CMOS Image Sensors Technologies & Markets -2010 Report

CMOS Image Sensors Technologies & Markets -2010 Report published by Yole Developpement in February, 2010. This report consists of 295 slides and the price starts from US $ 5290.

Introduction

Abstract

Image sensors have come a long way since the first introduction of CCD sensor technology in the 1990' s. They made a big jump in the 2000' s with the introduction of CMOS sensor technology which gave birth to the low-cost, high volume camera phone market.

Image sensors are now part of our everyday life: from cell-phone cameras, to notebook webcams, digital cameras, video camcorders to security & surveillance systems. In the future, new markets are also emerging such as sensors for medical applications, automotive security features, but also gaming and home TV webcams ... The reason why we are now releasing our first report on the CMOS image sensor industry is that we feel that we are at an historic turning point for this young, but still maturing industry.

Indeed, from 2010 and toward the next decade, the time has come that high-end and low-end markets start converging: digital cameras are on the way to get real HD video camcorder features. Meanwhile, camera cell-phones with auto-focus capability are on the way to get real digital still camera features along with basic video recording functionality... As these markets will progressively converge, key enabling technologies will be developed and are paving the way to the future growth of digital imaging industry:

• CMOS sensor technology will continue to expand and finally take the advantage in the remaining CCD application space as soon as 300mm infrastructure will build-up in Asia and BSI CMOS technology will be available.
• In the high-end camera phone market segment, disruptive new camera module concepts including Auto-focus, Zoom and Image stabilization features will be developed and introduced to the market.
• In the ultra-competitive low-end market, the race toward Wafer Level Cameras and digital autofocus features such as eDoF (extended Depth of Focus) or Wafer Level Auto-focus will enable the few remaining image sensor players to preserve their margins in this aggressive and cost driven market.
• Future CIS markets such as medical and automotive sensor applications will re-use extensively all these newly developed concepts (BSI, WLCamera, digital zoom) plus will need new features to be developed such as High Dynamic Range and NIR capability.

The objectives of this first report are the following:

• To provide market data on CMOS image sensor key market metrics & dynamics:
  • CMOS image sensor unit shipments, revenues and wafer production by application
  • Market shares with detailed breakdown for each player
  • Application focus on key areas of growth for CMOS image sensor (handsets, DSC/SLR, medical, automotive, security & surveillance, etc...)
• To provide key technical insight about future technology trends & challenges:
  • From BSI (Backside illuminated sensor) and other front-end technologies evolution (Pixel isolation, color filters, micro-lenses...) to WLC (Wafer Level Cameras) realization with wafer level optics, Packaging / Assembly & Test (Wafer Level Packaging and 3D TSV interconnects), WDR (Wide dynamic Range) sensor technologies, Image stabilization & Auto-focus technologies (eDoF, Piezo, other mechanical AF , MEMS based, WL Auto-focus or liquid lenses)
• To provide a deep understanding of CIS value chain, infrastructure & players:
  • Who are the CMOS image sensor players (IDMs, foundries, design houses) and how are they related?
  • What are the key suppliers and emerging infrastructure for BSI, Wafer Level Cameras, and future optical camera module technologies?

Companies cited in the report:

Advasense, AIE, AJI, Altasens, Anafocus, Anteryon, Aptina Imaging, Artificial Muscle, Asahi Glass, Awaiba, AWLP, BC Tech, BEI Kimco magnetic, Bosch, Cambridge Mechatronics, Canesta, Canon, Ceradyne, China WLCSP, CMOSIS, Continental, Crysview, Cypress, DALSA, DBlur, Delphi, Dongbu HiTek, DXO-Lab, e2v, Espon-Toyocom, Forza Silicon, Foveon, Foxconn, Fujinon, Fujitsu, GalaxyCore, Grace Semiconductor, Given Imaging, Hamamatsu, Hella, Heptagon, Himax imaging, HHNEC, Hoya, Hynix, Invensense, Jabil, JCAP, Kantatsu, Kodak, Kolen, Konica Minolta, Kostal, KunShan RuiXin Micro, Largan, LensVector, LG Innotek, Live Technologies, Medigus, Melexis, MGB Endoscopy, Micro-Imaging Solutions, Mitsumi, Murata, NEC / Schott, Nemotek, New Imaging Technologies, New scale technologies, Novatek, Omnivision, Omron, Optotune, OptoPac, Panasonic, PlanOptik, Phillips, Pixart, PixelPlus, Pixim, poLight, PGS Precision Pte, Q-Technology, Qualtre, Rad-icon, Rhevision, Retinal Implant, Saint-Gobain, Samsung, Sarnoff, Schott, Seiko, SEMCO, Senodia, SETi, Sharp, Sightic, Siimpel, SiliconFile, SMIC, SOITEC, Sony, STMicro, SuperPix, Tessera, Texas Instrument, Toshiba, Trioptics,Trixel, TSMC, TowerJazz, UMC, Valeo, Valtronic, Varioptic, Vasstek, VisEra, Vista Point, Viti, X-Fab, XceedImaging, XinTec, Zarlink, Ziptronixand more ...

Table of Contents

Objectives & Scope of the report

Executive Summary

1) Introduction & Background

• CCD versus CMOS sensors

2) Market forecasts & Supply Chain

• 2007-2015 CMOS image sensor forecasts
  • Shipments forecasts (in Munits)
  • Revenues forecasts (in $M)
  • Wafer production forecasts (in wafer size eq.)
• Global CMOS image sensor manufacturing infrastructure & Supply value chain
• 2009 market shares (both in unit shipments, wafer production and revenues)

3) Application Focus

• Automotive sensors
  • Applications, specifications, markets & supply chain
• Security & Surveillance sensors
  • Applications, specifications, markets & supply chain
• Medical sensors
  • Applications, specifications, markets & supply chain
• Industrial & Machine vision sensors
  • Applications, specifications, markets & supply chain

4) New Design & Front-end technology development

• High Dynamic Range sensor technologies
• Color filters, Micro-lenses array & AR coatings
• Substrate & Pixel isolation technologies

5) Camera module Packaging, Assembly & Test technologies

• Packaging solutions overview: COB, CCM ...
• Focus on WLP & 3D TSV integration trends

6) BSI "Backside illumination" technology development

• Motivations & applications for BSI sensors
• Technologies for BSI manufacturing
  • Initial substrate techno (SOI or Bulk Silicon)? And manufacturing infrastructure (200mm or 300mm?)
  • Pixel isolation technologies, Thickness of final active silicon
  • Type of bonding technology between wafer carrier and the active silicon?
  • Grinding technologies (CMP, mechanical plus dry etching...) and Etch stop layer choice for backside exposure (oxide, implant gradient...)
  • QE specifications targets. Specific backside passivation in order to decrease the dark current? Anti reflective coating technologies
• Players & status of commercialization
• Future approach: 3D integrated image sensors

7) WLC "Wafer Level Camera" technology development

• WLOptics technologies
  • From lens formation, stacking to final molding
• Market status, players & supply chain
• Test issues & challenges

8) Optical Zoom, Image Stabilization & Autofocus technologies

• New autofocus technologies (eDoF, Piezo, MEMS, Liquid Lens, LC): technical trends & players
• Image stabilization: technologies & players
• Micro-zoom: technologies & players

Conclusions & Perspectives

Appendix

• Yole Developpement presentation

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