MERCHANT COMPUTER BOARDS FOR REAL-TIME AND EMBEDDED APPLICATIONS 2008 MARKET INTELLIGENCE SERVICE COMPLETE SERVICE (ALL 5 VOLUMES)

MERCHANT COMPUTER BOARDS FOR REAL-TIME AND EMBEDDED APPLICATIONS 2008 MARKET INTELLIGENCE SERVICE COMPLETE SERVICE (ALL 5 VOLUMES) published by VDC Research Group in January, 2009. This report consists of 1149 Pages - 991 Exhibits and the price starts from US $ 24500.

Introduction

Abstract

DETAILED OVERVIEW:

The Merchant Computer Boards for Real-Time and Embedded Applications: 2008 Market Intelligence Service is comprised of 5 volumes.

Volume 1 - Slot Single Board Computers and Embedded CPU Blades

VDC is pleased to announce the release of the first Volume of its Merchant Computer Boards for Embedded/Real-Time Applications Market Intelligence Program, 2008. The Volume comprises an examination of the present and future markets for Slot Single Board Computers and Embedded CPU Blades. Included are current market sizes and forecasts through year 2012, along with brief descriptions of emerging technologies in this space.

Volume 2 - Embedded Motherboards

The second volume of VDC' s Merchant Computer Boards for Embedded/Real-Time Applications Market Intelligence Program, 2008 examines the present and future markets for embedded motherboards. Included are current market sizes and forecasts through year 2012, along with brief descriptions of emerging technologies in this space. This volume also contains vertical market coverage that has been substantially expanded over that offered in previous studies.

Volume 3 - Mezzanine Cards and Computers-on-Modules

As part of its Merchant Computer Boards for Embedded and Real-Time Applications Market Intelligence Program 2008, VDC Research Group (VDC) is pleased to announce the release of a study that comprises an examination of the present and future markets for mezzanine cards, Computers-on-Modules (COMs), and carriers for these. Included are current market sizes and forecasts through the year 2012, along with brief descriptions of the technologies involved. Trends are identified, markets analyzed, and strategies recommended.

Volume 4 - Stackables

As part of its Merchant Computer Boards for Embedded and Real-Time Applications Market Intelligence Program 2008, VDC Research Group (VDC) is pleased to announce the release of a study that comprises an examination of the present and future markets for Stackable computer boards.

COMPLETE SERVICE - All 5 volumes

As part of its Merchant Computer Boards for Embedded and Real-Time Applications Market Intelligence Program 2008, VDC Research Group (VDC) is pleased to announce the release of a study that comprises an examination of the present and future markets for Stackable computer boards.

Table of Contents

VOLUME 1: SLOT SINGLE BOARD COMPUTERS AND EMBEDDED CPU BLADES

I EXECUTIVE SUMMARY

• GENERAL
• Market Overview
• VME
• PCI
• ISA
• CompactPCI
• PCI-ISA
• ATCA
• AMC
• Vertical Markets
• CPU USE
• MULTI-CORE PROCESSOR USE
• OS VS. RTOS USE
• SELECTED RECOMMENDATIONS
• LEADING VENDORS

II SCOPE AND METHODOLOGY

• SCOPE
• Definitions of Terms
• Boards Excluded from the Study
• Blades
• Segmentation
• Other Report Content
• METHODOLOGY
• "Platinum" and "Gold"Vendor Ratings

III INDUSTRY STRUCTURE

• TRADE ASSOCIATINS
• Hyper Tanspoft™ Consortium
• lnfiniBand™ Trade Association(IBTA)
• PCI Industrial Computer Maufactuers Group(PICMG)®
• PCI Special lnterest Group (PCI SIG)®
• PXI Systems Alliance (PXISA)
• RapidlO® Trade Association
• VMEbus International Trade Association (VITA)®
• VXIbus Consortium
• SIGNIFICANT MERGER AND ACQUISITION ACTIVITIES IN SBC/BIADE
• SPACE

IV OVERVIEW

• GENERAL
• Blaes
• Bus and Blade Architectures
• MARKET OVERVIEW
• Comparisons with Historical Dates
• Geographic Distribution
• Sales/Distribution Channels
• Customer Classes
• Market Leaders

V VME

• TOTAL VME SBC/BLADE MARKET
• VERTICAL MARKETS
• GEOGRAPHIC DSTRIBUTION
• VME ARCHITECTURES
• SWITCH FABRIC USE
• BOARD SIZES
• DEGREES OF CUSTOMIZATION
• BOARD COOLING
• CPU INSTALLATION
• CPU TYPES
• MULTI-CORE PROCESSOR USE
• MULTIPLE DISCRETE PROCESSOR USE
• MEZZANINE SITES
• OPERATING SYSTEMS
• GENERAL COMMENTS
• INDUSTRY LEADERS

