Market Research Report

Mitsubishi 6th gen CSTBT 1200V CM450DY-24S IGBT Power Module Reverse Costing Analysis

cover Published by System Plus Consulting
Published Product code 246149
Content info 102 Pages
Price

Introduction

Abstract

Physical Analysis of the Device

Step by Step Reconstruction of the Process Flow

Cost of Manufacturing & Estimation of Selling Price

System Plus Consulting is pleased to publish a reverse costing report on the 6th generation of CSTBT power IGBT from MITSUBISHI. Discover the first IGBT with 2 metals for the emitter, with sophisticated impurity profiles for the CS layer and P layer. Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the CSTBT device, a 1200V, 150A IGBT and the CM450DY-24S, 1200V 450A, half-bridge IGBT module.

This report provides a reverse costing of the POWER TRANSISTOR and POWER MODULE with:

  • Detailed photos & Material analysis
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting is specialized in the cost analysis of electronics from semiconductor devices to electronic systems. Around this main line System Plus Consulting developed a complete range of services and costing tools to provide in-depth production cost studies and estimation of the objective selling price of the product.

Table of Contents

Table of Contents

Executive Summary

Hypothesis

Table of Contents

1. Technology Analysis of the module

  • Power Module Dimensions
  • Power Module Dissassembly
  • Transistors and Diodes
  • Wire bondings
  • Cross-section
  • AlN Substrate

2. Technology Analysis - IGBT Die

  • IBGT Die Dimensions
  • About the cross-sections
  • Die Thickness & Gate Contact
  • IGBT Transistor Cross-section
  • IGBT Transistor Structure
  • Mitsubishi CSTBT 6Th generation
  • Synthesis

3. Technology Analysis - Diode Die

4. Manufacturing Process flow

  • IGBT Process Flow
  • Diode Process Flow
  • AMB Substrate Process Flow
  • Module Process Flow

5. Cost Analysis

  • Economic Analysis Hypotheses
  • 5.1. IGBT
    • Component Summary
    • Wafer Fabrication Unit
    • Back-End 0
    • Yield Summary
    • Unprobed Wafer Cost
    • Die Cost
  • 5.2. Diode
  • 5.3. Module
    • AMB Substrate Cost
    • Module Cost
    • Final Test Cost
    • Component Cost

5. Selling Price Estimation

  • Selling Price Estimation
  • Manufacturer Ratios
  • Manufacturer Price
  • Glossary
  • Contact

Mitsubishi 6th gen CSTBT 1200V CM450DY-24S IGBT Power Module Reverse Costing Analysis published by System Plus Consulting in June 30, 2012. This report consists of 102 Pages and the price starts from US $ 3630.

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