Abstract
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Discover the worldwide detailed activities and installed capacities for packaging at the wafer-scale in 275 different ‘Middle-End' factories
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THIS WAFER PACKAGING FABS DATABASE FEATURES 275 FACTORIES WITH CAPACITIES FOR EACH ADVANCED PACKAGING PLATFORM
This second edition of the Wafer Packaging Fab database provides an exhaustive
list of players involved in the Middle-End area. This unique tool provides a
global overview of “who is doing what” in this emerging ecosystem.
Many details concerning each fab location are provided (fab function,
customers, JV, capacities by wafer size etc.). In addition, we propose in this
new version the analysis of installed capacities in the Middle-End area
through 100+ charts, following 3 main angles:
- Advanced packaging platforms
- Players
- Geographical locations
All the charts are provided in the database excel file and in a 100-slide
Powerpoint document.
2011 Cu Pillar Capacity
Breakdown by business model(12"eq. wspy)
Yole Développement © October 2012
For the first time, new analysis and charts about capacities expansions have
been integrated in the database, thus giving an overview of investments on the
2010 - 2014 time frame.
Top 30: 2011 Middle-End Capacities by Player
Breakdown by tecchnological platform(12"eq. wspy)
Yole Développement © October 2012
MORE THAN 150 ENTRIES BY COMPANY !
Our database references 275 fab locations with technical information related
to Wafer Level Packaging technologies or “middle-end” capabilities.
The tool provides an exhaustive list of players (IDM, OSAT, packaging house,
bumping house, etc...):
- Search by technology capacities and capabilities
- Study the profile and repartition of one given technology among the
different industry players
- Study players manufacturing strategy, supply chain and worldwide strategy
- Find small and big volume sources for your products
SAMPLE OF THE DATABASE
WORLDWIDE MAPPING
MAJOR COMPANIES CITED IN THE DATABASE
Amkor, Analog Devices, ASE, ASTRI, Avago, Bosch, CEA-LETI, China WLCSP,
ChipBond, ChipMOS, EPCOS-TDK, Epson Electronics, Fairchild, Flip Chip
International, Flip Chip Millennium, Fraunhofer, Freescale, Fujikura, Fujitsu
Integrated Microtechnology, Global Foundries, IBM, IMEC, Infineon, INTEL,
ITRI, JCET, Maxim IC, NANIUM, NEPES, NXP, OptoPAC, PTI, Renesas, Rohm,
Samsung, SMIC, SK Hynix, Sony, SPIL, STATS ChipPAC, STMicroelectronics,
Teramikros, Texas Instrument, Tezzaron, Toshiba, TriQuint, TSMC, UMC Global,
Xintec.
BIO
Lionel Cadix joined Yole after completing several projects linked to
the characterization and modeling of high-density TSV and 3DIC chip stacking
in collaboration with CEA-Leti and STMicroelectronics for his PhD. He is the
author of several publications and holds eight patents in the field of 3D
Integration.
ABOUT YOLE DÉVELOPPEMENT
Founded in 1998, Yole Développement have grown to become a group of companies
providing marketing, technology and strategy consulting, media in addition to
corporate finance services.
With a strong focus on emerging applications using silicon and/or micro
manufacturing, Yole Développement group has expanded to include more than 50
associates worldwide covering MEMS, Compound Semiconductors, LED, Image
Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaic, Advanced
Packaging, Nanomaterials and Power Electronics. The group supports industrial
companies, investors and R&D organizations worldwide to help them understand
markets and follow technology trends to develop their business.
Table of Contents
General information:
- 275 fabs
- Fab location
- Fab function (Front-end, Back-end, etc...)
- Main Customer, JV, partnership
- Business model
Technology platforms available by location:
- WLCSP
- FOWLP
- 3D WLCSP
- 3DIC
- 2.5D Interposers
- Wafer Level Optics
- Bumping (Au, solder, Cu, etc...)
Capacities information by wafer size
- Capacities by platforms
- Capacities by bumping technologies
2010/2014 Capacities expansion plans
- Capacities expansion by advanced packaging platform
100+ key charts provided in a .ppt document
- Breakdown by business model
- Breakdown by regions/country
- Breakdown by player
- Breakdown by wafer size
- 2010 - 2014 middle-end capacity expansion
- 2010 - 2014 capacity expansion by player
- Top 30 biggest capacities in the middle-end
Wafer Packaging Fabs Database 2012 published by Yole Developpement in November 19, 2012. This report price starts from US $ 5390.
The contents of this page may be different from the latest version. Please contact us for details.
