The Equipment & Materials business will grow by 4X in the next five years for 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and Flip-chip wafer bumping!
Demand for ‘mid-end' tools and related materials is surging, thanks to the growth of 3DIC & Wafer-Level-packaging technologies such as 3D TSV, FO WLP, 3D WLP, WLCSP, 2,5D interposers and Flip-chip wafer bumping.
Global Equipment & Material market forecast
for 3DIC & Wafer-Level-Packaging (in M$)
The material market will grow from ~$590M this year to over $2B by 2017 with a CAGR of 24%, driven mainly by the expansion of flip-chip wafer bumping, WLCSP and FOWLP technologies.
Also, the equipment market reached a value of ~$870M in 2011 with a CAGR of 28% fueled by the 3D IC technology with TSV interconnects, which represents one of the main emerging areas in the coming years; an area offering opportunities for new equipment modification and new materials development.
A slight decrease in 2012 is forecast, since manufacturers invested in equipment tools dedicated to the 3D TSV & WLP markets last year and high-volume production in 3D TSV, FO WLP, and 3D WLP has not started yet.
The materials market is diversified and segmented into several materials suppliers. Specialist material suppliers are involved and specialized in one specific sector.
However, the equipment market for 3D TSV & WLP applications is quite fragmented and diversified.
We can identify three main groups of equipment suppliers coming from different business markets:
The competitive landscape and market share for all main equipment & materials suppliers is quantified and detailed in this report.
Strippable thick resist for WLP applications
2011 Market Share Breakdown by supplier (in M$)
The wafer-level-packaging market remains a huge business opportunity and shows the greatest potential for significant future growth in the semiconductor industry.
Technologies related to equipment & materials used for different process flows are included in this report.
All key scenarios are analyzed, including flip-chip wafer bumping trends, Fan-in WLCSP, 3D WLP, FOWLP, 2.5D silicon interposers, and 3DIC Via Middle & Via Last processes.
Analysis on the “Via first” process flow is detailed in this report as well.
Our database is consistently updated with new information on key equipment & materials suppliers.
Along with the new research presented in this updated report, Yole delivers an Excel database which screens and profiles the detailed activity of more than 375+ small, medium and large equipment & materials suppliers coming from either the Front-end, Back-end assembly, PCB, LCD or Solar industries, and providing actual solutions for the 3DIC and wafer-level-packaging toolbox.
Equipment & Materials for 3DIC and Wafer-Level-Packaging:
GLOBAL supplies activity
One of the main developments this year was the acquisition of NEXX by Tokyo Electron (TEL) in March 2012
Amandine Pizzagalli joined Yole Dévelopment's Advanced Packaging and MEMS Manufacturing teams after graduating as an engineer in Electronics with a specialization in Semiconductors and Nano Electronics Technologies. Prior to Yole, she worked for Air Liquide with an emphasis on CVD and ALD processes for semiconductor applications.
Jerome Baron leads Semiconductor Packaging Market Research at Yole Développement. He has followed the 3D packaging market's evolution since its early beginnings at device, equipment and material levels. He earned a Master of Science degree in Nanotechnologies from the National Institute of Applied Sciences in Lyon, France.
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