Smart Houses: Smart Grid Extensions, ICT Markets and Technologies Development

Published by	Practel, Inc.
Published	January, 2010	Product code	108389
Content info
Price	US $ 3990 Read Only PDF By E-mail (Single User License) US $ 4150 Printable PDF by E-mail (Single User License) US $ 5990 PDF by E-mail (Enterprise License)

Introduction
Related Reports

Smart Houses: Smart Grid Extensions, ICT Markets and Technologies Development published by Practel, Inc. in January, 2010. This report price starts from US $ 3990.

Introduction

Abstract

This report addresses the development of wireline and wireless Information and Communications Technologies (ICT) to support the Smart House infrastructure. With each year, the Smart Houses communications technologies are becoming more and more affordable and efficient on the industry-wide scale for multiple applications; though the concept was originated in the 80th of the last Century. The importance of Smart Houses proliferation is now tied with the Smart Grid deployments, and Smart Houses communications networks will eventually be a part of a large country-wide project, such as centralized and intelligent automation system, which integrates utilities and consumers.

In this report, the analysis of Smart Houses Information and Communications Technologies is extended to both wireless and wireline technologies. They support such communications structures as, for example, Home Area Networks, security, and others, such as HDTV distribution in the house. The report analyzes wireless ICT (Z-wave and ZigBee/IEEE802.15.4) and wireline technologies (HomePlug, HomePNA, G.hn, MOCA); and respective markets. The emphasis is made on mesh networking and the IP environment that only recently became available for home-based communications nodes. Wireline technologies are using the existing Smart Home wiring, while wireless technologies support connectivity between various home network nodes by implementing the necessary wireless networking.

Wireline technologies are standardized by multiple standard organizations and industry groups; for example, the ITU G.hn standard came to the picture only recently, when millions of MOCA and HomePLug nodes have been already installed and functioning. The ITU standards are developing for "universal" technologies (which provide connectivity through electric wire, phone wire and coaxial cable in a Smart House). The complicated wireline ICT environment reflects the industry efforts as well as the vendors' interest to find the place in this lucrative market. While wireline technologies are designed for high-speed transmission (up to 1 Gb/s), considered in the report wireless technologies can support relatively slow communications (up to 1 Mb/s); they may be used for different applications.

The report also provides details of Home Area Networks features and markets and shows their importance for the Smart Grid development.

The U.S. market for ICT in Smart Houses (with a base of private houses reaching more than 100 million) is huge; it also has support of the government, which is very involved in the Smart Grid project.

Research Methodology

Considerable research was done using the Internet. Information from various Web sites was studied and analyzed. Evaluation of publicly available marketing and technical publications was conducted. Telephone conversations and interviews were held with industry analysts, technical experts and executives. In addition to these interviews and primary research, secondary sources were used to develop a more complete mosaic of the market landscape, including industry and trade publications, conferences and seminars.

The overriding objective throughout the work has been to provide valid and relevant information. This has led to a continual review and update of the information content.

Target Audience

This report is important to a wide population of researches, technical and sales staff involved in the developing of the Smart Houses. It is recommended for both service providers and vendors that are working with related technologies. The report also helps to understand issues associated with relationship between "green" Smart Houses ICT and other technologies.

1.0 Introduction 8

1.1 General 8
1.2 Scope 9
1.3 Research Methodology 10
1.4 Target Audience 10

2.0 Smart Houses 11

2.1 Levels 11
2.2 Components 12
2.3 Benefits 12

3.0 HomePlug: SH 13

3.1 General 13
3.2 HomePlug Alliance 14
3.2.3 ZigBee/HomePlug Smart Energy 16
3.3 Benefits 17
3.4 Details 17
3.5 HomePlug 1.0 18
3.6 HomePlug GP 19
3.7 HomePlug AV 20
3.8 HomePlug Command and Control 22
3.9 Standard Organizations Work 24
- 3.9.1 IEEE 24
- 3.9.2 TIA 26
- 3.9.3 ETSI 26
3.10 HomePlug - SH Market Segment 27
3.11 Vendors - SH PLC 29
- ActionTec 29
- Ariane 30
- Atheros 31
- Arkados 33
- Asoka 34
- Bewan 35
- Corinex 36
- CooperGate 38
- Devolo AG 38
- DS2 39
- GigaFast 40
- Gigle Networks 41
- Insteon 43
- IOGear 44
- NEC 46
- Netgear 47
- Siemens 48
- Spidcom 49
- ST&T 50
- Watteco 51
- Yitran 52
- Zyxel 54

4.0 ITU G.hn - HomePNA 56

4.1 HomePNA Alliance 56
- 4.1.1 General 56
- 4.1.2 HomePNA Specification: Major Features 56
4.2 ITU 57
- 4.2.1 General 57
- 4.2.2 HomeGrid Forum 58
- 4.2.3 Mixed Reaction 59
- 4.2.4 G.hn Details 59
- 4.2.5 Acceptance 60
- 4.2.6 HomePNA-G.hn 61
- 4.2.7 Samples of Vendors 61
  - CooperGate 62
  - NetSys 62

