Cover Image

Equipment & Materials for 3DIC & Wafer-Level-Packaging

Notice
This publication has been discontinued on June 21, 2014.

The Equipment & Materials business will grow by 4X in the next five years for 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and Flip-chip wafer bumping!

EQUIPMENT & MATERIALS SUPPLIERS OF FRONT-END AND BACK-END AREAS ARE FINDING BUSINESS

Demand for ‘mid-end' tools and related materials is surging, thanks to the growth of 3DIC & Wafer-Level-packaging technologies such as 3D TSV, FO WLP, 3D WLP, WLCSP, 2,5D interposers and Flip-chip wafer bumping.

Global Equipment & Material market forecast
for 3DIC & Wafer-Level-Packaging (in M$)

The material market will grow from ~$590M this year to over $2B by 2017 with a CAGR of 24%, driven mainly by the expansion of flip-chip wafer bumping, WLCSP and FOWLP technologies.

Also, the equipment market reached a value of ~$870M in 2011 with a CAGR of 28% fueled by the 3D IC technology with TSV interconnects, which represents one of the main emerging areas in the coming years; an area offering opportunities for new equipment modification and new materials development.

A slight decrease in 2012 is forecast, since manufacturers invested in equipment tools dedicated to the 3D TSV & WLP markets last year and high-volume production in 3D TSV, FO WLP, and 3D WLP has not started yet.

MARKET SHARE FOR 3DIC/WLP: BREAKDOWN BY EQUIPMENT & MATERIALS

The materials market is diversified and segmented into several materials suppliers. Specialist material suppliers are involved and specialized in one specific sector.

However, the equipment market for 3D TSV & WLP applications is quite fragmented and diversified.

We can identify three main groups of equipment suppliers coming from different business markets:

  • Large equipment suppliers coming from the semiconductor and front - end area who have expanded their business into the 3D TSV & WLP semiconductor business through acquisition of other companies.
  • Equipment suppliers coming from niche application wafer processing markets with a broad product portfolio.
  • “Specialist” equipment suppliers that have developed knowledge and expertise in very specific equipment lines.

The competitive landscape and market share for all main equipment & materials suppliers is quantified and detailed in this report.

Strippable thick resist for WLP applications
2011 Market Share Breakdown by supplier (in M$)

COMPLETE TECHNOLOGIES UPDATE FOR EACH TYPE OF EQUIPMENT & MATERIAL USED IN 3D TSV & WLP APPLICATIONS

The wafer-level-packaging market remains a huge business opportunity and shows the greatest potential for significant future growth in the semiconductor industry.

Technologies related to equipment & materials used for different process flows are included in this report.

All key scenarios are analyzed, including flip-chip wafer bumping trends, Fan-in WLCSP, 3D WLP, FOWLP, 2.5D silicon interposers, and 3DIC Via Middle & Via Last processes.

Analysis on the “Via first” process flow is detailed in this report as well.

DATABASE WITH 375+ KEY EQUIPMENT & MATERIALS SUPPLIERS FOR 3DIC/WLP

Our database is consistently updated with new information on key equipment & materials suppliers.

Along with the new research presented in this updated report, Yole delivers an Excel database which screens and profiles the detailed activity of more than 375+ small, medium and large equipment & materials suppliers coming from either the Front-end, Back-end assembly, PCB, LCD or Solar industries, and providing actual solutions for the 3DIC and wafer-level-packaging toolbox.

Equipment & Materials for 3DIC and Wafer-Level-Packaging:
GLOBAL supplies activity

One of the main developments this year was the acquisition of NEXX by Tokyo Electron (TEL) in March 2012

BENEFITS:

KEY FEATURES

  • 2011-2017 wafer forecast for wafer-level-packages, with a unique market segmentation of the different flavors currently blossoming in the “mid-end” of the semiconductor packaging supply chain: namely Flip-chip wafer bumping, WLCSP, FO WLP, 2.5D interposers and 3DICs with TSV interconnects.
  • Detailed WLP & other technologies process flows/scenarios analysis, including evidence of the critical steps related to each wafer-level-packaging platform, and what the available technology alternatives are in the equipment & materials toolbox.
  • WLP equipment & materials market forecasts in unit, volume and revenue from 2011-2017, and 2011 market share of all main equipment & materials suppliers per product line.
  • An Excel DATABASE screening and profiling the activities of 375+ small, medium and large equipment & materials suppliers coming from either the Front-end/Back-end assembly/PCB/LCD/Solar industries and active in the 3DIC & WLP area

WHO SHOULD BUY THIS REPORT?

  • Equipment & Materials suppliers
    • Assess the TAM - “Total Accessible Market” -- of your company's related products in the wafer-level-packaging areas
    • Identify technology trends, challenges, and precise requirements for each 3DIC/WLP scenario
    • Screen competition activity and identify possible partnerships or targets for M&As in areas close to your current business
  • R&D organizations & investors
    • Monitor the global activity and consolidation currently occurring in the semiconductor equipment & materials business in order to identify new partners and targets, and make the right decision before committing to one particular supplier
  • IDMs, CMOS foundries & OSAT players
    • Get an exhaustive list of the 375+ equipment & materials companies supplying solutions in the different 3DIC and wafer-level-packaging areas
    • Understand technology trends and benchmark several different 3DIC & WLP scenarios, including the future trends for PANEL scale packaging based on LCD/PCB infrastructures
  • PCB substrate manufacturers
    • Access a complete list of semiconductor packaging equipment & materials companies supplying solutions in the blossoming 3DIC & wafer-level-packaging area
    • Identify technology trends, challenges and issues for each 3D packaging scenario

BIO OF THE AUTHORS

Amandine Pizzagalli joined Yole Dévelopment's Advanced Packaging and MEMS Manufacturing teams after graduating as an engineer in Electronics with a specialization in Semiconductors and Nano Electronics Technologies. Prior to Yole, she worked for Air Liquide with an emphasis on CVD and ALD processes for semiconductor applications.

