Printed Circuit Board: World Outlook published by Visant Strategies, Inc. in August, 2007. This report consists of 90+ PAGES and the price starts from US $ 1799.
Abstract
Study Summary
“Printed Circuit Board: World Outlook,” examines the PCB industry
today and the challenges the industry faces tomorrow in emulating the
innovations and efficiency being developed by many of the end markets they
serve.
Challenges inherent to designing and manufacturing even more miniature and
complex boards and meeting the escalating demands from increasing the number
of pins in a chip, the growth in high speed serial data streaming
technologies, the use of bussed interfaces and clock rates higher than 400
MHZ, among other particulars, are examined in the study.
To meet these needs, the industry is now using Microvias and High Density
Interconnects as well as mixed signal hybrid circuits and utilizing more
sophisticated and multipronged design and development activities. The report
provides details on these market facets as well as global revenues through
2012 for HDI/Microvia PCBs and the same for PCBs categorized by the sector
they are intended for, such as telecommunications, PC hardware and peripherals.
The growth of PCBs is also being largely driven by the large use of
multi-layered, flexible PCBs. In the report, the growth rate and revenues for
PCBs are broken down into a multitude of categories, including whether they
are built on rigid, flex, or rigid-flex boards, are single, double and
multi-layer and which type of circuit design, analog, digital or mixed-signal,
the board is intended for. The study also examines and provides growth rates
and revenues for PCBs using different substrates such as Alumina, FR4,
Beryllium Oxide, BT-Epoxy, Polyimide or PTFE/woven fiberglass.
The fate of PCB industry is closely tied with that of the overall electronics
and semiconductor equipment market and the industry is easily influenced by
competition as well as fluctuations in market demand. The report examines
these factors and gives and analysis of future growth within the industry due
to these influences.
PCB regional production and usage analysis of North America, Europe, the Asia
Pacific Region, and the rest of the world is provided, noting the revenues
brought in for PCB production in each region yearly through 2012 as well as
the expenditures on PCBs for each region during the same time period.
“Printed Circuit Board: World Outlook” also examines the
end-product for each type of board when broken down into flexibility,
substrate and signal criteria as well as the advantages and disadvantages to
each type of PCB characteristic, such as the use of a single board or Alumina
as a substrate, and also provides the latest on CAD and contemporary PCB
design tools.
Table of Contents
SECTION ONE
- Summary
- 1.0 Introduction
- 1.1 Executive summary
- 1.2 What is a PCB?
- 1.3 Why PCBs are Used
- 1.4 PCB History
SECTION TWO
- 2.0 PCB technology
- 2.1 PCB Design Considerations
- 2.2 Steps in PCB Design and Manufacture
- 2.2.1 Component Mounting Techniques
- 2.2.1.1 Through-Hole PCBs
- 2.2.1.2 Surface-Mount PCBs
- 2.3 PCB Market by Layers
- 2.3.1 Single layer PCB
- 2.3.2 Double layer PCB
- 2.3.3 Multilayer PCB
- 2.3.3.1 Case Study - Plotech
- 2.3.4 Analysis
- 2.4 PCB Market by rigidity
- 2.4.1 Rigid PCBs
- 2.4.1.1 Advantages
- 2.4.1.2 Limitations
- 2.4.1.3 Popular End Applications