VI COMPACTPCI

• TOTALCOMPACTPCI SBC/BLADE MARKET
• VERTICAL MARKETSAL
• GEOGRAPHIC DSTRIBUTION
• COMPACTPCI ARCHITECTURES
• SWIT' CH FABRIC USE
• BOARD SIZES
• DEGREES OF CUSTOMIZATION
• BOARD COOLIG
• CPU INSTALLAON
• CPU TYPES
• MULTI-CORE PROCSSORE USE
• MULTIPLE DISCRETE PROCSSORE USE
• MEZZANINE SITES
• OPERATING SYSTEMS
• INDUSTRY LEADERS

VII PCI

• TOTAL PCI SBC/BLADE MARKET
• VERTICAL MARKETS
• GEOGRAPHIC DISTRIBUTION
• PCI ARCHITECTURES
• DEGREES OF CUSTOMIZATION
• CPU INSTALLATION
• CPU TYPES
• MULTI-CORE PROCESSOR USE
• MULTIPLE DISCRETE PROCESSOR USE
• OPERATING SYSTEMS
• INDUSTRY LEADERS

VIII ISA

• TOTAL ISA SBC MARKET
• VERTICAL MARKETS
• GEOGRAPHIC DISTRIBUTION
• DEGREES OF CUSTOMIZATION
• CPU INSTALLATION
• CPU TYPES
• MULTI-CORE PROCESSOR USE
• OPERATING SYSTEMS
• INDUSTRY LEADERS

IX PC-ISA

• TOTAL PCI-ISA SBC MARKET
• VERTICAL MARKETS
• GEOGRAPHIC DISTRIBUTION
• PII-ISA ARCHITECTURES
• DEGREES OF CUSTOMIZATION
• CPU INSTALLATION
• CPU TYPES
• MULTI-CORE PROCESSOR USE
• OPERATING SYSTEMS
• INDUSTRY LEADERS

X ATCA CPU BLADES

• TOTAL ATCA CPU BLADE MARKET
• VERTICAL MARKETS
• GEOGRAPHIC DISTRIBUTION
• SWITCH FABRIC USE
• DEGREEES OF CUSTOMIZATION
• CPU TYPES
• MULTI-CORE PROCESSOR USE
• MEZZANINE SITES
• OPERATING SYSTEMS
• INDUSTRY LEADERS

XI AMC CPU CARDS

• TOTAL AMC CPU CARD MARKET
• VERTICAL MARKETS
• GEOGRAPHIC DISTRIBUTION
• SWITCH FABRIC USE
• DEGREES OF CUSTOMIZATION
• CPU TYPES
• MULTI-CORE PROCESSOR USE
• MULTIPLE DISCRETE PROCESSOR USE
• OPERATING SYSTEMS
• INDUSTRY LEADERS

XII VERTICAL MARKETS

• OVERALL VERTICAL MARKET SEGMENTATION
• COMMUNICATIONS: EDGE
• COMMUNICATIONS: CORE
• INDUSTRIAL AUTOMATION AND CONTROL
• INSTRUMENTATION
• MEDICAL
• MILITARY/AEROSPACE
• TRANSPORTATION
• ENTERPRISE

XIII USER DATA

• SURVEY RESPONDENT DEMOGRAPHICS
• EVALUATION CRITERIA
• SLOT SBC/CPU BLADE ARCHITECTURES
• REASON FOR SELECTING SLOT SBCS/CPU BLADES
• EXPECTED CHANGES IN PURCHASES
• PROCESSORS USED
• SEGMENTATION BY ARCHITECTURE
• VME, VXS VPX
• CompactPCI
• PCI
• PCI-ISA
• ISA
• ATCA
• VERTICAL MARKETS
• Automotive
• Communications: Core
• Communications: Edge
• Industrial Automation
• Instrumentation
• Medical
• Military/Aerospace
• Transportation

XIV OBSERVATION AND RECOMMENDATIONS

• GENERAL
• VME SBCS AND BLADES
• Specific Recommendations
• COMPACT PCI SBCS AND BLADES
• Specific Recommendations
• EDGE-CONNECTED SBCS (PCI, ISA, PCI-ISA)
• PCI SBCS
• Specific Recommendations
• ISA SBCS
• Specific Recommendations
• PCI-ISA
• Specific Recommendations
• ATCA CPU BLADES
• Specific Recommendations
• AMC CPU Cards
• Specific Recommendations

XV VENDOR PROFILES

• ADLINK TECHNOLOGY, INC
• ADVANTECH
• AITECH
• CONCURRENT TECHNOLOGIES
• CONTINUOUS COMPUTING
• CURTISS WRIGHT CONTROLS EMBEDDED COMPUTING
• DIVERSIFIED TECHNOLOGY, INC
• EMERSON NETWORK POWER EMBEDDED COMPUTING
• GE FANUC INTELLIGENT PLATFORMS
• GENERAL MICRO SYSTEMS
• KONTRON AG
• MEN MIKRO
• MERCURY COMPUTER SYSTEMS, INC.
• PERFORMANCE TECHNOLOGIES, INC.
• RADISYS CORPORATION
• SUN MICROSYSTEMS, INC.
• THALES COMPUTERS

