WLP 2009 - Technologies, applications and market published by Yole Developpement in September, 2009. This report consists of 286 pages and the price starts from US $ 5290.
Abstract
A complete update on Wafer Level Packaging technologies with market status and forecast
MARKET TRENDS
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Wafer Level Packaging is a confirmed high growth trend in the semiconductor
packaging industry. Wafer Level Chip Scale Packaging (WLCSP), or the direct
bonding of bumped integrated circuits (IC' s) on printed circuit boards (PCB' s)
as one of the most visible expressions of WLP, is undoubtedly the fastest
growing package type in the whole industry. Yole forecasts that it will
exceed 10 billion units per year by 2012, at a compound annual growth rate of
more than 20% over the next 5 years.
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Primarily driven by footprint and thickness reduction of packaged integrated
circuits in mobile phones, WLCSP is now used in a wide range of circuits for
handsets: EMI/ESD interface protection; power supply (PMIC/PMU, DC/DC
converters, LED drivers, MOSFET' s,...); connectivity (Bluetooth, WLAN); and
other features (FM, GPS, TV on mobile, camera).
Wafer-Level Packaging of MEMS devices is also expected to grow fast, driven
here too by the handset market and its fast increasing rate of integrated
sensors (MEMS microphones, accelerometers, gyroscopes, pressure and magnetic
sensors).
Key features of the report
- Detailed account of all the application fields of WLCSP (examples
are Integrated circuits, DC/DC converters, GPS, Bluetooth, audio amplifiers,
...)
- Market trends and figures in Munits and wafer size equivalent with
breakdown by application. Market value evaluation in $M assembly service.
- Wafer price ranges of WLCSP contract assembly by wafer size
- Complete technologies and material tool-box analysis, covering
WLCSP, fan-out WLCSP and chip embedding platforms, as well as WLP of MEMS
devices.
- Key drivers, Benefits and challenges of each of these technologies
- Supply chain analysis: main contract assemblers (OSAT) for WLCSP.
Companies cited in the report:
Amkor, Analog Devices, Apple, Asahi Glass Chemicals , ASE, Analog Devices, Air
Products, Austriamicrosystems, Arch Chemical, AT&S, Avago Technologies, AVX,
Brewer Sciences, Bosch, Broadcom, California Micro Devices, Casio Computer,
China WLCSP, Clover Electronics, CSR, Dalsa Semiconductor, DNP, DOW Chemical,
Dupont, Enthone, Epcos, EPWorks, EVGroup, Fairchild Semiconductors, FlipChip
International, Fraunhofer-IZM,Freescale, Fujikura, Fujifilm, i2a, IC
Interconnect / JCAP, Imbera Electronics, Ibiden, IBM, IME,IMEC, IMT, Infineon,
International Rectifier, JSR Micro, Maxim, MaxLinear, Mentor Graphics,
MicroChem, Micron, National Semiconductor, Nanya, NEC Toppan Circuit, Nokia,
NXP, OKI Electric, Omnivision, OptoPAC, Pac Tech, Replisaurus Technologies,
RFMD, Rohm & Hass, Samsung, Sanyo, Schott, Sensonor, Silex, SiTime, Sharp,
Shin-Etsu, Shinko, Skyworks, StatsChipPac, STMicroelectronics, STEricsson,
SPIL, Sumitomo, SUSS MicroTec, Telephus, Tessera, Texas Instruments, TOK,
Toshiba, Triquint, Tronic' s Microsystems, Touch Microsystems Technology, TSMC,
Ultratech, VTI, Wolfson Microelectronics, Xintec.
Table of Contents
Scope of the report & definition
- Wafer scale packaging, wafer level packaging and wafer-level chip scale
packaging
- Scope of the report
- Application main sectors of WLP
Executive Summary
Technologies
- Market drivers and comparisons with other package platforms
- Limitations and challenges: reliability and pad limitation issues
- Mother PCB IO pitch reduction rate: 0.5mm versus 0.4mm
- Key WLP technologies
- Equipments and materials
- Embedded die technologies
- Technology roadmaps
Applications
- Present and future applications of WLP
- WLCSP for ICs in handsets
- WLCSP for ICs in medical, automotive and space applications
- WLP of CMOS image sensors
- WLP of MEMS devices
Market forecasts
- WLCSP and WLP market value and 2008-2013 forecasts
- WLCSP and WLP unit 2008 volumes and 2008-2013 forecasts by application
main sector and by application segment
- WLCSP and WLP 2008 wafer volumes and 2008-2013 forecasts For 6-inch,
8-inch and 12-inch wafers
- Materials for WLP market forecasts
Cost of WLCSP
- Cost benefits and drawbacks of WLP and WLCSP
- Estimated outsourced WLCSP assembly wafer prices for 6-inch, 8-inch and
12-inch wafers
- Cost comparisons with competing package platforms
- WLCSP Cost roadmap
Supply Chain
- Players and geographical locations
- Respective market shares of contract WLCSP assemblers
- Ratio contract versus in-house WLCSP assembly by wafer size
- Supply chain perspectives
Conclusion
