapter 5: IC Package Forecast by Package Family
IC Package Forecast by Package Family
- DIP
- SOT
- SO
- TSOP
- DFN
- CC
- QFP
- QFN
- PGA
- BGA
- FBGA
- WLP
- DCA
I/O Count Range
- 004-018
- 020-032
- 034-100
- 104-304
- 308-999
- 1,000+
Chapter 6: Packaging OSAT Market
- Market Overview
- Contractor Rankings
- Unit, Revenue, Pricing Forecasts by Package Family
- DIP
- SOT
- SO
- TSOP
- DFN
- CC
- QFP
- QFN
- PGA
- BGA
- FBGA
- WLP
Chapter 7: Company Profiles
- Amkor
- Anst China
- ASE
- Azimuth
- Carsem
- ChipMOS
- Cirtek
- CORWIL Technology
- Deca Technologies
- FlipChip Int'l
- Hana Microelectronics
- Hana Micron
- I2A
- J-Devices
- Jiangsu Changjiang
- Lingsen Precision
|
- Millennium Microtech
- NANIUM
- Nantong Fujitsu
- OSE
- Powertech
- Shinko Electric
- Signetics
- Sigurd
- Siliconware
- SPEL
- STATS ChipPAC
- Teramikros
- Tianshui Huatian Tech
- Unisem
- UTAC
- Vigilant Technology
- XinTec
|
Appendix A: OSAT Package Guide
Appendix B: OSAT Website Guide
Appendix C: Glossary
List of Figures and Tables(Partial)
- IC Unit Forecast
- IC Revenue Forecast
- IC Packaging Revenue Forecast
- Price per I/O by Package Family
- Package Price Forecasts
- IC Product Forecasts
- MPU
- MCU
- DSP
- DRAM
- Flash
- SRAM
- ROM and EPROM
- EEPROM/Other Memory
- Digital Bipolar
- Standard Logic
- Gate Arrays
- Cell-Based and PLD
- Display Drivers
- Custom Logic
- Amplifiers
- Interfaces
- Voltage Regulators
- Data Converters
- Custom Analog
- DIP Forecasts-3 I/O Ranges
- SOT Forecasts
- SO Forecasts-3 I/O Ranges
- TSOP Forecasts-3 I/O Ranges
- DFN Forecasts-2 I/O Ranges
- CC Forecasts-2 I/O Ranges
- QFP Forecasts-2 I/O Ranges
- QFN Forecasts-4 I/O Ranges
- PGA Forecasts-2 I/O Ranges
- BGA Forecasts-4 I/O Ranges
- FBGA Forecasts-6 I/O Ranges
- WLP Forecasts-4 I/O Ranges
- DCA Forecasts-5 I/O Ranges
- Total IC Packaging Revenue
- OSAT Total Forecast
- OSAT DIP Forecast
- OSAT SOT Forecast
- OSAT SO Forecast
- OSAT TSOP Forecast
- OSAT DFN Forecast
- OSAT CC Forecast
- OSAT QFP Forecast
- OSAT QFN Forecast
- OSAT PGA Forecast
- OSAT BGA Forecast
- OSAT FBGA Forecast
- OSAT WLP Forecast
- Packaging OSAT Rankings