VOLUME 2: EMBEDDED MOTHERBOARDS

I EXECUTIVE SUMMARY

• MARKET OVERVIEW
• FORM FACTOR CLASSES
• VERTICAL MARKETS
• CPU USE
• MULTI-CORE PROCESSOR USE
• OS vs.RTOS USE
• SELECTED RECOMMENDATIONS
• LEADING MOTHERBOARD VENDORS

II SCOPE AND METHODOLOGY

• SCOPE
• Definitions of Terms
• Boards Excluded from the Study
• Segmentation
• Other Report Content
• METHODOLOGY
• "Platinum" and "Gold" Vendor Ratings

III INDUSTRY STRUCTURE

• INDUSTRY PARTICIPANTS
• TRADE ASSOCIATIONS
• The PC/104 Consortium: EBX and EPIC
• Small Form Factor Special Interest Group (SFF-SIG): Pico-ITX
• SIGNIFICANT MERGERS AND ACQUISITONS IN EMBEDDED MOTHERBOARD MARKET

IV INDUSTRY OVERVIEW

• FORM FACTOR CLASSES
• VERTICAL MARKETS
• GEOGRAPHIC DISTRIBUTION
• SALES AND DISTRIBUTION CHANNELS
• CONSUMING CUSTORMER CLASSES
• LEADING MOTHERBOARD VENDORS

V "DESKTOP FORM FACTOR" MOTHERBOARDS

• GENERAL OVERVIEW
• Form Factors
• Brief Technical Descriptions
• MARKET OVERVIEW
• Overall Market
• Form Factors
• Vertical Markets
• Degrees of Customization
• Processors
• Expansion Slot Architectures
• Operating Systems
• Integrated Features
• Leading Vendors

VI "DESKTOP FORM FACTOR" MOTHERBOARDS -VERTICAL MARKETS

• OVERALL VERTICAL MARKET SEGMENTATION
• COMMUNICATIONS: EDGE
• COMMUNICATIONS: CORE
• INDUSTRIAL AUTOMATION AND CONTROL
• INSTRUMENTATION
• MEDICAL
• MILITARY/AEROSPACE/DEFENSE
• TRANSPORTATION

VII "EMBEDDED FORM FACTOR" MOTHERBOARDS

• GENERAL OVERVIEW
• Form Factors
• Brief Technical Descriptions
• MARKET OVERVIEW
• Overall Market
• Form Factors
• Vertical Markets
• Degrees of Customization
• Processors
• Expansion Architectures
• Operating Systems
• Integrated Features
• Leading Vendors

VIII "EMBEDDED FORM FACTOR" MOTHERBOARDS -VERTICAL MARKETS

• OVERALL VERTICAL MARKET SEGMENTATION
• COMMUNICATIONS: EDGE
• COMMUNICATIONS: CORE
• INDUSTRIAL AUTOMATION AND CONTROL
• INSTRUMENTATION
• MEDICAL
• MILITARY/AEROSPACE/DEFENSE
• TRANSPORTATION

IX DEMAND SIDE DATA

• SURVEY RESPONDENT DEMOGRAPHICS: ALL MOTHERBOARDS
• NON-TECHNICAL VENDOR SELSECTION CRITERIA: ALL MOTHERBOARDS
• MOTHERBOARD FORM FACTORS
• REASON FORM SELECTING MOTHER BOARDS
• EXPECTED CHANGES IN MOTHERBOARD PURCHASES
• PROCESSORS USED ON MOTHERBOARDS
• SURVEY RESPONDENT DEMOGRAPHICS: DESKTOP FORM FACTOR MOTHERBOARDS
• NON-TECHNICAL VENDOR SELECTION CRITERIA: DESKTOP FORM FACTOR MOTHERBOARDS
• REASON FOR SELECTING DESKTIOP FORM FACTOR MOTHERBOARDS
• EXPECTED CHANGES IN DESKTOP FORM FACTOR MOTHERBOARD PURCHASES
• PROCESSORS USED ON DESKTOP FORM FACTOR MOTHERBOARDS
• SURVEY RESPONDENT DEMOGRAPHICS: EMBEDDED FORM FACTOR MOTHERBOARDS
• NON-TECNICAL VENDOR SELECTION CRITERIA: EMBEDDED FORM FACTOR MOTHERBOARDS
• REASON FOR SELECTIN EMBEDDED FORM FACTOR MOTHERBOARDS
• EXPECTED CHAGES IN EMBEDDED FODRM FACTOR MOTHERBOARD PURCHASES
• PROCESSORS USED ON EMBEDDED FORM FACTOR MOTHERBOARDS
• PROCESSORS USED ON "OTHER" FORM FACTOR MOTHERBOARDS

