The MEMS packaging, assembly, test & calibration market will reach $2.3B
value by 2016, growing three times faster than the overall IC packaging
industry
MEMS PACKAGING MARKET IS GROWING FASTER THAN IC PACKAGING MARKET
In package unit shipments, the MEMS packaging market is growing 2x faster (~
20% CAGR) than what is predicted for the overall IC package market. WLP / TSV
platform is set to grow the fastest while leadframe and organic laminate based
packages are poised to grow a comfortable 16% CAGR over the next 5 years to
come. There are plenty of MEMS and sensors to be found in recent smartphone
designs: MEMS accelerometers, gyroscopes, pressure sensors, electronic compass
magnetometers, multiple silicon MEMS microphones, FBAR / BAW filters &
duplexers, RF switches and MEMS oscillators: there is no doubt that MEMS
content is growing faster than standard IC content.
CHANGING THE PARADIGM
In terms of how the packaging is involved, it's all about orchestrating the
assembly of MEMS sensor and their related ASIC inside a module. But this is
costly: packaging, assembly, test and calibration steps account for nearly 35%
to 60% of a total MEMS packaged module's cost.
MEMS types of packaging are more complex than most standard IC packages
because they require "System-in-Package" type of assembly. Additionally, most
MEMS packages are connecting sensors to their final environment, bringing very
specific constraints at the module level such as building a cavity, a hole in
the substrate or metal lead for pressure sensor and microphones, an optical
window for optical MEMS, a full vacuum hermeticity at the die level.
The application scope of MEMS is broad and very diversified. Since its early
beginnings, the MEMS industry faced the issue of being a highly fragmented
market, with NO manufacturing standards clearly emerging Packaging always
needed to cope with the very specific end-applications requirements of MEMS
modules
However, the MEMS law "One MEMS = 1 Device with 1 Process with 1
Package" is now changing as several packaging platform standards are now
clearly emerging (such as WLP & TSV interconnects, SiP module assembly based
on molded or cavity packaging for e.g.)
This report is featuring a full analysis of packaging, assembly & test
requirements application by application as well as a dedicated focus on MEMS
package substrates such as ceramic, leadframe and organic laminates.
STANDARDS ARE ON THE WAY
While there are a lot of developments happening for high reliability, low cost
MEMS packages in the automotive, medical and industrial application space, the
number of MEMS and sensors going into mobile, consumer and gaming applications
is expected to continue to skyrocket, driving integration of an incredibly
high number of MEMS and sensor devices in unprecedented volume. As a result,
OSAT and wafer foundry players are getting more and more interest in MEMS
module packaging, as volume and complexity of MEMS SiP modules is increasing
dramatically, implying several key trend in this space:
IDMs needs to find second sources partners and qualify some OSATs in order
to secure their supply chain
Standardization (coming from both foundries, OSAT, WLP houses or substrate
suppliers) is critical and necessary to implement in order to keep the
packaging, assembly, test and calibration cost of MEMS modules under control.
More than ever, system-level integration (including package co-design &
software competencies, SiP module assembly, passive integration and 3D TSV /
WLP capabilities) will be key to leverage a high added value solution to final
OEM customers as well as an efficient infrastructure to support the high
volume grow of consumer MEMS applications. There are many different players
with different designs, and it's not likely we'll see one solution adopted by
all the players. Expect to see a blooming of several "big niches" standards in
the future, driven by the biggest and most successful players. **4
KEY FEATURES OF THE REPORT
To provide market data on key MEMS packaging industry market metrics &
dynamics
MEMS package and substrate unit shipments and revenues application by
application
Market shares for key MEMS player with detailed breakdown inside each
MEMS applicative segment
To provide technical insight about key MEMS packaging technology trends &
challenges
From MEMS-ASIC integration trends (SiP module versus SOC) to
interconnect trends (wire-bond versus flip-chip versus WLP / TSV) to
substrate approach (ceramic, leadframe, organic laminate, silicon/glass
interposers)
Teardowns module analysis and reverse costing analysis of the main key
MEMS package modules design wins from top tiers player leaders in their
respective applicative market space
Specific requirements in each MEMS packaging applications along with
packaging technologies roadmaps
Focus on final test and calibration trends which represent more than
20-30% of the total MEMS modules value
To provide a deep understanding of the MEMS packaging value chain,
infrastructure & players
Who are the key players (IDMs, fab-less, wafer foundries, packaging &
test subcontractors) involved in the MEMS packaging business and how are
they related?
