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STMicroelectronics LSM330D 6-Axis Inertial Module 3D Accelerometer & 3D Gyroscope Reverse Costing Analysis

Physical Analysis of the Devices Step by Step Reconstruction of the Process Flow Cost of Manufacturing and Estimation of Selling Price

System Plus Consulting is proud to publish the reverse costing report of the new 6-axis MEMS Inertial Module supplied by STMicroelectronics.

The LSM330D is a system-in-package featuring a 3-axis accelerometer and a 3-axis gyroscope. With a 3x5.5x1mm size, it belongs to the smallest inertial modules for consumer applications. It is manufactured with the same ST THELMA process used for more than 1.5billon MEMS devices. The LSM330D is targeted for consumer applications: GPS navigation systems, Impact recognition and logging, Gaming.....

This report provides complete teardown of the MEMS IMU with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

Table of Contents

Glossary

Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

ST Company Profile

  • Product Range
  • Business Model Physical analysis
  • Physical Analysis Methodology
  • Package Characteristics & Markings
  • Package Opening
  • Accelerometer & Gyroscope
    • ASIC - Dimensions
    • ASIC - Markings
    • ASIC - Delayering
    • ASIC - Cross-Section
    • MEMS - Dimensions
    • MEMS - Markings
    • MEMS - Bond Pads Opening
    • MEMS - Cap Opening
    • MEMS - Cap
    • MEMS - Sensing Area
    • MEMS - Cross-section
  • ST 3-Axis Accelerometers MEMS Dies Comparison
  • ST 3-Axis Gyroscopes MEMS Dies Comparison

Manufacturing Process Flow

  • Overview
  • ASIC/MEMS Process Flows
  • Description of the Wafer Fabrication Units

Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Yields Explanation
  • Yields Hypotheses
  • ASICs Front-End Cost
  • ASICs Back-End 0 Cost (Probe Test and Dicing)
  • ASICs Dies Cost (Front End + Back End 0)
  • MEMSs Front-End Cost
  • MEMSs Front-End Cost per Process Steps
  • MEMSs Front-End: Equipment Cost per Family
  • MEMSs Front-End: Material Cost per Family
  • Back-End 0: Probe Test and Dicing Cost
  • Back-End 0: Dies Cost (Front End + Back End 0)
  • Back-End 1: Packaging Cost
  • Back-End 1: Final Test & Calibration Cost
  • LSM330D Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

  • Manufacturer Financial Ratios
  • LSM330D Estimated Selling Price

Conclusion

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