X OVSERVATIONS AND RECOMMENDATIONS

• MARKET POTENTIAL
• THE OVERALL EMBEDDED MOTHERBOARD MARKET - OBSERVATIONS
• FORM FACTORS
• Desktop Class Form Factors
• Embedded Class Form Factors
• CUSTOMIZATION
• MICROPROCESSORS
• OPERATING SYSTEMS
• EXPANSION CAPABILITY
• Desktop Class Form Factors
• Embedded Form Factors
• INTEGRATED FEATURES
• VERTICAL MARKETS
• SPECIFIC RECOMMENDATIONS
• Overall Embedded Motherboards
• Desktop Class Motherboard Vendors
• Embedded Class Motherboard Vendors

XI VENDOR PROFILES

• AAEON TECHNOLOGY, INC.
• ADLINK TECHNOLOGY, INC.
• ADVANTECH
• AMPROCOMPUTERS, INC.
• ANOVO CO., LTD.
• AVALUE TECHNOLOGY INC.
• AXIOMTEK CO., LTD.
• DFI, INC.
• EUROTECH S.P.A
• IBASE TECHNOLOGY, INC.
• IEI TECHNOLOGY CORPORATION
• KONTRON AG
• PORTWELL, INC.
• PADISYS CORPORATION
• SUN MICROSYSTEMS, INC.
• SUPER MICRO COMPUTER, INC.
• TYAN COMPUTER
• VIA TECHNOLOGIES, INC.

VOLUME 3: MEZZANINE CARDS AND COMS

I EXECUTIVE SUMMARY

• GENERAL OVERVIEW
• Segmentation by Product Class
• VERTICAL MARKETS
• SELECTED RECOMMENDATIONS
• LEADING VENDORS

II SCOPE & METHODOLOGY

• SCOPE
• DEFINITIONS OF TERMS
• BOARDS EXCLUDED FROM THE STUDY
• SEGMENTATION
• OTHER REPORT CONTENT
• METHODOLOGY
• "PLATINUM" AND "GOLD" VENDOR RATINGS

III INDUSTRY STRUCTURE

• INDUSTRY PARTICIPANTS
• TRADE ORGANIZATIONS
• ETX Industrial Group
• Mezzanines International, fka Group IPC
• PICMG
• VITA (VMEbus International Trade Association)
• XTX Consortium
• MERGERS AND ACQUISITIONS

IV INDUSTRY OVERVIEW

• CURRENT AND PROJECTED SHIPMENTS
• Segmentation by Product Class
• GEOGRAPHIC DISTRIBUTION, COMBINED PRODUCT CLASSES
• SALES AND DISTRIBUTION CHANNELS
• VERTICAL MARKETS
• LEADING VENDORS

V MEZZANNE CARDS AND CARRIERS

• DEFINITIONS
• "True" Mezzanine Cards vs. "Quasi" Mezzanine Cards
• TECHNICAL OVERVIEW
• Industry Pack (IP)
• PMC
• XMC
• AMC (Advanced Mezzanine Card)
• Micro TCA
• STUDY FINDINGS: GENERAL
• Over Market
• Market Growth and Segmentation by Mezzanine Architecture
• Geographic Distribution of Shipments
• Vertical Markets
• Degree of Customization
• Processor vs. Non-Processor Types
• PROCESSOR MEZZANINE CARDS
• Segmentation by Mezzanine Architecture
• Segmentation by Processor Use
• NON-PROCESSOR MEZZANINE CARDS
• OPERATING SYSTEM USE
• HIGH SPEED SERIAL INTERCONNECT USE
• NON-INTELLIGENT MEZZANINE CARD CARRIER BUS ARCHITECTURES
• LEADING VENDORS OF MEZZANINE CARDS AND CARRIERS, 2007

VI MEZZANINE CARD AND CARRIER VERTICAL MARKETS

• OVERALL VERTICAL MARKET SEGMENTATION
• COMMUNICATIONS: EDGE
• Mezzanine Architectures
• Degree of Customization
• Processor vs. Non-Processor Cards
• Primary Processor Types
• Multi-Core CPU Use
• Single us. Multiple Discrete CPU Use
• Non-Processor Functional Types
• Operating Systems
• Carrier Bus Architectures
• COMMUNICATIONS: CORE
• Mezzanine Architectures
• Degree of Customization
• Processor vs. Non-Processor Cards
• Primary Processor Types
• Multi-Core CPU Use
• Single us. Multiple Discrete CPU Use
• Non-Processor Functional Types
• Operating Systems
• Carrier Bus Architectures
• INDUSTRIAL AUTOMATION & CONTROL
• Mezzanine Architectures
• Degree of Customization
• Processor vs. Non-Processor Cards
• Primary Processor Types
• Multi-Core CPU Use
• Single vs. Multiple Discrete CPU Use
• Non-Processor Functional Types
• Operating Systems
• Carrier Bus Architectures
• INSTRUMENTATION
• Mezzanine Architectures
• Degree of Customization
• Processor vs. Non-Processor Cards
• Primary Processor Types
• Multi-Core CPU Use
• Single vs. Multiple Discrete CPU Use
• Non-Processor Functional Types
• Operating Systems
• Carrier Bus Architectures
• MEDICAL
• Mezzanine Architectures
• Degree of Customization
• Processor vs. Non-Processor Cards
• Primary Processor Types
• Multi-Core CPU Use
• Single vs. Multiple Discrete CPU Use
• Non-Processor Functional Types
• Operating Systems
• Carrier Bus Architectures
• MILITARY, AEROSPACE & DEFENSE
• Mezzanine Architectures
• Degree of Customization
• Processor vs. Non-Processor Cards
• Primary Processor Types
• Multi-Core CPU Use
• Single vs. Multiple Discrete CPU Use
• Non Processor Functional Types
• Operating Systems
• Carrier Bus Architectures
• TRANSPORTATION
• Mezzanine Architectures
• Degree of Customization
• Processor vs. Non-Processor Cards
• Primary Processor Types
• Multi-Core CPU Use
• Single vs. Multiple Discrete CPU Use
• Non-Processor Functional Types
• Operating Systems
• Carrier Bus Architectures
• "OTHER" VERTICALS
• Mezzanine Architectures
• Degree of Customization
• Processor vs. Non-Processor Cards
• Primary Processor Types
• Multi-Core CPU Use
• Single vs. Multiple Discrete CPU Use
• Non-Processor Functional Types
• Operating Systems
• Carrier Bus Architectures

