3D Silicon & Glass Interposer

3D Silicon & Glass Interposer published by Yole Developpement in September, 2010. This report price starts from US $ 5790.

Introduction

Abstract

Physical Analysis of the Device Step by Step Reconstruction of the Process Flow Cost of Manufacturing & Estimation of Selling Price.

Yole Dpéveloppement is pleased to publish a reverse costing report on the LIS331DLH high performance digital 3 axis accelerometer supplied by STMicroelectronics and targeting low-power consumer & industrial applications.

Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the chip.

This report provides a reverse costing of the MEMS accelerometer with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

About Yole Dpéveloppement

Our commitment is to facilitate market access for innovative technology, devices, equipment and materials in the MEMS, compound semiconductor, nano and life science fields. Founded in 1998, Yole Dpéveloppement is involved in different fields, with strong leadership worldwide:

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Table of Contents

Glossary

Overview/Introduction

• Executive Summary
• Reverse Costing Methodology

STMicroelectronics Company Profile

• STMicroelectronics
• LIS331DLH Specifications & Block Diagram

Physical analysis

• Synthesis of the Physical Analysis
• Physical Analysis Methodology
• Package Characteristics & Markings
• Package Opening & Bonding Number
• Device Structure
• ASIC - Dimensions
• ASIC - Markings & Bond Pads
• ASIC - Functions
• ASIC Synthesis
• MEMS Sensor - Dimensions and Marking
• MEMS Sensor - X-Axis SEM Views
• MEMS Sensor - Y-Axis SEM Views
• MEMS Sensor - Z-Axis SEM Views
• MEMS Sensor - Capacitances electrodes
• Component Cross-Section
• MEMS Cross-Section
• Mobil Elements Cross-Section
• Physical Data Summary
• MEMS process characteristics

Manufacturing Process Flow

• Global Overview
• ASIC Process Flow
• Description of the ASIC Wafer Fabrication Unit
• MEMS Process Flow
• Description of the MEMS Wafer Fabrication Unit

Cost Analysis

• Synthesis of the Cost Analysis
• Main Steps of Economic Analysis
• Yields Explanation
• Die per wafer & Probe Test
• ASIC Wafer Front-End Cost
• ASIC Die Cost
• MEMS Wafer Front-End Cost
• MEMS Front-End Cost per Process Steps
• MEMS Front-End : Equipment Cost per Family
• MEMS Front-End : Material Cost per Family
• MEMS Back-End 0 : Probe Test & dicing
• MEMS Die Cost (Front End + Back End 0)
• Back-End 1 : Packaging, Final test, calibration
• LIS331DLH Component Cost (FE + BE 0 + BE 1)
• Yields Synthesis

Estimated Manufacturer Price Analysis

• Supply Chain Analysis
• Manufacturers ratios
• Estimated manufacturer Price

Conclusion

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