Home Category Region Publishers About Us Contact Us
Japanese Korean Chinese
Home > Market Research Report > Electronic Components > MEMS > SiTime SiT8002 - MEMS Oscillator Reverse Costing Analysis
Category
Electronic Components (1970)
Connectors (56)
Display (222)
Lighting and LED (179)
MEMS (85)
Power Devices (110)
Printed Electronics (120)
Semiconductor Manufacturing & Equipment (443)
Semiconductor Material (73)
Sensors (189)
Market Research Report

SiTime SiT8002 - MEMS Oscillator Reverse Costing Analysis

Published by System Plus Consulting
Published February, 2010 Product code 114493
Content info  
Price
US $ 2340 PDF by E-mail (Single User License)
US $ 2930 PDF by E-mail (Site License)
US $ 3510 PDF by E-mail (Corporate License)


SiTime SiT8002 - MEMS Oscillator Reverse Costing Analysis published by System Plus Consulting in February, 2010. This report price starts from US $ 2340.

Introduction

Abstract

  • Analyze the cost of projects at the R&D level
  • Enhance the negotiation power of purchasing managers
  • Benchmark competitor' s products

System Plus Consulting is proud to publish the reverse costing report of the MEMS Oscillator SiT8002 supplied by SiTime Corporation.

The SiTime SiT8002 is a one-time programmable 1MHz to 125MHz oscillator. Completely quartz-free, It uses a standard 2.5× 2.0mm 4-land MLF-type package containing 2 stacked dies: a MEMS resonator and an ASIC for signal conditioning. The MEMS resonator is manufactured on SOI wafers using MEMS First™ process licensed by Robert Bosch GmbH. The SiT8002 programmable oscillator is suitable for use in clock generation for consumer, portable industrial, automotive, and computation applications.

This report provides complete teardown of the MEMS Oscillator with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

Table of Contents

Glossary

Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

SiTime Company Profile

  • Product Range
  • Business Model

Physical analysis

  • Synthesis of the Physical Analysis
  • Physical Analysis Methodology
  • Package Characteristics & Markings
  • Package X-Ray
  • Package Opening & Bonding Number
  • ASIC Markings
  • ASIC Dimensions
  • ASIC Minimal Dimension and Metal Layers
  • ASIC Process Characteristics
  • Resonator Markings
  • Resonator Dimensions
  • Resonator with Cap and Electrical Contacts
  • Resonator after Cap Polishing
  • Resonator Electrical Contact Details
  • Resonator Cross-Section
  • MEMS process characteristics

Manufacturing Process Flow

  • Overview
  • ASIC Process Flow
  • MEMS Process Flow
  • Description of the Wafer Fabrication Units

Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Supply Chain Analysis
  • Manufacturers Financial Ratios
  • Yields Explanation
  • ASIC Front-End Cost - Hypothesis
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test
  • ASIC Back-End 0 : Backgrinding and Dicing
  • ASIC Water Cost
  • ASIC Die Cost
  • MEMS Front-End Cost - Hypothesis
  • MEMS Front-End Cost
  • MEMS Front-End Cost per Process Steps
  • MEMS Front-End Cost: Equipment Cost per Family
  • MEMS Front-End Cost material Cost per Family
  • MEMS Back End 0: Probe Test
  • MEMS Front-End 0 Backgrinding and Dicing
  • MEMS Water Cost
  • MEMS Die cost
  • SiT 80002 Packaging Cost Hypothesis & Process Flow
  • SiT 80002 Packaging Cost
  • SiT 80002 Final Test Cost
  • SiT 80002 Component Manufacturing Cost
  • Yield Synthesis

Estimated Manufacturer Price Analysis

Conclusion

Back to Top