Jerome Baron leads Semiconductor Packaging Market Research at Yole Développement. He has followed the 3D packaging market's evolution since its early beginnings at device, equipment and material levels. He earned a Master of Science degree in Nanotechnologies from the National Institute of Applied Sciences in Lyon, France.

Table of Contents

Scope of the report & definitions

  • Objectives of the report

Executive Summary

1) 3DIC & WLP Equipment & Materials 2011-2017 market forecasts

  • Equipment market forecasts (in units and M$ revenues)
    • Breakdown details for Wafer Bonders /C2W Bonders / DRIE etching / CVD / PVD / ECD Plating / Exposure & Lithography / Spray coating / Cleaning / Temporary Bonding & De-Bonding / Grinding-Thinning-CMP / Wafer-molding / Inspection & Metrology / Test tools
  • Market share of all main equipment suppliers per equipment line
    • Breakdown details for Wafer Bonders / C2W Bonders / DRIE etching / CVD / PVD / ECD Plating / Exposure & Lithography / Spray coating / Cleaning / Temporary Bonding & De-Bonding / Grinding-Thinning-CMP / Wafer-molding / Inspection & Metrology
  • Materials market forecasts (in volume shipment and M$ revenues)
    • Breakdown details for Photoresist & coatings / Adhesive tapes / pre-applied & wafer-level underfills / Molding compounds / Plating & cleaning chemistries / Slurries for CMP / Temporary bonding materials/ Gas & precursors / sputtering targets / silicon & glass wafer carriers, capping, interposers and TGV substrates
  • Market share of all main material suppliers per product line
    • Breakdown details for Photoresist & coatings / Adhesive tapes / pre-applied & wafer-level underfills / Molding compounds / Thermal interface materials (TIM) / Plating & cleaning chemistries / Slurries for CMP / Temporary bonding materials/ Gas & precursors / sputtering targets / silicon & glass wafer carriers, capping, interposers and TGV substrates

2) 3DIC & WLP technologies process flows & manufacturing trends analysis

  • Focus on Flip-chip wafer bumping
    • Introduction & background
    • Typical manufacturing process flows
    • Equipment & Materials suppliers involved
    • Key process challenges and issues
  • Focus on WL CSP packaging
  • Focus on FO WLP packaging
  • Focus on 2.5D silicon interposers
  • Focus on “Via first” TSV”
  • Focus on 3D WLP
  • Focus on “Via Middle” TSV

3) DATABASE in excel format

  • Detailed analysis of the activity of the 375+ key equipment & material suppliers of the wafer-level-packaging tool-box solutions (activity profiling & key contacts included)

Conclusions & Perspectives

Appendix

Show More
RELATED REPORTS
* Global Semiconductor Wafer Cleaning Systems Market 2014-2018
  • Published:
  • Jul 14, 2014
  • USD 2500
  • 84 Pages

* Power Electronics Market by Substrate Wafer Technology (GaN, SiC, and Others), Devices (Power IC, Power Module & Power Discrete), Applications, and Geography - Analysis & Forecast to 2014 - 2020
  • Published:
  • May 01, 2014
  • USD 4650
  • 329 Pages

* Electronic Chemicals & Materials Market by Types (Silicon Wafer, PCB Laminate, Photoresist, Specialty Gases, etc.), Application (Semiconductor & IC, PCB), Forms (Solid, Liquid, Gaseous) & Geography - Regional Trends & Forecast to 2019
  • Published:
  • Mar 24, 2014
  • USD 4650
  • 226 Pages

* Gallium Nitride (GaN) Semiconductor Devices (Discrete & IC) and Substrate Wafer Market by Technology, Application, Product, Device & by Geography - Forecast & Analysis to 2013 - 2022
  • Published:
  • Mar 20, 2014
  • USD 4650
  • 422 Pages

* Global Optical Patterned Wafer Inspection Equipment Market 2014-2018
  • Published:
  • Mar 07, 2014
  • USD 2000
  • 48 Pages

* Sapphire Technology Market by Growth Technologies (KY, CZ, HEM, and EFG), Substrate Wafer (Si-on-Sapphire, SiC-on-Sapphire, GaN-on-Sapphire, and Others), Devices, Applications, and Geography - Analysis & Forecast to 2013 - 2020
  • Published:
  • Mar 03, 2014
  • USD 4650
  • 236 Pages

* Silicon Reclaim Wafers
  • Published:
  • Feb 01, 2014
  • USD 4950
  • 108 Pages

* Global Wafer Level Packaging Inspection Systems Market 2014-2018
  • Published:
  • Jan 17, 2014
  • USD 2500
  • 61 Pages

* Global Wafer-level Packaging Equipment Market 2014-2018
  • Published:
  • Jan 17, 2014
  • USD 2500
  • 55 Pages

* Silicon Reclaim Wafer Characterization Summary (Report)
  • Published:
  • Jan 01, 2014
  • USD 995
  • 28 Pages

Browse more Semicon Fab Market Research Reports

Pricing
Not Available
Get Notified
Email me when related reports are published