VII MEZZANINE CARD DEMAND SIDE DATA

• DEMAND SIDE DATA
• SURVEY RESPONDENT DEMOGRAPHICS
• NON-TECHNICAL VENDOR SELECTION CRITERIA
• MEZZANINE ARCHITECTURES
• REASONS FOR SELECTING MEZZANINE CARDS
• EXPECTED CHANGES IN MEZZANINE CARD PURCHASES
• PROCESSORS USED ON MEZZANINE CARDS
• SURVEY RESPONDENT DEMOGRAPHICS: AMC CARD USERS
• NON-TECHNICAL VENDOR SELECTION CRITERIA: CARD USERS
• REASONS FOR SELECTING AMC CARDS
• EXPECTED CHANGES IN AMC CARD PURCHASES
• PROCESSORS USED ON AMC CARDS
• SURVEY RESPONDENT DEMOGRAPHICS: PMC CARD USERS
• NON-TECHNICAL VENDOR SELECTIOIN CRITERIA: PMC CARDS
• REASONS FOR SELECTING PMC CARDS
• EXPECTED CHANGES IN PMC CARD PURCHASES
• PROCESSORS USED ON PMC CARDS
• SURVEY RESPONDENT DEMOGRAPHICS: XMC CARD USERS
• NON-TECHNICAL VENDOR SELECTION CRITERIA: XMC CARDS
• REASONS FOR SELECTING XMC CARDS
• EXPECTED CHAGES IN XMC CARD PURCHASES
• PROCESSORS USED ON XMC CARDS
• SURVEY RESPONDENT DEMOGRAPHICS: "OTHER" CARDS
• REASONS FODR SELECTING "OTHER" CARD PURCHASES
• PROCESSORS USED ON "OTHER" CARDS

VIII COMS AND COM CARRIERS

• COMPUTERS-ON-MODULES (COMS)
• TECHNICAL OVERVIEW
• DIMM-PC
• COM Express
• ETX
• XTX
• Proprietary and Other Architectures
• Interchangeability Issues
• STUDY FINDINGS
• Overall Market
• Market Growth and Segmentation by Form Factor
• Geographic Distribution of Shipments
• Vertical Markets
• Degree of Customization
• DIMM-PC: Compliance with Specification
• COM Express Modules: Segmentation by Type
• COM Modules: Segmentation by Processor Type
• DIMM-PCs: Segmentation by Processor Type
• COM Express Modules: Segmentation by Processor Type
• ETX Modules: Segmentation by Processor Type
• XTX Modules: Segmentation by Processor Type
• COM Modules: Integrated Features
• COM Modules: Estimated Operating System Use
• COM: Carriers: Standard vs. Custom
• COM Carriers: Segmented by Form Factor/Architecture
• Slot Card COM Carriers: Segmented by Bus Architecture
• LEADING VENDORS OF COMS AND COM CARRIERS, 2007

IX COM MODULES VERTICAL MARKETS

• OVERALL VERTICAL MARKET SEGMENTATION
• COMMUNICATIONS: EDGE
• Form Factors
• Degree of Customization
• Processor Types
• Multi-Core CPU Use
• Operating Systems
• COMMUNICATIONS: CORE
• Form Factors
• Degree of Customization
• Processor Types
• Multi-Core CPU Use
• Operating Systems
• INDUSTRIAL AUTOMATION 6 CONTROL
• Form Factors
• Degree of Customization
• Processor Types
• Multi-Core CPU Use
• Operating Systems
• INSTRUCTION
• Form Factors
• Degree of Customization
• Processor Types
• Multi-Core CPU Use
• Operating Systems
• MEDICAL
• Form Factors
• Degree of Customization
• Processor Types
• Multi-Core CPU Use
• Operating Systems
• MILITARY, AEROSPACE & DEFENSE
• Form Factors
• Degree of Customization
• Processor Types
• Multi-Core CPU Use
• Operating Systems
• TRANSPORTATION
• Form Factors
• Degree of Customization
• Processor Types
• Multi-Core CPU Use
• Operating-Systems
• OTHER (UNDEFINED) VERTICALS
• Form Factors
• Degree of Customization
• Processor Types
• Multi-Core CPU Use
• Operating System

