The Deep Reactive Ion Etching ("DRIE") is a structuration process originally used for MEMS. This process enables achieving etch depths of 100s of micrometers with almost vertical sidewalls with very high aspect ratio (> 50:1 in some cases). The process was first developed by Robert Bosch, and thus it is also called the "BOSCH process" and is used whenever high aspect ratios are targeted. SPP, the equipment manufacturer,obtained a license from Bosch to exploit the technology.This agreement has led to incredible growth of the DRIE market. First used for production of accelerometers, the process is used today for production of (some) ink jet-heads, pressure sensors,gyroscopes, micro phones and micro actuators (e.g.MEMS auto-focus). But the use of the process has become popular outside of the MEMS world, for Advanced Packaging applications.
The DRIE process is unique to achieve very high aspect ratio with vertical walls in a semiconductor environment. Therefore, because this etching process is becoming more and more used, Yole Developpement has released this "Deep Reactive Ion Etching, Technology & Market" report. From 2011 to 2017, the number of DRIE-processed wafers will jump from 5.4M to more than 27M (all wafer sizes). This is > 30% CAGR (see figure 1).
The report describes the following points:
The report will analyze the technical & economic evolution of the DRIE technology. It will give:
Overview of the different DRIE approaches Description of the applications for DRIE with main characteristics Equipment players market shares and competitive information
In the years 2005+, the emerging of the Through Si Vias ("TSV") technology for 3D stacking gave a breath to the DRIE technology. Today, DRIE is used through three different technology platforms:
And the third application covers Power Devices, where DRIE is a competing technology for Super Junction MOSFETs. Niche "innovation" applications are also driving the DRIE market (e.g. micro components for watches).
This buoyant DRIE market is highly competitive with more than 10 vendors. Although SPTS is market leader in number of shipped DRIE chambers, SPTS is now challenged by Lam Research and many other vendors: Maxis, Panasonic Factory, SAMCO, AMAT, Hitachi High Tech, Oxford Instruments, TEL. These companies are described in the report.
The Yole report also describes the forecast for DRIE-related chemistry (gas & hard mask thick resist). The report identifies technology trends, challenges and precise requirements for DRIE process, we screen competitive activity, and identify the potential applications that might require the use of DRIE technology.
AAC Acoustic, Air Liquide, Air Product, Akustica, Analog Devices, Applied Materials, Brewer Science, Bosch, DuPont, Epson, Fairchild, FujiElectric, IceMos, Ipdia, Hitachi High-Tech, Hua-Hong NEC, Invensense, Kodak, Knowles, LAM Research, Maxis, Memjet, Nippon Kayaku, Oxford Instrument, Microchem, Panasonic Factory, Pelchem, SAMCO, Silecs, Shin-Etsu, ST Micro, Panasonic, Renesas, SPTS, Tokyo Electron, ULVAC, VTI, Ycchem...