Where is the value in the MEMS packaging, assembly, test & calibration
area depending on each application? How this value is shared among the
different business models in this space and how does this value flows?
Assembly & test service packaging subcontractors (OSATs)
Understand the MEMS packaging industry market dynamics and its key
future applications
Get the list of today's and tomorrow key MEMS players to drive your
business
Understand the key MEMS modules cost structures through explicit
teardown analysis
Plan ahead for needed investments capacity related to this field
MEMS IDM's (Integrated Device Manufacturers) and fabless companies
Get the list of the top assembly, packaging & test packaging
subcontractors active in the MEMS packaging business
Benchmark competition activity and choose the right package and partner
for your future MEMS module applications
Substrate suppliers
Understand the differentiated value of your products and technologies in
the MEMS market
Evaluate your related TAM 'Total Accessible Market' in this market
Get the list of today's and tomorrow key MEMS players to drive your
business
MEMS and CMOS wafer foundries
Spot new opportunities and define diversification strategies, especially
related to the MEMS Wafer-Level-Packaging opportunity (with wafer bonding,
TSV, RDL and bumping features)
Electronic module makers and OEMs
Evaluate the benefits of using these new technologies in your end system
Monitor new application and package trends
Benefits
KEY FEATURES OF THE REPORT
To provide market data on key MEMS packaging industry market metrics &
dynamics
MEMS package and substrate unit shipments and revenues application by
application
Market shares for key MEMS player with detailed breakdown inside each
MEMS applicative segment
To provide technical insight about key MEMS packaging technology trends &
challenges
From MEMS-ASIC integration trends (SiP module versus SOC) to
interconnect trends (wire-bond versus flip-chip versus WLP / TSV) to
substrate approach (ceramic, leadframe, organic laminate, silicon/glass
interposers)
Teardowns module analysis and reverse costing analysis of the main key
MEMS package modules design wins from top tiers player leaders in their
respective applicative market space
Specific requirements in each MEMS packaging applications along with
packaging technologies roadmaps
Focus on final test and calibration trends which represent more than
20-30% of the total MEMS modules value
To provide a deep understanding of the MEMS packaging value chain,
infrastructure & players
Who are the key players (IDMs, fab-less, wafer foundries, packaging &
test subcontractors) involved in the MEMS packaging business and how are
they related?
Where is the value in the MEMS packaging, assembly, test & calibration
area depending on each application? How this value is shared among the
different business models in this space and how does this value flows?
WHO SHOULD BUY THE REPORT?
Assembly & test service packaging subcontractors (OSATs)
Understand the MEMS packaging industry market dynamics and its key
future applications
Get the list of today's and tomorrow key MEMS players to drive your
business
Understand the key MEMS modules cost structures through explicit
teardown analysis
Plan ahead for needed investments capacity related to this field
MEMS IDM's (Integrated Device Manufacturers) and fabless companies
Get the list of the top assembly, packaging & test packaging
subcontractors active in the MEMS packaging business
Benchmark competition activity and choose the right package and partner
for your future MEMS module applications
Substrate suppliers
Understand the differentiated value of your products and technologies in
the MEMS market
Evaluate your related TAM 'Total Accessible Market' in this market
Get the list of today's and tomorrow key MEMS players to drive your
business
MEMS and CMOS wafer foundries
Spot new opportunities and define diversification strategies, especially
related to the MEMS Wafer-Level-Packaging opportunity (with wafer bonding,
TSV, RDL and bumping features)
Electronic module makers and OEMs
Evaluate the benefits of using these new technologies in your end system
Monitor new application and package trends
Table of Contents
Table of Contents
Introduction to MEMS industry p.8
Applications, players and market dynamics
Executive Summary p.21
Global MEMS packaging 2010-2016 market forecast p.40
Overall MEMS package shipments forecast (in units)
