The worldwide printed electronics (PE) market has been over-hyped and
inaccurately forecast for over a decade. Yet PE still holds much potential and
is now starting to show promise and commercialization. New Venture Research
(NVR) has been following this emerging market for the last five years and the
contract electronic manufacturing services market for more than 20 years. As a
result of our extensive industry contacts and recent field interviews in PE,
NVR is in a position to put a realistic stake in the ground with regard to the
leading PE market applications and their potential for future growth.
This latest report - Contract Manufacturing Opportunities in Printed
Electronics - 2013 Edition - is a comprehensive market analysis of emerging PE
technologies and applications, and leverages our in-depth database of contract
electronics manufacturing services (EMS) suppliers and markets built up over
the past two decades. EMS suppliers are the best positioned to capitalize on
the most promising PE opportunities, of which we have identified over 40
leading application areas. This report analyzes the highest potential products
by end customer that stand to win out over traditional semiconductor and
material technologies. This is because PE is creating a standalone market of
its own as well as displacing some traditional semiconductor electronics.
Certain market applications have clear economic and commercial advantages over
the next five years (the only period that can be reasonably forecast).
Chapter 3 begins with a technical analysis of the most popular material
technologies including organic and inorganic thin film transistors and other
forms of printable circuits. The chapter moves on to discuss the various kinds
of equipment that are used to print and layer these thin films, especially ink
jet and screen printer technology which are used for the majority of PE
applications today. A summary of the total equipment market by revenue is
provided for 2012. The section concludes with an examination of substrates and
the field of e-paper and related displays.
Chapter 4 explores and analyzes the PE market for conductive inks and thin
films. Currently, the vast majority of conductive materials are composed of
silver flake along with corresponding dielectrics for insulation. Other
materials such as carbon/graphene, copper, gold, platinum, and carbon
nanotube/silver/copper nanowire are explored. A table of all the worldwide
conductive inks is summarized in terms of revenue for 2012 along with a table
of conductive inks by industry segment.
Chapter 5 identifies and explores the leading product applications for PE
products among ten industry segments and in context with the entire contract
manufacturing market. Leading product applications are analyzed for both
traditional electronics assembly and advanced PE manufacturing production.
Chapter 6 forecasts the future for PE products for 40 different product
applications, contrasting the highest potential PE products against
traditional semiconductor electronics. All PE product applications are
summarized in the final chapter, including a ranking of the strongest markets
in descending order of growth. The highest growth markets are projected to
expand over 125% CAGR, while others are as low as only 5% CAGR, from
2012-2017. Overall, the market for PE products will triple over the next five
years, reaching nearly $10 billion in assembly revenue value by 2017.
Chapter 7 analyzes the leading PE companies and suppliers in three ways -
equipment manufacturers, advanced materials/thin film providers, and
solution/integration companies that develop technical solutions or can
successfully integrate one or more PE technologies. In all, 185 PE companies
are profiled in this report and are organized according to category.
About the Author
Randall Sherman is the principal analyst and president of New Venture Research
Corp., a technology market research and business consulting firm focused on
the EMS and OEM electronics manufacturing industries. Mr. Sherman has more
than 25 years' experience in technology and business research. He began his
career as a telecom network design engineer and he holds an undergraduate
degree in Astrophysics. He also holds two master's degrees - an MSEE from the
University of Colorado and an MBA from the Edinburgh School of Business.
Before NVR, he held senior positions at various market research firms
including Creative Strategies, Frost and Sullivan, and BIS Strategic Decisions.
About New Venture Research
New Venture Research Corp. (NVR) was established in 1988 to provide advanced
business research services for the high technology electronics sector.
Initially, the company's focus was on providing startup businesses with market
research and strategic planning consulting services since we were located in
Silicon Valley, California. Later, the company expanded into providing
business development and merger & acquisition services to large and small as
well as old and new firms.
Today, NVR is a global provider of business intelligence, growth management
and advisory services to companies in the information technology,
telecommunications, consumer, scientific instrumentation and advanced
electronics markets.
Table 6-2 - Worldwide Electronics Assembly Market by Supplier and Market
Segment, 2011-2016
Table 6-3 - Worldwide Appliance Assembly Market by Leading Supplier and
Region ($M), 2011
Table 6-4 - Worldwide PE Appliance Assembly Market by Application ($M),
2012-2017
Table 6-5 - Worldwide PE Display and Lighting Assembly Market by Application
($M), 2012-2017
Table 6-6 - Worldwide Medical Assembly Market by Leading Supplier and Region
($M), 2011
Table 6-7 - Worldwide PE Medical Assembly Market by Application ($M),
2012-2017
Table 6-8 - Worldwide PE Packaging Assembly Market by Application ($M),
2012-2017
Table 6-9 - Worldwide PV Assembly Market by Leading Supplier and
Manufacturing Region ($M), 2011
Table 6-10 - Worldwide PV Assembly Market for PE by Application ($M),
2012-2017
Table 6-11 - Worldwide PCB Assembly Market for PE by Application ($M),
2012-2017
Table 6-12 - Worldwide RFID Market by Component ($B), 2012
Table 6-13 - Worldwide RFID Assembly Market for PE by Application ($M),
2012-2017
Table 6-14 - Worldwide Textile Assembly Market for PE by Application ($M),
2012-2017
Table 6-15 - Worldwide Transportation Assembly Market for PE by Application
($M), 2012-2017
Table 6-16 - Worldwide Other Assembly Markets for PE by Application ($M),
2012-2017
Table 6-17 - Worldwide PE Market by Industry Segment ($M), 2012-2017
Table 6-18 - Worldwide PE Assembly Market by Application ($M), 2012-2017
Table 6-19 - Worldwide PE Assembly Market by Application Leading CAGR
($M), 2012-2017
List of PE Companies Profiled
Materials Companies
3M
Advanced Nano Products
Agfa-Orgacon
Applied Nanotech
Asahi Glass Co.
