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Market Research Report
InvenSense ITG-3200 -3-Axis Gyroscope Reverse Costing Analysis
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InvenSense ITG-3200 -3-Axis Gyroscope Reverse Costing Analysis published by System Plus Consulting in May, 2010. This report price starts from US $ 3120.
Abstract
Physical Analysis of the Device
Step by Step Reconstruction of the Process Flow
Cost of Manufacturing and Estimation of Selling Price
Yole Développement publish the reverse costing report of the 3-Axis
MEMS Gyroscope ITG-3200 supplied by InvenSense.
The ITG-3200 is the first 3-axis(Pitch-Roll Yaw) gyro developed by InvenSense.
It uses a very thin 4x4x0.9mm QFN package. The components are manufactured on
200mm wafers using a three-bonded-wafer process: a thin sensor wafer and a
protective cap wafer both processed by Deep RIE, and an ASIC wafer for signal
conditioning. The ITG-32003-Axis gyroscopes are suitable for various motion
processing solutions for consumer products.
This report provides complete teardown of the MEMS Gyroscope with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation Glossary Overview
BENEFITS:
- Analyze the cost of projects at the R&D level
- Enhance the negotiation power of purchasing managers
- Benchmark competitor' s products
Table of Contents
Glossary
Overview/Introduction
- Executive Summary
- Reverse Costing Methodology
InvenSense Company Profile
Physical analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
- Package Characteristics & Markings
- Package Opening & Bonding Number
- Device Structure
- Device Dimensions
- MEMS Sensor - Optical Views
- MEMS Sensor - X-Axis SEM Views
- MEMS Sensor - Y-Axis SEM Views
- MEMS Sensor - Z-Axis SEM Views
- ASIC - Overview
- ASIC - Markings & Bond Pads
- ASIC - Cavities
- ASIC - Delayering
- ASIC - Logic Area & Memory
- Component Cross-Sections
- ASIC Process Characteristics
- MEMS process characteristics
- Comparisons with Previous Generations
Manufacturing Process Flow
- Overview
- ASIC Process Flow (CMOS + Cavity Etch)
- MEMS Process Flow (Cap + Sensor + Assembly)
- Description of the Wafer Fabrication Unit
Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Yields Explanation
- Die per wafer & Probe Test
- Front-End Cost - Hypotheses
- ASIC Front-End Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End : Equipment Cost per Family
- MEMS Front-End : Material Cost per Family
- Total Front-End Cost (ASIC + MEMS + Assembly)
- Back-End 0 : Probe Test and Dicing
- Total Wafer Cost (Front-End + Back-End 0)
- Die cost
- Back-End 1 : Packaging Cost
- Back-End 1 : Final Test Cost
- ITG-3200 Component Cost (FE + BE 0 + BE 1)
Estimated Manufacturer Price Analysis
Conclusion
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