The first complete report analyzing in detail the opportunities for Polymeric Materials in 3DIC & Wafer-Level Packaging applications
Polymeric semiconductor material market reach a value of $274M last year and its growth of more than 26% CAGR is fueled by the expansion of flip-chip wafer bumping, Fan-in WLCSP packages, 3D WLP, FO WLP packages, 2.5D Glass / Silicon interposers and 3DIC packages over the next 5 years to come.
For the first time, Yole's analysts have been able to gather market data, technology information and analysis necessary to answer the following questions:
About half of the demand today for polymeric materials in 3DIC & WLP applications is driven by dielectric passivation resins which reached about $107M market value in 2011.
Polymide (PI) and BCB of DOW Chemical still account for > 70% of the total demand, historically by the growth flip-chip bumping an WLCSP passivation steps.
PBO, epoxies, WPR and AL-X recently entered the market thanks to the recent growth demand in 300mm WLCSP, FOWLP and emerging 3DIC applications.
This research will cover :
There is a wide range of polymeric material available on the market. This study will feature:
NEW FUNCTIONS OF POLYMERIC MATERIALS ARE LEVERAGING BURGEONING WLP MARKET
Today demand is driven by FC wafer bumping, fan-in WLCSP and thin-film IPD. Tomorrow, significant demand will shift to FOWLP, 3DIC stacks, 3D WLP, and 2.5D interposer substrate platforms.
Types of polymeric materials covered:
Corporate profiles detailing financials, employees, polymer products for wafer level packaging and selected properties of these products are compared and contrasted for : 3M, Ajinamoto, Asahi Glass, Asahi Kasei, Brewer Science, Cookson, Dow Chemical, Dow Corning, DuPont, HD Microsystems, Fujifilm, Hitachi Chemical, Henkel, JSR Micro, Lord, Namics, Nitto Denko, Nippon Kayaku, Shin Etsu, Silecs, Simitomo Bakeite, TOK and Toray.