The Equipment & Materials business will grow by 4X in the next five years for
3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and Flip-chip wafer bumping!
EQUIPMENT & MATERIALS SUPPLIERS OF FRONT-END AND BACK-END AREAS ARE FINDING BUSINESS
Demand for ‘mid-end' tools and related materials is surging, thanks to
the growth of 3DIC & Wafer-Level-packaging technologies such as 3D TSV, FO
WLP, 3D WLP, WLCSP, 2,5D interposers and Flip-chip wafer bumping.
Global Equipment & Material market forecast
for 3DIC & Wafer-Level-Packaging (in M$)
The material market will grow from ~$590M this year to over $2B by 2017 with a
CAGR of 24%, driven mainly by the expansion of flip-chip wafer bumping, WLCSP
and FOWLP technologies.
Also, the equipment market reached a value of ~$870M in 2011 with a CAGR of
28% fueled by the 3D IC technology with TSV interconnects, which represents
one of the main emerging areas in the coming years; an area offering
opportunities for new equipment modification and new materials development.
A slight decrease in 2012 is forecast, since manufacturers invested in
equipment tools dedicated to the 3D TSV & WLP markets last year and
high-volume production in 3D TSV, FO WLP, and 3D WLP has not started yet.
MARKET SHARE FOR 3DIC/WLP: BREAKDOWN BY EQUIPMENT & MATERIALS
The materials market is diversified and segmented into several materials
suppliers. Specialist material suppliers are involved and specialized in one
However, the equipment market for 3D TSV & WLP applications is quite
fragmented and diversified.
We can identify three main groups of equipment suppliers coming from different
- Large equipment suppliers coming from the semiconductor and front - end
area who have expanded their business into the 3D TSV & WLP semiconductor
business through acquisition of other companies.
- Equipment suppliers coming from niche application wafer processing markets
with a broad product portfolio.
- “Specialist” equipment suppliers that have developed knowledge
and expertise in very specific equipment lines.
The competitive landscape and market share for all main equipment & materials
suppliers is quantified and detailed in this report.
Strippable thick resist for WLP applications
2011 Market Share Breakdown by supplier (in M$)
COMPLETE TECHNOLOGIES UPDATE FOR EACH TYPE OF EQUIPMENT & MATERIAL USED IN 3D TSV & WLP APPLICATIONS
The wafer-level-packaging market remains a huge business opportunity and shows
the greatest potential for significant future growth in the semiconductor
Technologies related to equipment & materials used for different process flows
are included in this report.
All key scenarios are analyzed, including flip-chip wafer bumping trends,
Fan-in WLCSP, 3D WLP, FOWLP, 2.5D silicon interposers, and 3DIC Via Middle &
Via Last processes.
Analysis on the “Via first” process flow is detailed in this
report as well.
DATABASE WITH 375+ KEY EQUIPMENT & MATERIALS SUPPLIERS FOR 3DIC/WLP
Our database is consistently updated with new information on key equipment &
Along with the new research presented in this updated report, Yole delivers an
Excel database which screens and profiles the detailed activity of more than
375+ small, medium and large equipment & materials suppliers coming from
either the Front-end, Back-end assembly, PCB, LCD or Solar industries, and
providing actual solutions for the 3DIC and wafer-level-packaging toolbox.
Equipment & Materials for 3DIC and Wafer-Level-Packaging:
GLOBAL supplies activity
One of the main developments this year was the acquisition of NEXX by Tokyo
Electron (TEL) in March 2012
- 2011-2017 wafer forecast for wafer-level-packages, with a unique market
segmentation of the different flavors currently blossoming in the
“mid-end” of the semiconductor packaging supply chain: namely
Flip-chip wafer bumping, WLCSP, FO WLP, 2.5D interposers and 3DICs with TSV
- Detailed WLP & other technologies process flows/scenarios analysis,
including evidence of the critical steps related to each wafer-level-packaging
platform, and what the available technology alternatives are in the equipment
& materials toolbox.
- WLP equipment & materials market forecasts in unit, volume and revenue
from 2011-2017, and 2011 market share of all main equipment & materials
suppliers per product line.
- An Excel DATABASE screening and profiling the activities of 375+ small,
medium and large equipment & materials suppliers coming from either the
Front-end/Back-end assembly/PCB/LCD/Solar industries and active in the 3DIC &
WHO SHOULD BUY THIS REPORT?
- Equipment & Materials suppliers
- Assess the TAM - “Total Accessible Market” -- of your
company's related products in the wafer-level-packaging areas
- Identify technology trends, challenges, and precise requirements for
each 3DIC/WLP scenario
- Screen competition activity and identify possible partnerships or
targets for M&As in areas close to your current business
- R&D organizations & investors
- Monitor the global activity and consolidation currently occurring in
the semiconductor equipment & materials business in order to identify new
partners and targets, and make the right decision before committing to one
- IDMs, CMOS foundries & OSAT players
- Get an exhaustive list of the 375+ equipment & materials companies
supplying solutions in the different 3DIC and wafer-level-packaging areas
- Understand technology trends and benchmark several different 3DIC & WLP
scenarios, including the future trends for PANEL scale packaging based on
- PCB substrate manufacturers
- Access a complete list of semiconductor packaging equipment & materials
companies supplying solutions in the blossoming 3DIC & wafer-level-packaging
- Identify technology trends, challenges and issues for each 3D packaging
BIO OF THE AUTHORS
Amandine Pizzagalli joined Yole Dévelopment's Advanced Packaging and
MEMS Manufacturing teams after graduating as an engineer in Electronics with a
specialization in Semiconductors and Nano Electronics Technologies. Prior to
Yole, she worked for Air Liquide with an emphasis on CVD and ALD processes for
Jerome Baron leads Semiconductor Packaging Market Research at Yole
Développement. He has followed the 3D packaging market's evolution since its
early beginnings at device, equipment and material levels. He earned a Master
of Science degree in Nanotechnologies from the National Institute of Applied
Sciences in Lyon, France.