System Plus Consulting is proud to publish the reverse costing report of the world's first 3-Axis MEMS accelerometer supplied by STMicroelectronics and using Through-Silicon-Via technology.
The Component was extracted from a NOKIA phone and seems to be a special version of the STM 3-Axis Accelerometer LIS302DL.
Packaged in a LGA-14 pin package, the device integrates two dies in a side-by-side configuration and features an ultra low-power consumption that allows power saving functions in consumer applications.
By removing the area reserved for I/O pads, the TSV process allows the MEMS die area to be shrinked when compared to the standard accelerometer. The manufacturing process uses an approach similar to the standard THELMA technology, but adds major changes which increase the final wafer cost.
The report also provides a comparative analysis with the standard ST 3-Axis MEMS Accelerometer, the LIS302DL.
System Plus Consulting is specialized in the cost analysis of electronics from semiconductor devices to electronic systems. Around this main line System Plus Consulting developed a complete range of services and costing tools to provide in-depth production cost studies and estimation of the objective selling price of the product.