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STMicroelectronics: World's first Inertial MEMS using Through-Silicon-Via technology Reverse Costing Analysis

This publication has been discontinued on January 23, 2013.


Physical Analysis of the Devices

Step by Step Reconstruction of the Process Flow

Cost of Manufacturing and Estimation of Selling Price

System Plus Consulting is proud to publish the reverse costing report of the world's first 3-Axis MEMS accelerometer supplied by STMicroelectronics and using Through-Silicon-Via technology.

The Component was extracted from a NOKIA phone and seems to be a special version of the STM 3-Axis Accelerometer LIS302DL.

Packaged in a LGA-14 pin package, the device integrates two dies in a side-by-side configuration and features an ultra low-power consumption that allows power saving functions in consumer applications.

By removing the area reserved for I/O pads, the TSV process allows the MEMS die area to be shrinked when compared to the standard accelerometer. The manufacturing process uses an approach similar to the standard THELMA technology, but adds major changes which increase the final wafer cost.

The report also provides a comparative analysis with the standard ST 3-Axis MEMS Accelerometer, the LIS302DL.


System Plus Consulting is specialized in the cost analysis of electronics from semiconductor devices to electronic systems. Around this main line System Plus Consulting developed a complete range of services and costing tools to provide in-depth production cost studies and estimation of the objective selling price of the product.

Table of Contents

Overview / Introduction

  • Executive Summary
  • Reverse Costing Methodology

STMicroelectronics Company Profile

  • STMicroelectronics Profile
  • Component Specifications

Physical Analysis

  • Synthesis of the Physical Analysis
  • Package Characteristics & Markings
  • Package Opening
  • ASIC Process technology
  • ASIC Synthesis
  • MEMS - Dimensions and Marking
  • MEMS Opening
  • MEMS Sensor - biaxial accelerometer
  • MEMS Sensor - Z-Axis
  • Component Cross-Section
  • ASIC Cross-Section
  • MEMS Cross-Section
  • TSV Cross Section

Standard Component : Short Analysis

Manufacturing Process Flow

  • ASIC Wafer Fabrication Unit
  • MEMS Wafer Fabrication Unit
  • Manufacturing Process Flow: TSV Component
  • Manufacturing Process Flow: Standard Component

Cost Analysis

  • Synthesis of the Cost Analysis
  • ASIC Wafer Front-End Cost
  • ASIC Die Cost
  • MEMS Wafer Front-End Cost
  • MEMS Wafer Front-End Cost
  • MEMS Front-End Cost per Process Steps
  • MEMS Front-End : Equipment Cost per Family
  • MEMS Front-End : Material Cost per Family
  • MEMS Back-End 0 : Probe Test & dicing
  • MEMS Die Cost
  • Packaging, Final test and Calibration
  • Component with TSV Cost
  • Standard Component Cost
  • Yields Synthesis

Estimated Manufacturer Price

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