EMBEDDED INTEGRATED COMPUTER SYSTEMS, 5TH EDITION GLOBAL MARKET ANALYSIS VOLUME 01: COMMUNICATIONS APPLICATIONS

This publication has been discontinued on May 30, 2011.

Introduction

Abstract

This report examines present and future markets for Embedded Integrated Computer Systems (EICSs) in communications applications on a global basis. The study includes:

• Market sizes and forecasts through the year 2010
• Analysis of market and technology trends
• User data on trends, expectations, and product preferences
• Strategic recommendations

Table of Contents

I EXECUTIVE SUMMARY

• GENERAL OVERVIEW
• GEOGRAPHICAL DISTRIBUTION
• COMMUNICATIONS MARKET SEGMENTS
• SYSTEM ARCHITECTURES
• USER SURVEY RESULTS
• SELECTED RECOMMENDATIONS
• LEADING VENDORS

II SCOPE AND METHODOLOGY

• SCOPE
• Definition of Terms
• Segmentation
• Other Report Content
• METHODOLOGY

III INDUSTRY STRUCTURE

• INDUSTRY PARTICIPANTS
• SEGMENTATION MODEL
• SYSTEM CONFIGURATIONS
• SALES ORGANIZATIONS
• CUSTOMER CLASSES
• RoHS

IV MARKET SIZE, SEGMENTATIONS, AND FORECASTS

• TOTAL EICS COMMUNICATIONS MARKET
• MERCHANT EICS COMMUNICATIONS MARKET
• Unit Volumes & Pricing
• Geographic Distribution
• Sales/Distribution Channels
• Customer Classes
• Market Segments
• Applications
• System Configurations
• System Architectures
• Passive Backplane Bus Architectures
• Active Backplane Motherboard Form Factors
• Enclosure/Mounting Style
• CPU Classes
• CPU Types
• Number of Processors
• Services Offered

V USER REQUIREMENTS AND TRENDS

• INTRODUCTION
• METHODOLOGY
• FOCUS ON COMMUNICATIONS APPLICATIONS
• SOURCES FOR EMBEDDED INTEGRATED COMPUTER SYSTEMS (EICSS)
• HARDWARE COMPUTER PLATFORM ARCHITECTURES
• Passive Backplane Architectures
• Active Backplane Architectures
• Stackable Architectures
• TYPES OF CONFIGURATIONS
• ENCLOSURES
• Passive Backplane
• Active Backplane
• KEY TECHNOLOGIES
• MICROPROCESSOR USE
• SINGLE AND MULTIPLE PROCESSORS
• SOFTWARE OPERATING SYSTEMS
• SUBSYSTEM CAPABILITIES
• SYSTEM FAILURES
• ETHERNET CONNECTIVITY
• TYPES OF COOLING
• SUPPORT SERVICES
• UPGRADES AND MAINTENANCE
• PRODUCT FEATURES AND PERFORMANCE
• COMMERCIAL CONSIDERATIONS
• SOURCES FOR INFORMATION

VI COMPETITIVE ANALYSIS

• COMMUNICATIONS EICS VENDOR MARKET SHARES
• COMMUNICATIONS EICS GEOGRAPHICAL VENDOR MARKET SHARES
• COMMUNICATIONS EICS SYSTEM ARCHITECTURE VENDOR MARKET SHARES
• COMMUNICATIONS EICS ENCLOSURE TYPE VENDOR MARKET SHARES

VII STRATEGY AND RECOMMENDATIONS

• GENERAL
• Specific Recommendations
• SYSTEM ARCHITECTURES
• Specific Recommendations
• MICROPROCESSORS
• Specific Recommendations
• SERVICES
• Specific Recommendations

VIII VENDOR PROFILES

• ADVANTECH CO., LTD.
• ALCATEL
• APPRO INTERNATIONAL
• CISCO SYSTEMS, INC.
• CONTINUOUS COMPUTING
• ERICSSON FIXED NETWORKS & MOBILE NETWORKS GROUPS
• GERMANE SYSTEMS
• HEWLETT-PACKARD ENTERPRISE, STORAGE, AND SERVERS GROUP
• HUAWEI TECHNOLOGIES CO., LTD.
• IBM HARDWARE GROUP
• JUNIPER NETWORKS, INC.
• KONTRON AG
• LUCENT NETWORK SOLUTIONS GROUP
• MOTOROLA EMBEDDED COMMUINCATIONS COMPUTING
• MOTOROLA NETWORKS DIVISION
• NATIONAL INSTRUMENTS
• NOKIA SIEMENS NETWORKS
• NORTEL NETWORKS MOBILITY & CONVERGED CORE NETWORKS
• RADISYS CORPORATION
• SUN MICROSYSTEMS, INC
• ZTE CORPORATION

• APPENDIX: VENDOR LIST

Related Reports