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Polymeric Materials for 3DIC & WLP Applications

Notice
This publication has been discontinued on June 21, 2014.

Abstract

Desxription

The first complete report analyzing in detail the opportunities for Polymeric Materials in 3DIC & Wafer-Level Packaging applications

POLYMER USAGE WILL GROW BY 26% CAGR IN WAFER LEVEL APPLICATIONS OVER 5 YEARS

Polymeric semiconductor material market reach a value of $274M last year and its growth of more than 26% CAGR is fueled by the expansion of flip-chip wafer bumping, Fan-in WLCSP packages, 3D WLP, FO WLP packages, 2.5D Glass / Silicon interposers and 3DIC packages over the next 5 years to come.

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For the first time, Yole's analysts have been able to gather market data, technology information and analysis necessary to answer the following questions:

  • What materials are being used in what applications ?
  • What key properties do I need to understand before I make a materials choice ?
  • Who are the key supplies of these materials and what is their market share?
  • What synergies do competitors have in their product lines ?

AN INCREASING NUMBER OF POLYMERS ARE USED FOR WLP APPLICATIONS

About half of the demand today for polymeric materials in 3DIC & WLP applications is driven by dielectric passivation resins which reached about $107M market value in 2011.

Polymide (PI) and BCB of DOW Chemical still account for > 70% of the total demand, historically by the growth flip-chip bumping an WLCSP passivation steps.

PBO, epoxies, WPR and AL-X recently entered the market thanks to the recent growth demand in 300mm WLCSP, FOWLP and emerging 3DIC applications.

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This research will cover :

  • Global materials market forecast
  • Global forecast breakdown by application
  • Global forecast breakdown by function
  • Detailed market breakdown of permanent dielectrics by material, supplier, account

A WIDE RANGE OF POLYMERIC MATERIALS ARE USED TO SOLVE WLP ISSUES

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There is a wide range of polymeric material available on the market. This study will feature:

  • Chemistries and history of key microelectronic polymers
  • Properties, pros & cons for each solution
  • Applications by polymer type
  • Processing considerations

NEW FUNCTIONS OF POLYMERIC MATERIALS ARE LEVERAGING BURGEONING WLP MARKET

Today demand is driven by FC wafer bumping, fan-in WLCSP and thin-film IPD. Tomorrow, significant demand will shift to FOWLP, 3DIC stacks, 3D WLP, and 2.5D interposer substrate platforms.

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Types of polymeric materials covered:

  • Permanent dielectric polymers
  • Thick plating resists
  • Temporary bonding & de-bonding adhesives
  • Hard mask resist for DRIE etch
  • Wafer-level underfills
  • Wafer-level molding cmpds
  • Adhesive tape (BG/Dicing tape)

DETAILED MATERIAL SUPPLIER PROFILES

Corporate profiles detailing financials, employees, polymer products for wafer level packaging and selected properties of these products are compared and contrasted for : 3M, Ajinamoto, Asahi Glass, Asahi Kasei, Brewer Science, Cookson, Dow Chemical, Dow Corning, DuPont, HD Microsystems, Fujifilm, Hitachi Chemical, Henkel, JSR Micro, Lord, Namics, Nitto Denko, Nippon Kayaku, Shin Etsu, Silecs, Simitomo Bakeite, TOK and Toray.

Benefits

WHO SHOULD BUY THIS REPORT?

  • Material suppliers
    • Assess the TAM ( total accessible market) for your company's polymeric products
    • Identify tech trends, challenges and requirements for each 3DIC / WLP scenarios. Are their markets you could be serving?
  • Materials users (IDMs, Wafer Foundries, Packaging Houses)
    • Identify competitive materials, What are others using ?
    • Consolidate suppliers by understanding their full product offerings
  • Equipment Vendors
    • What materials should you be developing processes for ?
    • What are the technology trends ?

Table of Contents

Scope of the report

Executive summary

Key Properties of Polymeric materials

  • Electrical properties
  • Mechanical Properties
  • Thermal Properties
  • Others Properties
  • Comparison of Polymer Properties

Commercial Microelectronic Polymer Chemistries

  • Epoxies
  • Polyimides
  • Polybenzoxozoles (PBO)
  • BCB
  • Siloxanes
  • Parylene
  • Polynorbornenes
  • AL-X aromatic fluoropolymer

Polymeric materials for Wafer Level Packaging Functions Applications

  • Permanent dielectric polymers
  • Strippable plating resists
  • Temporary bonding & de-bonding Adhesives
  • Hard mask Thick resist for DRIE
  • Wafer-level underfills
  • Wafer-level Molding Compounds

Permanent Dielectric -Material Processing Considerations

  • Wafer-level Molding Compounds
  • Spin-coating
  • Spray-coating
  • Other depositions
  • Lithography (Expose & Develop)
  • Curing / Descum
  • Stripping/cleaning

Mid-End / WLP Application platforms

  • Flip-chip wafer bumping
  • 'Fan-in' WL CSP
  • FO WLP
  • 3D WLP
  • 3D IC with TSV
  • 2.5 silicon interposers
  • Passive Integration Thin-film IPD

Market size by Material / Application/Supply chain

  • WLP Materials market forecast for WLP applications
    • 2011-2016 Global Materials Market Forecast
  • 2011-2016 Global Materials market forecast breakdown
    • 2010-2016 Polymer materials forecast breakdown by materials functions
  • Dielectric passivation polymers: details market forecast
    • WLP cost breakdown per material supplier 2011
    • WLP cost breakdown by polymer type 2011
    • Polymer market share per supplier
    • Demand by player breakdown by application per player

Polymeric material suppliers Company profiles

Conclusions & Perspectives

Appendix

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