5.0 MOCA 64

5.1 General 64
5.2 Partnerships 64
5.3 Details 65
5.4 Samples of Vendors 66
- Actioncable 66
- Broadcom 67
- CommScope 68
- Entropic 68
- Netgear 70

6.0 Smart House: Wireless Communications 72

6.1 Z-Wave 72
- 6.1.2 Z-Wave Alliance 73
- 6.1.3 Benefits 74
- 6.1.4 Details 74
  - 6.1.4.1 General 74
  - 6.1.4.2 Characteristics 75
  - 6.1.4.3 ZigBee and Z-Wave 76
- 6.1.5 Advanced Energy Control Framework 77
  - 6.1.5.1 Z-wave and Smart Metering 77
- 6.1.6 Selected Vendors 79
  - Aeon Labs 79
  - Mi Casa Verde 80
  - Sigma Designs 81
- 6.1.7 Pricing 82
- 6.1.8 Market Estimate: Z-wave Products for Smart Houses 82
  - 6.1.8.1 Model 82
  - 6.1.8.2 Results 82
6.2 ZigBee 84
- 6.2.1 General 84
- 6.2.2 Details 85
  - 6.2.2.1 Major Features 85
  - 6.2.2.2 Device Types 86
- 6.2.3 Protocol Stack 87
  - 6.2.3.1 Physical and MAC layers - IEEE802.15.4 88
  - 6.2.3.2 Frame 89
  - 6.2.3.3 Upper Layers 90
- 6.2.4 Interoperability 91
- 6.2.5 Security 92
- 6.2.6 Platform Considerations 94
  - 6.2.6.1 Battery Life 95
  - 6.2.6.2 ZigBee Technology Benefits and Limitations 95
- 6.2.7 Standardization Process 96
  - 6.2.7.1 ZigBee Alliance 97
    - 6.2.7.1.1 Objectives 97
- 6.2.8 Example: Smart Energy Profile 97
  - 6.2.8.1 Features 99
- 6.2.9 ZigBee IP 99
- 6.2.10 802.15.4 - ZigBee Basis 100
  - 6.2.10.1 IEEE 802.15.4 Radio 100
- 6.2.11 Application Specifics - Profiles Examples 101
- 6.2.12 IETF and ZigBee 102
- 6.2.13 Applications 103
  - 6.2.13.1 General 103
  - 6.2.13.2 Home-SH 104
  - 6.2.13.3 PC 106
  - 6.2.13.4 Manufacturing 106
  - 6.2.13.5 WSN and ZigBee 106
  - 6.2.13.6 ZigBee Role 107
  - 6.2.13.7 "Green" ZigBee 108
- 6.2.14 Market 109
  - 6.2.14.1 Expectations 109
  - 6.2.14.2 Segments 110
  - 6.2.14.3 Forecast 111
  - 6.2.14.4 Industry 113

Airbee (Software) 113
Amber (RF Modules) 114
Arch Rock (IP) 116
Atmel (Chipsets) 117
CEL (Modules) 118
Chipcon - TI (Chipsets) 119
Cirronet-RFM (Modules-Industrial Applications) 121
Crossbow (WSN, Environment Monitoring, motes) 123
Digi (Radios, Routers, Energy Management) 124
Duolog (Transceivers) 126
Ember (Chipsets; SH) 127
EnergyHub (Smart Home) 130
GreenPeak (WSN) 131
Helicomm (Modules) 132
Jennic (Chipsets-Modules) 134
Freescale (Chipsets) 136
Nuri Telecom (AMR Application) 137
Oki (Chipsets) 138
Open Peak (Power Management) 139
Renesas (Platforms, AMR) 140
Silicon Laboratories (Chipsets, Modules) 141
Synapse (Module, Protocols) 143
Telegesis (Integrator, Modules) 144
TI (Chipsets) 145

7.0 Home Area Networks 146

7.1 General - Advantages 146
7.2 Choices 146
- 7.2.1 Specification 147
7.3 Technologies 148
- 7.3.1 IETF and IP/WSN 148
- 7.3.2 Major Projects 149
- 7.3.3 6LoWPAN WG 149
- 7.3.4 6LoWPAN Development 150
  - 7.3.4.1 Industry Support 150
  - 7.3.4.2 NanoStack 151
  - 7.3.4.3 Details 151
  - 7.3.4.4 U-SNAP 153
- 7.3.5 Example-HAN 154
- 7.3.6 ROLL WG 154
  - 7.3.6.1 General 154
  - 7.3.6.2 Scope 155
- 7.3.7 Major Characteristics of IP-WSN 157
- 7.3.8 IPSO Alliance (IP for Smart Objects) 157
- 7.3.9 Major Players: Samples 157
  - Control4 157
  - Insteon 160
  - Jennic 162
  - Radiocrafts-Sensinode 163
  - Sigma Designs 164
7.4 HAN Market 166
- 7.4.1 Drivers 166
- 7.4.2 Nodes 166
- 7.4.3 Geography 167
- 7.4.4 Technologies 168
- 7.4.5 Market Size 168