Asahi Kasei
BASF
Beneq
Blue Nano
Cabot
Cambrios
Carestream Advanced
Materials
Cima Nanotech
Corning
Creative Materials
Dai Nippon Printing
DayStar Technologies
Delta Optoelectronics
Dow Chemical
DuPont Microcircuit Mat.
Eastman Kodak
Electric Vinyl, Inc.
Electronic Paper and Tech.
elumin8
Ercon
Ferro Corp.
FUJIFILM Holdings Corp.
Fujikura
Gwent Group
H. C. Starck
Heliatek GmbH
Henkel
Heraeus
Hitachi Chemical
Indium Corporation
Infineon Technologies
Inktec
Int'l Solar Elect. Tech.
Intrinsiq Materials
Kimoto
Konarka Technologies
Kovio
LG Philips LCD Co., Ltd.
Liquid X Printed Metals
Litrex
Luminous Media, Ltd.
MEMC Electronic Materials
Microvision, Inc.
Mirwec Films
Nanogap
NanoInk, Inc.
NanoMas Technology
Nissan Chemical Ind.
Novaled AG
Novalia
Optomec
ORFID
OrganicID
Ormecon GmbH
OSRAM GmbH
Plextronics
PolyIC GmbH & Co. KG
Poly-Ink
QUALCOMM MEMS
Samsung Electronics
Soligie
SouthWest
NanoTechnologies
Sumitomo Chemical
Sun Chemical
Toshiba Mobile Display
ToyoChem
ULANO
Unidym, Inc.
Victrex Polymer
Vorbeck Materials
Equipment Companies
Agfa-Gevaert
AIXTRON AG
Applied Materials
Canon
CERADROP
Conductive Inkjet Tech.
Dainippon Screen Printing
DEK Printing Machines
Dialog Semiconductor
FUJIFILM Dimatix
Fuji Xerox Co.
Goss International Americas
Haiku Tech
Hewlett Packard
Hisense
Johnson Laminating & Coat
Kammann Machines
KIWO
Konica Minolta
Landa Corporation
MacDermid Printing
MAN Roland
Mark Andy, Inc.
Merck Millipore
Midori Mark Co., Ltd.
MuTracx
NovaCentrix
NXT PLC
Ohio Gravure Technologies
PixDro BV
Preco, Inc.
Printcolor Screen Ltd.
Printechnologics
Roth & Rau
Schreiner PrinTronics
Seiko Epson
SiPix Imaging, Inc.
SonoPlot
Speedline Technologies
ST Microelectronics
Sung An Machinery
Taiyo Ink Mfg. Co., Ltd.
Thieme GmbH & Co.
Tokyo Electron, Ltd.
Toppan Printing Co.
UniJet
Universal Display Corporation
Veeco Instruments
Xaar
Xerox Corporation
Solution/Integration
Companies
Add-Vision
Ascend Solar
AVANCIS
Aveso
Blue Spark
Bosch Solar
Calyxo
Cambridge Display
Canadian Solar
China Sunenergy
Cymbet
Durel
E Ink
eMagin
Energy Conversion Devices
Enfucell
EV Group
Evonik
Excellatron
First Solar
Flexcell
Front Edge
Frontier Industrial Technology
Fuji Electric
G24 Innovations
Global Solar Energy
GSI Technologies
Imprint Energy
Infinite Power Solutions
Innovalight
ISORG
Kaneka
KSW Microtec
Liquavista
Memtron Input Components
Nanosolar
NRG Solar
Ormet Circuits, Inc.
PARC
Parelec
PChem
Plastic Logic
Power Paper, Ltd.
PragmatIC Printing
ReneSola, Ltd.
Semprius
Sensormatic
Sharp Corporation
Si-Cal
SMARTRAC
Solarmer
Solar Frontier
Solexant
Solicore
Sontor GmbH
Sumation Co., Ltd.
T-Ink, Inc.
Terepac
Thin Film Electronics
Contract Manufacturing Opportunities in Printed Electronics published by New Venture Research in January 28, 2013. This report consists of 287 Pages and the price starts from US $ 2495.