Physical Analysis of the Devices
Step by Step Reconstruction of the Process Flow
Cost of Manufacturing and Estimation of Selling Price
System Plus Consulting is proud to publish the reverse costing report of the
world's first 3-Axis MEMS accelerometer supplied by STMicroelectronics and
using Through-Silicon-Via technology.
The Component was extracted from a NOKIA phone and seems to be a special
version of the STM 3-Axis Accelerometer LIS302DL.
Packaged in a LGA-14 pin package, the device integrates two dies in a
side-by-side configuration and features an ultra low-power consumption that
allows power saving functions in consumer applications.
By removing the area reserved for I/O pads, the TSV process allows the MEMS
die area to be shrinked when compared to the standard accelerometer. The
manufacturing process uses an approach similar to the standard THELMA
technology, but adds major changes which increase the final wafer cost.
The report also provides a comparative analysis with the standard ST 3-Axis
MEMS Accelerometer, the LIS302DL.
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting is specialized in the cost analysis of
electronics from semiconductor devices to electronic systems. Around this main
line System Plus Consulting developed a complete range of services and costing
tools to provide in-depth production cost studies and estimation of the
objective selling price of the product.