Physical Analysis of the Devices Step by Step Reconstruction of the Process
Flow Cost of Manufacturing and Estimation of Selling Price
System Plus Consulting is proud to publish the reverse costing report of the
new 6-axis MEMS Inertial Module supplied by STMicroelectronics.
The LSM330D is a system-in-package featuring a 3-axis accelerometer and a 3-axis gyroscope.
With a 3x5.5x1mm size, it belongs to the smallest inertial modules for
consumer applications. It is manufactured with the same ST THELMA process used
for more than 1.5billon MEMS devices. The LSM330D is targeted for consumer
applications: GPS navigation systems, Impact recognition and logging,
Gaming.....
This report provides complete teardown of the MEMS IMU with:
Detailed photos
Material analysis
Schematic assembly description
Manufacturing Process Flow
In-depth economical analysis
Manufacturing cost breakdown
Selling price estimation
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting is specialized in the cost analysis of electronics from
semiconductor devices to electronic systems. Around this main line System Plus
Consulting developed a complete range of services and costing tools to provide
in-depth production cost studies and estimation of the objective selling price
of the product.
Table of Contents
Table of Contents
Glossary
Overview/Introduction
Executive Summary
Reverse Costing Methodology
ST Company Profile
Product Range
Business Model Physical analysis
Physical Analysis Methodology
Package Characteristics & Markings
Package Opening
Accelerometer & Gyroscope
ASIC - Dimensions
ASIC - Markings
ASIC - Delayering
ASIC - Cross-Section
MEMS - Dimensions
MEMS - Markings
MEMS - Bond Pads Opening
MEMS - Cap Opening
MEMS - Cap
MEMS - Sensing Area
MEMS - Cross-section
ST 3-Axis Accelerometers MEMS Dies Comparison
ST 3-Axis Gyroscopes MEMS Dies Comparison
Manufacturing Process Flow
Overview
ASIC/MEMS Process Flows
Description of the Wafer Fabrication Units
Cost Analysis
Synthesis of the Cost Analysis
Main Steps of Economic Analysis
Yields Explanation
Yields Hypotheses
ASICs Front-End Cost
ASICs Back-End 0 Cost (Probe Test and Dicing)
ASICs Dies Cost (Front End + Back End 0)
MEMSs Front-End Cost
MEMSs Front-End Cost per Process Steps
MEMSs Front-End: Equipment Cost per Family
MEMSs Front-End: Material Cost per Family
Back-End 0: Probe Test and Dicing Cost
Back-End 0: Dies Cost (Front End + Back End 0)
Back-End 1: Packaging Cost
Back-End 1: Final Test & Calibration Cost
LSM330D Component Cost (FE + BE 0 + BE 1)
Estimated Price Analysis
Manufacturer Financial Ratios
LSM330D Estimated Selling Price
Conclusion
STMicroelectronics LSM330D 6-Axis Inertial Module 3D Accelerometer & 3D Gyroscope Reverse Costing Analysis published by System Plus Consulting in August 30, 2012. This report consists of 140 Pages and the price starts from US $ 3240.