X COMS DEMAND SIDE DATA

• DEMAND-SIDE DATA
• SURVEY RESPONDENT DEMOGRAPHICS
• NON-TECHNICAL VENDOER SELECTION CRITERIA
• COM FORM FACTORS
• REASON FOR SELECTING COMS
• EXPECTED CHANGES IN COM PURCHASES
• PROCESSORS USED ON COMS
• SURVEY RESPONDENT DEMOGRAPHICS: COM EXPRESS USERS
• NON-TECHNICAL VENDOR SELECTION CRITERIA: COM EXPRESS MODULES
• REASONS FOR SELECTING COMS IN GENERAL (COM EXPRESS USERS)
• REASONS FOR SELECTING COM EXPRESS, IN PARTICULAR
• CHARACTERISTICS OF COM EXPRESS TARGET APPLICATION(S)
• BOARDS/FORM FACTORS BEING REPLACED BY COM EXPRESS
• EXPECTED CHAGES IN COM EXPRESS PURCHASES
• PROCESSORS USED ON COM EXPRESS MODULES
• SURVEY RESPONDENT DEMOGRAPHICS: DIMM-PC MODULES
• REASONS FOR SELECTING DIMM-PC MODULELS
• SURVEY RESPONDENT DEMOGRAPHICS: ETX MODULE USERS
• NON-TECHNICAL VENDOR SELECTION CRITERIA: ETX MODULES
• REASONS FOR SELECTING ETX MODULRES
• EXPECTED CHAGES ETX MODULE PURCHASES
• PROCESSORS USED ON ETX MODULRES
• SURVEY RESPONDENT DEMOGRAPHICS "OTHER COM USERS
• NON-TECHNICAL VENDOR SELECTION CRITERIA "OTHER COMS
• REASONS FOR SELECTING "OTHER COM FORM FACTORS
• EXPECTED CHAGES IN "OTHER COM PURCHASES
• PROCESSORS USED ON "OTHER COMS

XI OBSERVATIONS AND RECOMMENDATIONS

• MEZZANINE CARDS
• Industry Pack
• PMC
• XMC
• AMC
• COMPUTERS-ON-MODULES (COMs)
• ETX
• COM Express
• XTX
• COM Carriers

XII VENDOR PROFILES

• ADLINK TECHNOLOGY, INC.
• ADVANTECH CO., LTD.
• COMPULAB, LTD.
• CURTISS-WRIGHT CONTROLS EMBEDDED COMPUTIN (CWCEC)
• DIGITAL-LOGIC AG
• EMERSON NETWORK POWER EMBEDDED COMPUTING
• GE FANUC INTELLIGENT PLATFORMS
• INTERPHASE CORPORATIN
• KONTRON AG
• MEN MIKRO
• MERCURY COMPUTER SYSTEMS, INC
• MSC VERTRIEBS GMBH
• PORTWELL, INC.
• RADISYS
• WAYS TO WORK WITH US

VOLUME 4: STACKABLES

I EXECUTIVE SUMMARY

GENERAL OVERVIEW PLATFORM CLASSES VERTICAL MARKETS CPU TYPES OPERATING SYSTEMS LEADING STACKABLE VENDORS

II SCOPE AND METHODOLOGY

• SCOPE
• DEFINITIONS OF TERMS
• BOARDS EXCLUDED FROM THE STUDY
• SEGMENTATION
• OTHER REPORT CONTENT
• METHODOLOGY

III INDUSTRY STRUCTURE

• INDUSTRY PARTICIPANTS
• TRADE ORGANIZATIONS AND STANDARDS
• The PC/104 Consortium
• Small Form Factor Special Interest Group (SFF-SIG)
• Stackable USB
• MERGERS AND ACQUISITIONS

IV INDUSTRY OVERVIEW

• PLATFORM CLASSES
• VERTICAL MARKETS
• GEOGRAPHIC DISTRIBUTION
• SALES AND DISTRIBUTION CHANNELS
• CONSUMING CUSTOMER CLASSED
• DEGREE OF CUSTOMIZATION
• PROCESSORTS
• OPERATING SYSTEMS
• LEADING STACKABLES VENDORS

V PC/104 FAMILY MODULES

• GENERAL OVERVIEW
• Expansion Architectures
• Technical Descriptions
• MARKET OVERVIEW
• Expansion Architectures
• Technical Descriptions
• MARKET OVERVIW
• Overall Market
• Architectures and Functional Classed
• Vertical Markets
• Geographic Distribution
• Sales & Distribution Channels
• Consuming Customer Classes
• Degree of Customization
• Processors
• Integrated features
• Operating Systems
• Functional Types
• Leading PC/104 Family Stackables Vendors, 2007

