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Market Research Report

Smart Houses: Wireless ICT - Markets Development

Published by Practel, Inc.
Published January, 2010 Product code 106472
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US $ 3950 Read Only PDF By E-mail (Single User License)
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Smart Houses: Wireless ICT - Markets Development published by Practel, Inc. in January, 2010. This report price starts from US $ 3950.

Introduction

Abstract

Report Overview

This report addresses the development of wireless ICT to support Smart Houses. Only now, the Smart Houses technologies are becoming affordable on the industry-wide scale; though the concept was originated in the 80th of the last Century. The importance of Smart Houses proliferation is now considered in connection with the Smart Grid deployments, and Smart Houses wireless ICT will eventually be a part of a large country-wide project, such as centralized and intelligent automation system, which integrates utilities and consumers.

In this report, wireless Information and Communications Technologies for Smart Houses are grouped as:

ICT for home automation. They support such communications structures as, for example, Home Area Networks, security, and others, which in the majority of cases do not need high-speed transmission. Report analyzes Z-wave and ZigBee/IEEE802.15.4 technologies and markets with emphasis on mesh networking and the IP environment that only recently became available for home-based communications nodes. The report provides details of Home Area Networks and shows their importance for the Smart Grid development.

ICT for Entertainment and Information. The goal of a Smart House is to make a comfortable life for tenants; this requires effective and low-cost connectivity between various entertainment devices, such as HDTV, various recording/playing gadgets as well as other devices. Users require transition from bulky cables to wireless support of transmission in a range of several Gb/s at the distances 10m or more. They also want to cover with wireless channels all house. The report details multiple industry and standardization organizations efforts to bring to the picture 60 GHz radio for such purposes. In connection with this, it analyzes the status of several competing technologies to implement comfortable and cost-efficient transmission of HDTV and other band-hungry applications.

The U.S. market for wireless ICT in Smart Houses (with a base of private houses reaching more than 100 million) is huge; it also has support of the government, which is involved in the Smart Grid project.

Target Audience

This report is important to a wide population of researches, technical and sales staff involved in the developing of the Smart Houses. It is recommended for both service providers and vendors that are working with related technologies. The report also helps to understand issues associated with relationship between Smart Houses ICT and other technologies.

Research Methodology

Considerable research was done using the Internet. Information from various Web sites was studied and analyzed. Evaluation of publicly available marketing and technical publications was conducted. Telephone conversations and interviews were held with industry analysts, technical experts and executives. In addition to these interviews and primary research, secondary sources were used to develop a more complete mosaic of the market landscape, including industry and trade publications, conferences and seminars.

The overriding objective throughout the work has been to provide valid and relevant information. This has led to a continual review and update of the information content.

Table of Contents

1.0 Introduction

  • 1.1 General
  • 1.2 Scope
  • 1.3 Research Methodology
  • 1.4 Target Audience

2.0 Smart Houses

  • 2.1 Levels
  • 2.2 Components
  • 2.3 Benefits

3.0 Smart House: Wireless Communications

  • 3.1 Z-Wave
    • 3.1.2 Z-Wave Alliance
    • 3.1.3 Benefits
    • 3.1.4 Details
      • 3.1.4.1 General
      • 3.1.4.2 Characteristics
      • 3.1.4.3 ZigBee and Z-Wave
    • 3.1.5 Advanced Energy Control Framework
      • 3.1.5.1 Z-wave and Smart Metering
    • 3.1.6 Selected Vendors
      • Aeon Labs
      • Mi Casa Verde
      • Sigma Designs
    • 3.1.7 Pricing
    • 3.1.8 Market Estimate: Z-wave Products for Smart Houses
      • 3.1.8.1 Model
      • 3.1.8.2 Results
  • 3.2 ZigBee
    • 3.2.1 General
    • 3.2.2 Details
      • 3.2.2.1 Major Features
      • 3.2.2.2 Device Types
    • 3.2.3 Protocol Stack
      • 3.2.3.1 Physical and MAC layers - IEEE802.15.4
      • 3.2.3.2 Frame
      • 3.2.3.3 Upper Layers
    • 3.2.4 Interoperability
    • 3.2.5 Security
    • 3.2.6 Platform Considerations
      • 3.2.6.1 Battery Life
      • 3.2.6.2 ZigBee Technology Benefits and Limitations
    • 3.2.7 Standardization Process
      • 3.2.7.1 ZigBee Alliance
        • 3.2.7.1.1 Objectives
    • 3.2.8 Example: Smart Energy Profile
      • 3.2.8.1 Features
    • 3.2.9 ZigBee IP
    • 3.2.10 802.15.4 - ZigBee Basis
      • 3.2.10.1 IEEE 802.15.4 Radio
    • 3.2.11 Application Specifics - Profiles Examples
    • 3.2.12 IETF and ZigBee
    • 3.2.13 Applications
      • 3.2.13.1 General
      • 3.2.13.2 Home-SH
      • 3.2.13.3 PC
      • 3.2.13.4 Manufacturing
      • 3.2.13.5 WSN and ZigBee
      • 3.2.13.6 ZigBee Role
      • 3.2.13.7 “Green” ZigBee
    • 3.2.14 Market
      • 3.2.14.1 Expectations
      • 3.2.14.2 Segments
      • 3.2.14.3 Forecast
      • 3.2.14.4 Industry
        • Airbee (Software)
        • Amber (RF Modules)
        • Arch Rock (IP)
        • Atmel (Chipsets)
        • CEL (Modules)
        • Chipcon - TI (Chipsets)
        • Cirronet-RFM (Modules-Industrial Applications)
        • Crossbow (WSN, Environment Monitoring, motes)
        • Digi (Radios, Routers, Energy Management)
        • Duolog (Transceivers)
        • Ember (Chipsets; SH)
        • EnergyHub (Smart Home)
        • GreenPeak (WSN)
        • Helicomm (Modules)
        • Jennic (Chipsets-Modules)
        • Freescale (Chipsets)
        • Nuri Telecom (AMR Application)
        • Oki (Chipsets)
        • Open Peak (Power Management)
        • Renesas (Platforms, AMR)
        • Silicon Laboratories (Chipsets, Modules)
        • Synapse (Module, Protocols)
        • Telegesis (Integrator, Modules)
        • TI (Chipsets)