- 2.4.2 Flexible PCBs
- 2.4.2.1 Flex PCB Advantages
- 2.4.2.2 Flex PCB Limitations
- 2.4.2.3 Popular End Products for Flex PCBs
- 2.4.3 Rigid-Flex PCBs
- 2.4.3.1 Advantages of Rigid-Flex PCBs
- 2.4.3.2 Limitations of Rigid-Flex PCBs
- 2.4.3.3 Rigid-Flex PCB Popular End Applications
- 2.4.4 Analysis
- 2.5 PCB Market by Materials
- 2.5.1 Alumina Substrate
- 2.5.1.1 Advantages of Alumina as a Substrate
- 2.5.1.2 Limitations of Alumina as a Substrate
- 2.5.1.3 End Applications for PCBs with an Alumina Substrate
- 2.5.1.4 Alumina Substrate Application - Thin-Film Applications
- 2.5.1.5 Alumina Substrate Application - Facsimile Machines
- 2.5.2 FR4 Substrate
- 2.5.2.1 FR-4 Advantages
- 2.5.2.2 FR-4 Limitations
- 2.5.2.3 FR-4 Popular End Applications
- 2.5.3 Beryllium Oxide Substrate
- 2.5.3.1 Beryllium Oxide Advantages
- 2.5.3.2 Beryllium Oxide Limitations
- 2.5.3.3 Beryllium Oxide Popular End Uses
- 2.5.3.4 Beryllium Oxide Applications - Electro Hydraulics
- 2.5.4 BT - Epoxy Substrate
- 2.5.4.1 BT - Epoxy Advantages
- 2.5.4.2 BT - Epoxy Limitations
- 2.5.4.3 BT - Epoxy Popular End Applications
- 2.5.5 Polyimide
- 2.5.5.1 Polyimide Advantages
- 2.5.5.2 Polyimide Limitations
- 2.5.5.3 Polyimide Popular End Applications
- 2.5.6 PTFE/ Woven Fiberglass Substrate (Teflon)
- 2.5.6.1 PTFE Advantages
- 2.5.6.2 PTFE Limitations
- 2.5.6.3 PTFE Popular End Applications
- 2.5.6.4 PTFE Application - Precisionfab
- 2.5.6.5 PTFE Application - Arlon
- 2.5.7 Hybrid PCB Substrates
- 2.5.7.1 PTFE/Fiberglass/BT-Epoxy Hybrid Substrate
- 2.5.7.2 Montmorillonite (MMT)-filled brominated Epoxy Hybrid Substrate
- 2.5.8 Analysis
- 2.6 Today' s PCB Market Demands and Implications
- 2.6.1 Approaches for PCB Space Optimization
- 2.6.1.1 FPGA Space Optimization - Actel
- 2.6.1.2 LED Space Optimization - Maxim.
- 2.6.1.3 FPGA Space Optimization - Procon
SECTION THREE
- 3.0 The PCB Business Environment
- 3.1 Application Specific PCBs
- 3.1.1 Telecommunications
- 3.1.1.1 Mobile Phone
- 3.1.1.1.1 Omnidirectional Type PCB Antenna
- 3.1.1.2 Backplane
- 3.1.2 Computing Hardware
- 3.1.2.1 PC
- 3.1.2.1.1 Motherboard of a PC
- 3.1.2.1.2 Computer Keyboard
- 3.1.2.1.3 Storage and Other Computing Applications
- 3.1.3 CE and Automotive Applications
- 3.1.3.2 DVD, VCD
- 3.1.3.3 Camera (Infrared day and night camera)
- 3.1.3.4 Reed Switches
- 3.1.3.5 Position sensing application
- 3.1.3.6 Brake lever sensing application
- 3.1.3.7 Fuel level sensing application
- 3.1.3.8 Electronically-locked door sensors application
- 3.1.4 Other Applications
- 3.1.4.1 Photoelectric fire/smoke detector/alarm
- 3.1.4.2 Water boilers and Control units
- 3.1.4.2 Medical Ultrasound System
- 3.1.4.3 Pressure Sensors
- 3.1.5 Analysis
- 3.2 Business Drivers
- 3.2.1 High Speed and High Frequency Signals
- 3.2.1.1 High Speed and High Frequency Signal Challenges
- 3.2.1.2 Approaches to Counter Challenges
- 3.2.1.2.1 Microstrips
- 3.2.1.2.2 Striplines
- 3.2.2 Semiconductor Packaging technology innovations
- 3.2.2.1 CSP/WLP
- 3.2.2.2 PGA/BGA
- 3.2.2.3 FC
- 3.2.2.4 MCM
- 3.2.2.5 SiP
- 3.2.2.6 PoP
- 3.2.3 Packing integration technology/System on the Package
- 3.2.4 Advances in EDA
- 3.2.4.1 Initial EDA/CAD Tools
- 3.2.4.2 Conventional Procedure to Use CAD Tools
- 3.2.4.3 Contemporary PCB Design Tools
- 3.2.5 Miniaturization
- 3.2.5.1 Laser and Photonic Methods for Micro Vias
- 3.3 PCB Industry Issues and Challenges