VI OTHER (NON PC/104) STACKABLES

• GENERAL OVERVIEW
• Form Factors
• Brief Technical Descriptions
• MARKET OVERVIEW
• Overall Market
• Form Factors
• Vertical Markets
• Degrees of Customization
• Processors
• Expansion Architectures
• Operating Systems
• Integrated Features
• Leading Vendors

VII DEMAND SIDE DATA

• DEMAND SIDE DATA
• SURVEY RESPONDENT DEMOGRAPHICS
• NON-TECHNICAL VENDOR SELECTION CRITERIA
• STACKABLES FORM FACTORS
• REASON FOR SELECTING STACKABLES
• EXPECTED CHANGES IN STACKABLES PURCHASES
• PROCESSORTS USED ON STACKABLES
• SURVEY RESPONDENT DEMOGRAPHICS; PC/104 FAMILY USERS
• NON-TECHNICAL VENDOR SELECTION CRITERIA: PC/104 FAMILY
• REASONS FOR SELECTING PC/104 FAMILY IN GENERAL
• EXPECTED CHAGES IN PC/104 FAMILY PURCHASE
• PROCESSORS USED ONPC/104 FAMILY STACKABLES
• SURVEY RESPONDENT DEMOGRAPHICS: NON-PC/104 FAMILY STACKABLES USERS
• NON-TECHNICAL VENDOR SELECTION CRITERIA: NON-PC/104 FAMILY STACKABLES USERS
• REASONS FOR SELECTING NON-PC/104 FAMILY STACKABLES
• EXPECTED CHANGES IN NON-PC/104 FAMILY STACKABLES PURCHASES
• PROCESSORS USED ON NON-PC/104 FAMILY STACKABLES

VIII OBSERVATIONS AND RECOMMENDATIONS

• SMALL SIZE, BIG OPPORTUNITY
• STACKABLE PLATFORMS
• PC/104 Family Modules
• "Other" Stackables
• CUSTOMIZATION
• MICROPROCESSORS
• OPERATING SYSTEMS
• HIGH-SPEED MODULE-TO-MODULE INTERCONNECTS
• EXPANSION CABABILITY
• "Other" Stackables
• PC/104 Family Modules
• INTEGRATED FEATURES
• VERTICAL MARKETS
• SPECIFIC RECOMMENDATIONS
• PC/104 Family Module Vendors
• "Other" Stackable Board Vendors

IX VENDOR PROFILES

• AAEON TECHNOLOGY, INC.
• ADVANTECH
• AMPRO COMPUTERS, INC.
• ARBOR TECHNOLOGY CORPORATION
• AXIOMTEK CO., LTD.
• DIAMOND SYSTEMS CORPORATION
• DIGITAL-LOGIC AG
• EUROTECH S.P.A.
• KONTRON AG
• MICRO/SYS, INC.
• RTD EMBEDDED TECHNOLOGIES, INC.
• TRI-M ENGINEERING
• VERSALOGIC CORPORATION
• WINSYSTEMS, INC.
• WAYS TO WORK WITH US

VOLUME 5: GLOBAL MARKET SUMMARY

I EXECUTIVE SUMMARY

• GENERAL MARKET OVERVIEW
• VERTICAL MARKETS
• NORMALIZED GROWTH CURVES BY PLATFORM AND ARCHITECTURE
• MARKET SHARE LEADERS
• "PLATINUM" CLASS MERCHANT BOARD VENDORS

II SCOPE AND METHODOLOGY

• SCOPE
• METHODOLOGY
• Supply Side Research
• Demand Side Research
• REPORT ORGANIZATION

III INDUSTRY STRUCTURE

• INDUSTR PARTICIPANTS
• TRADE ASSOCIATIONS
• Computer-On-Module Industrial Group
• ETX Industrial Group
• Hyper Transport™ Consortium
• InfiniBand™ Trade Association (IBTA)
• Mezzannines International, fka Group IPC
• PC/104 Consortium (a.k.a. PC/104 Embedded Consortium)
• PCI Industrial Computer Manufacturers Group (PICMG)®
• PCI Special Interest Group (PCI SIG)®
• PXI systems Alliance (PXISA)
• RapidlO® Trade Association
• Small Form Factor Special Interest Group (SFF-SIG)
• StackableUSB
• VMEbus International Trade Association (VIYTA)®
• VXIbus Consortium
• XTX Consortium
• SIGNIFICANT RECENT MERGERS AND ACQUISITIONS

IV OVERALL MERCHANT EMBEDDED BOARD MARKET

• GENERAL MARKET OVERVIEW
• PROJECTED GROWTH BY PLATFORM
• GEOGRAPHIC DISTRIBUTION
• CHANNELS OF DISTRIBUTION
• CONSUMING CUSTOMER CLASSES
• CPU USE
• TROS USE
• VERTICAL MARKETS
• General
• Communications
• Industrial Automation and Control
• Industrial Automation and Control
• Instrumentation
• Medical
• Military/Aerospace/Defense
• Transportation
• Other, Unspecified Vertical Markets
• LEADING VENDORS
• NON-PRODUCT VENDOR SELECTION CRITERIA
• PLATINUM AND GOLD VENDOR RATINGS

