Freescale MPXY8300A - MEMS TPMS Reverse Costing Analysis published by System Plus Consulting in July, 2009. This report price starts from US $ 2600.
Abstract
Analyze the cost of projects at the R&D level Enhance the negotiation power of
purchasing managers Benchmark competitor' s products
System Plus Consulting is proud to publish the reverse costing report of the
MEMS Tire Pressure Monitoring System (TPMS) MPXY8300A supplied by Freescale
Semiconductor. Based on a complete teardown process the report provides an
estimation of the production cost as well as the selling price of the circuit.
This Freescale MPXY8300A TPMS component is used in cars, trucks or buses to
detect under-inflated or over-inflated tires. It uses a Multi-Chip Package
containing 4 separate dies: 2 capacitive MEMS devices (pressure sensor,
2-axis accelerometer with X and Z axis) and 2 Integrated Circuits (8-bit
microcontroller, radio frequency transmitter).
This report provides complete teardown and cost estimation of the component
with:
Detailed photos Material analysis Schematic assembly description Manufacturing
Process Flow In-depth economical analysis Manufacturing cost breakdown Selling
price estimation
Table of Contents
Glossary
Overview/Introduction
- Executive Summary
- Reverse Costing Methodology
Freescale Company Profile
Physical Analysis
- Synthesis of the physical analysis
- Physical analysis methodology
- Tire Pressure Monitoring System (TPMS)
- Multi-Chip Package
- Package characteristics & markings
- Package opening - Bondings Number
- Package opening - Encapsulation
- MCU markings
- MCU dimensions
- MCU minimal dimension and metal layers
- MCU process characteristics
- RFX markings
- RFX dimensions
- RFX minimal dimension and metal layers
- RFX process characteristics
- G-die: markings & dimensions
- G-die: cap opening
- G-die: sensors dimensions
- G-die: x-axis structure
- G-die: x-axis process characteristics
- G-die: z-axis structure
- G-die: z-axis process characteristics
- P-die: markings
- P-die: dimensions
- P-die: minimal dimension and metal layers
- P-die: sensors dimensions
- P-die: "Sense" sensor process characteristics
- P-die: "Reference" sensor process characteristics
- P-die: process characteristics
Manufacturing Process Flow
- Overview
- MCU process flow
- RFX process flow
- G-die process flow: sensor wafer
- G-die process flow: cap water
- P-die process flow: ASIC
- P-die process flow: Sensor
- Description of the Wafer Fabrication Units
Cost Analysis
- Synthesis of the cost analysis
- Main steps of economic analysis
- Yields explanation
- MCU wafer cost
- MCU probe & dicing cost
- MCU die Cost
- RFX wafer cost
- RFX probe & dicing cost
- RFX die cost
- G-die wafer cost
- G-die wafer cost per step
- G-die probe & dicing cost
- G-die die cost
- P-die wafer cost
- P-die wafer cost per step
- P-die probe & dicing cost
- P-die cost
- MPXY8300A packaging cost
- MPXY8300A final test cost
- MPXY8300A component manufacturing Cost
- Yield synthesis
Estimated Manufacturer Price Analysis
- Supply Chain Analysis
- Manufacturer ratios
- Estimated manufacturer Price
Conclusion