- 3.3.1 Application Issues: Analog, Digital and Mixed Signal PCBs
- 3.3.1.1 Analog PCBs
- 3.3.1.1.1 Analog Design Challenges and Limitations
- 3.3.1.1.2 Technology Advances and Workarounds
- 3.3.1.1.3 Case Study - Blacet Research
- 3.3.1.2 Digital PCBs
- 3.3.1.2.1 Digital Design Challenges and Limitations
- 3.3.1.2.2 Technology Advances and Workarounds
- 3.3.1.3 Mixed Signal PCBs
- 3.3.1.3.1 Importance of Grounding in Mixed Signal PCBs
- 3.3.1.3.2 Other Design Considerations
- 3.3.1.3.3 Mixed Signal PCB Applications
- 3.3.1.3.4 Case Study - Maxim
- 3.3.2 Environmental Issues
- 3.4 Market Push and Pull
- 3.4.1 Impact of Raw Material Price Fluctuations
- 3.4.2 Outsourced Manufacturing Trends
- 3.5 The Geographical Distribution of PCB Manufacturers and Market
Realities Going Forward
- 3.5.1 Geographical Region Metrics
- 3.5.1.1 North American PCB Production Revenues and Market Demand
Expenditures
- 3.5.1.2 European PCB Production Revenues and Market Demand Expenditures
- 3.5.1.3 APAC Region PCB Production Revenues and Market Demand
Expenditures
- 3.5.1.4 ROW PCB Production Revenues and Market Demand Expenditures
- 3.5.1.5 Analysis
TABLES AND FIGURES
- Table 1-1: World PCB Revenues 2007-2012
- Table 2-1: Global Single Layer PCB Revenues 2007-2012
- Table 2-2: Global Double Layer PCB Revenues 2007-2012
- Table 2-3: Global Multi-Layer PCB Revenues 2007-2012
- Table 2-4: Shares of Layered PCBs vs. Global PCB Production 2007 and 2012
- Table 2-5: Global Rigid PCB Revenues 2007-2012
- Table 2-6: Global Flex and Rigid Flex PCB Revenues 2007-2012
- Table 2-7: Share of Rigid and Flex PCBs vs. Global PCB Production 2007 and
2012
- Table 2-8: Substrate Material Properties
- Table 2-9: Global Revenues for PCB Substrate Material 2007-2012
- Table 2-10: PCB Substrate Share of Global PCB Market 2007-2012
- Table 3-1: Global PCB Revenues for PCBs Used in Telecommunications
Applications 2007-2012
- Table 3-2: Global PCB Revenues for PCBs Used in Computing Hardware
Applications 2007-2012
- Table 3-3: Global PCB Revenues for PCBs Used in Automotive Applications
2007-2012
- Table 3-4: Global PCB Revenues for PCBs Used in Industrial, Medical,
Military and Other 2007-2012
- Table 3-5: Overall Shares of Global PCB Revenues by Application 2007 and
2012
- Table 3-6: Global Revenues for PCB/MCM EDA Tools 2007-2012
- Table 3-7: Global Revenues for HDI Microvia PCBs 2007-2012
- Table 3-8: HDI/Microvias Share of Global Multi-layer PCB Revenues 2007-2012
- Table 3-9: North American PCB Production Revenues and Market Demand
Expenditures 2007-2012
- Table 3-10: Europe PCB Productions Revenues and Market Demand Expenditures
2007-2012
- Table 3-11: APAC PCB Production Revenues and Market Demand Expenditures
2007-2012
- Table 3-12: The ROW PCB Production Revenues and Market Demand Expenditures
2007-2012
- Table 3-13: Regional PCB Revenues Share, NA, Europe, APAC and Other 2007
and 2012
- Table 3-14: Regional PCB Expenditures Share, NA, Europe, APAC and Other
2007 and 2012
- Table A-1: Cellular and NGN Base Station Deployments, All Technologies
World Market 2006-2012
- Table A-2: Telematics Users, World Market 2005-2011
- Table A-3: Total Vehicles Equipped with Navigational Devices, World Market
2005-2011
- Table A-4: Mobile Subscribers, All Technologies World Market 2006-2012
- Table A-5: Cellular Phone Shipments, World Market 2005-2011
- Table A-6: Mobil Television Users, World Market 2005-2011