V SLOT SINGLE BOARD COMPUTERS AND EMVEDDED CPU BLADES

• SLOT SBCS VS, EMVEDDED CPU BLADES
• "Traditional" SBCs
• Blades
• Fabric-enabled SBCs
• BUS ARCHITECTURES
• MARKET OVERVIEW
• PROJECTED GROWTH BY ARCHITECTURE
• VERTICAL MARKETS
• General
• Communications
• Industrial Automation and Control
• Instrumentation
• Medical
• Military/Aerospace/Defense
• Transportation
• Other, Unspecified Vertical markets
• MEZZANINE SITES
• SWITCH FABRIC USE
• MULTI-CORE CPU USE
• RTOS USE
• LEADING VENDORS
• SELECTED RECOMMENDATIONS

VI "DESKTOP FORM FACTOR" EMBEDDED MOTHEBOARDS

• GENERAL OVERVIEW
• Form Factors
• Brief Technical Descriptions
• MARKET OVERVIEW
• PROJECTED GROWTH BY FORM FACTOR
• VERTICAL MARKETS
• General
• Communications
• Industrial Automation and Control
• Instrumentation
• Medical
• Military/Aerospace/Defense
• Transportation
• MULTI-CORE CPU USE
• EXPANSION SLOT ARCHITECTURES
• RTOS USE
• INTEGRA TED FEATURES
• LEADING VENDORS
• SELECTED RECOMMENDATIONS

VII "EMBEDDED FORM FACTOR" EMBEDDED MOTHERBOARDS, A.K.A "OTHER" (NON-PC/104 FAMILY) STACKABLES

• GENERAL OVERVIEW
• Form Factors
• Brief Technical Descriptions
• MARKET OVERVIEW
• Overall Market
• VERTICAL MARKETS
• General
• Communications
• Industrial Automation and Control
• Instrumentation
• Medical
• Military/Aerospace/Defense
• Transportation
• MULTI-CORE CPU USE
• EXPANSION ARCHITECTURES
• RTOS USE
• INTEGRATED FEATURES
• LEADING VENDORS
• SELECTED RECOMMENDATIONS

VIII MEZZANINE CARDS AND NON-INTELIGENT MEZZANINE CARD CARRIERS

• GENERAL OVERVIEW
• DEFINITIONS
• BRIEF TECHNICAL DESCRIPTIONS
• Industry Pack (IP)
• PMC
• XMC
• AMC (Advanced Mezzanine Card)
• MARKET OVERVIEW
• PROJECTED GROWTH BY MEZZANINE ARCHITECTURE
• NON-INTELLIGENT CARRIERS: BUS ARCHITECTURES
• VERTICAL MARKETS
• General
• Communications
• Industrial Automation and Control
• Instrumentation
• Medical
• Military/Aerospace/Defense
• Transportation
• Other Unspecified Verticals
• PROCESSOR VS. NON-PROCESSOR MEZZANINE CARDS
• PROCESSOR TYPES
• NON-PROCESSOR CARDS: FUNCTIONAL TYPES
• RTOS USE
• LEADING VENDORS
• SELECTED RECOMMENDATIONS

IX COMS (COMPUTERS-ON-MODULES) AND COM CARRIERS

• GENERAL OVERVIEW
• Form Factors
• Brief Technical Descriptions
• MARKET OVERVIEW
• Overall Market
• PROJECTED GROWTH BY FORM FACTOR
• CARRIER ARCHITECTURES
• VERTICAL MARKETS
• General
• Communications
• Industrial Automation and Control
• Instrumentation
• Medical
• Military/Aerospace/Defense
• Transportation
• Other Unspecified Verticals
• MULTI-CORE PROCESSOR USE
• RTOS USE
• INTEGDRATED FEATURES
• LEADING VENDORS
• SELECTED RECOMMENDATIONS

X PC/104 FAMILY MODULES

• GENERAL OVERVIEW
• Architectures
• Brief Technical Descriptions
• MARKET OVERVIEW
• Overall Market
• PROJECTED GROWTH BY ARCHITECTURES AND PRIMARY FUNCTIONAL CLASSES
• VERTICAL MARKETS
• General
• Communications
• Industrial Automation and Control
• Instrumentation
• Medical
• Military/Aerospace/Defense
• Transportation
• Other Unspecified Verticals
• MULTI-CORE PROCESSOR USE
• RTOS USE
• PC/104 FAMILY EXPANSION MODULES: FUNCTIONAL TYPES
• LEADING VENDORS
• SELECTED RECOMMENDATIONS

XI DEMAND SIDE DATA

• DEMAND SIDE DATA
• SURVEY RESPONDENT DEMOGRAPHICS
• BOARD TYPES USED / PURCHASED
• EXPECTED CHANGES IN BOARD PURCHASES
• PROCESSORS USED

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