• Japanese
  • Korean
  • Chinese
Cover Image

FLIR ISC0601B Micro-bolometer 25 micrometer pixel IR Sensor from i7 camera Reverse Costing Analysis

Physical Analysis of the Device

Step by Step Reconstruction of the Process Flow

Cost of Manufacturing and Estimation of Selling Price

System Plus Consulting is proud to publish a reverse costing report on the micro-bolometer ISC0601B, 320x240 pixels supplied by FLIR.

Flir micro-bolometer technology is based on a vanadium oxide material, with micro-machined structures. Each pixel contains active membranes suspended at 2μm above the readout circuit.

This micro-bolometer is suitable for various applications including thermography, industrial inspection, Building & Renewable Energy, Border Security and coastal surveillance, automotive, etc.

This report provides complete teardown of the Flir ISC0601B sensor with:

  • Detailed photos
  • Material analysis
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

The micro-bolometer is part of the FLIR i7 thermal imaging camera. A reverse costing report on the i7 camera is available separately.

Table of Contents

Glossary

1. Overview/Introduction

  • Glossary
  • Executive Summary
  • Reverse Costing Methodology

2. Company Profile

  • ULIS Profile
  • On Semiconductor

3. Physical Analysis

  • Synthesis of the Physical Analysis
  • IR Camera
  • Package
  • Package X-ray
  • Package front side
  • Package gear side
  • Read Out IC
  • ROIC Functions
  • ROIC technology
  • Micro-Biometer
  • Reflector
  • Structure of Pixel
  • Microbridge
  • Contact structure
  • Compensation Pixels
  • Principle Operation
  • Physical data summary

4. Manufacturing Process Flow

  • Global Overview
  • ROIC Process Flow
  • Description of the ROIC Wafer Fabrication Unit
  • Micro-bolometer Process Flow
  • Description of the Micro-Bolometer Wafer Fabrication Unit
  • Packaging

5. Cost analysis

  • Main Steps of Economic Analysis
  • Yields Explanation
  • Die per wafer & Probe Test
  • ROIC Wafer Front-End Cost

6. 200mm Micro-Bolometer Cost analysis

  • Micro-Bolometer Wafer Cost
  • Micro-Bolometer Step Cost
  • Micro-Bolometer Equipment Cost
  • Micro-Bolometer Consumable Cost
  • Back-End 1: Packing, Final test
  • Component cost (FE + BE 0+ BE 1)
  • Yields Synthesis

Conclusion

Show More
Pricing