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Wafer Packaging Fabs Database 2012

Notice
This publication has been discontinued on June 22, 2013.

Abstract

Discover the worldwide detailed activities and installed capacities for packaging at the wafer-scale in 275 different ‘Middle-End' factories

THIS WAFER PACKAGING FABS DATABASE FEATURES 275 FACTORIES WITH CAPACITIES FOR EACH ADVANCED PACKAGING PLATFORM

This second edition of the Wafer Packaging Fab database provides an exhaustive list of players involved in the Middle-End area. This unique tool provides a global overview of “who is doing what” in this emerging ecosystem. Many details concerning each fab location are provided (fab function, customers, JV, capacities by wafer size etc.). In addition, we propose in this new version the analysis of installed capacities in the Middle-End area through 100+ charts, following 3 main angles:

  • Advanced packaging platforms
  • Players
  • Geographical locations

All the charts are provided in the database excel file and in a 100-slide Powerpoint document.

2011 Cu Pillar Capacity
Breakdown by business model(12"eq. wspy)

Yole Développement © October 2012

For the first time, new analysis and charts about capacities expansions have been integrated in the database, thus giving an overview of investments on the 2010 - 2014 time frame.

Top 30: 2011 Middle-End Capacities by Player
Breakdown by tecchnological platform(12"eq. wspy)

Yole Développement © October 2012

MORE THAN 150 ENTRIES BY COMPANY !

Our database references 275 fab locations with technical information related to Wafer Level Packaging technologies or “middle-end” capabilities.

The tool provides an exhaustive list of players (IDM, OSAT, packaging house, bumping house, etc...):

  • Search by technology capacities and capabilities
  • Study the profile and repartition of one given technology among the different industry players
  • Study players manufacturing strategy, supply chain and worldwide strategy
  • Find small and big volume sources for your products

SAMPLE OF THE DATABASE

WORLDWIDE MAPPING

MAJOR COMPANIES CITED IN THE DATABASE

Amkor, Analog Devices, ASE, ASTRI, Avago, Bosch, CEA-LETI, China WLCSP, ChipBond, ChipMOS, EPCOS-TDK, Epson Electronics, Fairchild, Flip Chip International, Flip Chip Millennium, Fraunhofer, Freescale, Fujikura, Fujitsu Integrated Microtechnology, Global Foundries, IBM, IMEC, Infineon, INTEL, ITRI, JCET, Maxim IC, NANIUM, NEPES, NXP, OptoPAC, PTI, Renesas, Rohm, Samsung, SMIC, SK Hynix, Sony, SPIL, STATS ChipPAC, STMicroelectronics, Teramikros, Texas Instrument, Tezzaron, Toshiba, TriQuint, TSMC, UMC Global, Xintec.

BIO

Lionel Cadix joined Yole after completing several projects linked to the characterization and modeling of high-density TSV and 3DIC chip stacking in collaboration with CEA-Leti and STMicroelectronics for his PhD. He is the author of several publications and holds eight patents in the field of 3D Integration.

ABOUT YOLE DÉVELOPPEMENT

Founded in 1998, Yole Développement have grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services.

With a strong focus on emerging applications using silicon and/or micro manufacturing, Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaic, Advanced Packaging, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

Table of Contents

General information:

  • 275 fabs
  • Fab location
  • Fab function (Front-end, Back-end, etc...)
  • Main Customer, JV, partnership
  • Business model

Technology platforms available by location:

  • WLCSP
  • FOWLP
  • 3D WLCSP
  • 3DIC
  • 2.5D Interposers
  • Wafer Level Optics
  • Bumping (Au, solder, Cu, etc...)

Capacities information by wafer size

  • Capacities by platforms
  • Capacities by bumping technologies

2010/2014 Capacities expansion plans

  • Capacities expansion by advanced packaging platform

100+ key charts provided in a .ppt document

  • Breakdown by business model
  • Breakdown by regions/country
  • Breakdown by player
  • Breakdown by wafer size
  • 2010 - 2014 middle-end capacity expansion
  • 2010 - 2014 capacity expansion by player
  • Top 30 biggest capacities in the middle-end
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