The Most Comprehensive Report Available On The Global IC Packaging Industry
While the integrated circuit (IC) market tends to be cyclical in nature, the general trend is for more ICs to be integrated into more products over time. While military was once the main driver of electronics, currently the market is being driven by demand for handheld consumer devices and the adjoining infrastructure. The automobile industry is also gaining steam, and vehicles are laden with semiconductor devices.
A year of unprecedented growth in 2010 (IC revenue grew 40.6% while units expanded 35.5%) followed the worst economic downturn since the great depression. The year 2012 saw a softening in the market, which is typical of U.S. Presidential election years. A steady climb is anticipated in the market for 2013 and beyond, although economic uncertainty in Europe and developments in unrest in the Middle East could hamper growth.
New Venture Research (NVR), in the 2013 Edition of The Worldwide IC Packaging Market, analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market. The report begins with an economic and industry overview, and historic and future unit and revenue graphs.
Following this high-level review, the report presents forecasts for each semiconductor product type, and segments these products by package family and I/O count range. Packaging revenue figures are displayed for each segment, based on prices charged in the outsourced assembly and test (OSAT) market. The package families are then rolled up by I/O count and semiconductor product. In doing so, the report generates the total value of the IC packaging industry.
Next, the report presents NVR's continuing, extensive coverage of the OSAT market. OSATs will continue to assume a larger share of the world's IC packaging business. The report breaks the OSAT market down by package families and major product categories providing units and revenue for each category. To help you further assess this group of companies, the report profiles the activities of the world's largest OSAT companies and the packages they offer.
The Worldwide IC Packaging Market, 2013 Edition continues NVR's leadership position in assessing the status and future of IC packaging. This report is an effective and economical tool for any company associated in the semiconductor industry to aid in assessing their own markets and potential areas of growth. The report sells for $3495 and is delivered by email as a single-user PDF file. Extra single-user licenses sell for $250 each and a corporate license is $1000. With the purchase of the report, an Excel spreadsheet of all tables may be obtained for an additional $750 and a printed copy for $250.