4.0 Home Area Networks

  • 4.1 General - Advantages
  • 4.2 Choices
    • 4.2.1 Specification
  • 4.3 Technologies
    • 4.3.1 IETF and IP/WSN
    • 4.3.2 Major Projects
    • 4.3.3 6LoWPAN WG
    • 4.3.4 6LoWPAN Development
      • 4.3.4.1 Industry Support
      • 4.3.4.2 NanoStack
      • 4.3.4.3 Details
      • 4.3.4.4 U-SNAP
    • 4.3.5 Example-HAN
    • 4.3.6 ROLL WG
      • 4.3.6.1 General
      • 4.3.6.2 Scope
    • 4.3.7 Major Characteristics of IP-WSN
    • 4.3.8 IPSO Alliance (IP for Smart Objects)
    • 4.3.9 Major Players: Samples
      • Control4
      • Insteon
      • Jennic
      • Radiocrafts-Sensinode
      • Sigma Designs
  • 4.4 HAN Market
    • 4.4.1 Drivers
    • 4.4.2 Nodes
    • 4.4.3 Geography
    • 4.4.4 Technologies
    • 4.4.5 Market Size

5.0 60 GHz Radio Technology

  • 5.1 General
  • 5.2 Spectrum Specifics
    • 5.2.1 Oxygen Absorption
  • 5.3 Antenna
  • 5.4 Radiation Limiting at 60 GHz
  • 5.5 Combined Effect
  • 5.6 Progress in the Chip Technology for mmWave
    • 5.6.1 Modulation
    • 5.6.2 Specifics
      • 5.6.2.1 Indoor Behavior
  • 5.7 Wi-Fi and 60 GHz Radio
    • 5.7.1 WiGig
  • 5.8 Summary
  • 5.9 60 GHz Radio-IEEE 802.15.3c and Competition
    • 5.9.1 General
    • 5.9.2 Specifics
      • 5.9.2.1 Benefits for WPAN
    • 5.9.3 Applications
    • 5.9.4 Challenges
    • 5.9.5 Standardization and Development: WirelessHD, IEEE 802.15.3c and Other
      • 5.9.5.1 WirelessHD
        • 5.9.5.1.1 Details: WirelessHD Technology
        • 5.9.5.1.2 Completion
        • 5.9.5.1.3 Amimon
        • 5.9.5.1.4 Celeno
      • 5.9.5.2 Issues and Progress
    • 5.9.6 IEEE 802.15.3c
      • 5.9.6.1 Current Status
      • 5.9.6.2 Benefits
    • 5.9.7 Very High Throughput Group
    • 5.9.8 Diversity
    • 5.9.9 ECMA
    • 5.9.10 Market
      • 5.9.10.1 General: Applications
      • 5.9.10.2 Market Obstacles: Specifics
      • 5.9.10.3 Forecast
    • 5.9.11 Players and Projects
      • IBM
      • SiBeam
      • Phiar-Motorola
      • NEC
    • 5.9.12 Comparison
    • 5.9.13 60 GHz WPAN: SH Example

6.0 Conclusions

FIGURES:

  • Figure 1: TAM Estimate: U.S. Small SH Z - wave IC ($US Mil)
  • Figure 2: TAM Estimate: U.S. Large SH Z - wave IC ($US Mil)
  • Figure 3: ZigBee Protocol Stack
  • Figure 4: Profiles
  • Figure 5: Estimate: ZigBee Modules Market Worldwide ($M)
  • Figure 6: Estimate: ZigBee Modules Market Worldwide (M Units)
  • Figure 7: ZigBee Market Segmentation (2009)
  • Figure 8: ZigBee Market Segmentation (2013)
  • Figure 9: Dynamic of HAN Growth as Percentage of Total Deployed
  • Figure 10: HAN Market Geography (Percentage from total market)
  • Figure 11: HAN Technologies Shares (As a percentage of total Market)
  • Figure 12: U.S. Addressable HAN Market (Million Units)
  • Figure 13: U.S. HAN Addressable Market ($B)
  • Figure 14: 60 GHz Connections
  • Figure 15: Global Frequencies
  • Figure 16: Spectrum Details
  • Figure 17: Attenuation in 60 GHz Band
  • Figure 18: Absorption Details
  • Figure 19: Bands Features Comparison
  • Figure 20: 60 GHz “Open” Spectrum
  • Figure 21: IEEE802.15 Structure
  • Figure 22: WPAN 60 GHz Radio Addressable Market ($M US)
  • Figure 23: 60 GHz WPAN Example

TABLES:

  • Table 1: Z-Wave and ZigBee
  • Table 2: Z-wave Products Retail Pricing
  • Table 3: ZigBee Parameters
  • Table 4: ZigBee Smart Energy Profile Feature Set
  • Table 5: Directivity
  • Table 6: 60 GHz Links Characteristics
  • Table 7: Bandwidth Utilization Details
  • Table 8: Attenuation
  • Table 9: Properties
  • Table 10: Required Speed
  • Table 11: Competition
  • Table 12: WPAN Technologies
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