Memory Applications, Packaging & Integration Trends 2009 published by Yole Developpement in May, 2009. This report consists of 283 slides and the price starts from US $ 5290.
Abstract
How 3-D integration will challenge and reshape the memory industry?
The memory semiconductor industry is about to go through a period of major
technological changes as new integration trends and disruptive packaging
technologies pave the way to the future growth of this industry
Historically, the DRAM memory market has been mostly driven by computing
applications while NOR Flash has been mainly deployed into consumer and
communication devices. More recently, NAND Flash memory has emerged as the
most promising solid state storage solution for current consumer devices and
is showing as the best candidate for hard disk drive replacement in the near
future.
INTEGRATION IS THE NEXT CHALLENGE
On the other hand, today wireless is growing and enabling new market segments
everywhere, (smart-phones, mobile pocket computing devices ). As a result,
CONNECTIVIY and INTEGRATION are now new drivers to deal with. Demand for data
is increasing everywhere: Faster pipes, more pipes (WAN, LAN, PAN), HD
multimedia Current complexity and concurrency require more than ever higher
data capacity, improved power consumption and is stressing existing well
established architectures: new interconnects, integration schemes and
packaging technologies are needed to support higher performance, breakthrough
density and low power consumption devices. 3-D IC integration is showing as a
major solution path to tackle these challenges and memories will be key
components in achieving this successful integration.
3-D INTEGRATION WILL OPEN A NEW APPLICATION SPACE FOR MEMORY MARKET
Yole Developpement has followed the burgeoning 3-D Packaging industry since
its early beginning The global economic downturn is challenging the fast
adoption of the "Through Silicon Vias" technology into high volume
applications such as low cost memories. However, we are seeing concrete signs
that this market is definitely taking-off, with the first 3-D integrated DRAM
memories being shipped this year: we estimate that about 20 000 wafers of DRAM
memory will be shipped with 3D TSV by the end of 2009, with production moving
forward to higher volumes in 2010. By 2013, we expect that telecom and
computing industries will drive more than 70% of the volume for 3-D TSV
integrated memories.
3-D integration with memories is a hot topic at the moment because of the
challenging market conditions and of the important investment needed for
building the required infrastructure. As a result, precompetitive alliances
and partnerships may be necessary to drive the risk down while accelerating
product adoption. Memory manufacturers, CMOS foundries, OSAT packaging houses,
Fab-less IC players and integrated device manufacturers are all concerned and
actively preparing for this ultimate integration.
This new study aims at answering the following questions: What are the end
applications driving the use of 3-D integrated memories? Who are the key
players doing it? How will it happen? When will the market ramp up? What is
the impact of the current economic turmoil? How big is this 3-D memory market
going to be and at which conditions? How will 3D TSV technologies boost new
applications and drive the growth of Flash and DRAM market?
Key features of the report
- Up-to-date Key metrics of the memory market:
- Per application (more than 30 products screened)
- Per type of memory (DRAM / SRAM / NOR / NAND Flash)
- In Munits shipment and in 300mm wafer equivalent
- Impact of 3-D integration on the memory market and applications
- Key players strategy for 3DIC integration with memories
- Cost analysis & challenges for TSV manufacturing:
- How to make TSV interconnects happen in high volume / low cost memory
markets?
Companies cited in the report:
- AMD, Amkor
- Chartered Semiconductor
- Dai Nippon Printing
- Dongbu HiTek
- Ibiden
- IBM
- IMFlash
- Intel
- Elpida
- Excico
- Freescale
- Fujitsu
- Hynix
- Micron
- Nanya
- NEC
- Numonyx
- Qualcomm
- Renesas
- TSMC
- Texas Instruments
- Samsung
- SanDisk
- Seagate
- Shinko
- SOITEC / Tracit
- Sony
- StatsChipPac
- STMicroelectronics
- Spansion
- SPIL
- Swissbit
- Tezzaron
- Toshiba
- UMC
- Xilinx
- Ziptronix
- and more
Table of Contents
Introduction to memory technologies 1
- DRAM / SRAM / NOR Flash / NAND Flash
- 2008 overall memory shipment market (in Units)
- 2008 overall memory market revenues (in $B)
- Trends for next generation Non-Volatile memory technologies:
- M-RAM / PC-RAM: status of industrialization and near-term opportunities
Memory Applications & Markets .. 18
- Current & future applications driving DRAM / SRAM / NAND / NOR Flash
memory demand
- Per industry:
- 2008 Market forecasts in Munits shipment and in 300mm wafers equivalent
- Breakdown for Telecom / Computing / Consumer / Servers / Automotive /
Industrial & Medical markets
- Per product / application:
- 2008-2015 market forecasts in Munits shipment and in 300mm wafers
equivalent
- Breakdown for Desktop PCs / Notebooks / Net books / MID / Regular &
Blade Servers / Data storage servers / Portable media players / Portable
game stations / Memory Cards / USB Stick / Cell-phones / Game stations /
Set-Top Box / HD camcorders / DSC / SLR / Automotive / Base stations /
Portable navigation Sys GPS / Digital TV / Workstations / Memory
Upgrades / HDD / Printer / Analog TV / DVD Player / HPC / ATE systems
Memory Packaging & Integration Trends 33
- Architectures and memory die quantity analysis in current product
generation:
- Focus on Cell-phones, SSDs, DSCs, servers, Portable media players and
game stations
- Single Die versus Stacked packaging:
- 2008-2015 Key market metrics and trends for memory - integration using
TSO P / FBGA / PoP / PiP / WLP Fan-in / Fan-out WLP packages / Silicon
interposers
Impact of 3-D integrations on the memory market 55
- Applications and market drivers for 3D integration with memories
- gEmbedded 3D-SOC memoriesh Versus g3-D Stacked memories in SiPh:
- Definitions, players and roadmaps
- 2008-2015 market forecasts in Munits shipment and in 300mm wafers
equivalent
- "3D Chip Stacking" Vs. "Circuit Transfer 3D" Vs. "Monolithic 3D"
integration
- Definitions, players and roadmaps
- 2008-2015 market forecasts in Munits shipment and in 300mm wafers
equivalent
- Impact of MLC versus SLC Flash memory architecture on adoption of 3-D TSV
memories
- Definitions, players and roadmaps
- 2008-2015 market forecasts in Munits shipment and in 300mm wafers
equivalent
- Silicon interposers for 3D TSV memories:
- Definitions, players and roadmaps
- 2008-2015 market forecasts in Munits shipment and in 300mm wafers
equivalent
- TSV manufacturing cost challenge:
- What is the process and cost of TSV in memories today?
- What is the targeted cost for a broad adoption of 3-D TSV into low cost
memory markets?
- Overall Roadmap for 3-D integration with Memories (2008 2015)
- Impact of 3-D integration on DRAM / SRAM / NAND / NOR Flash memory markets
- 2008-2015 market forecasts in Munits shipment and in 300mm wafers
equivalent
- Breakdown per mount technology: forecast for Single die / Wire Bond
stacked / 3-D TSV memory
- Breakdown per application:
- Opportunities of 3-D integrated memory in DDR3 / DDR4 / Wireless
Application processors / Wireless Baseband - DSP / SSDs / Graphic memory /
Micro-Cards / Embedded & Cache CPU-GPU / FPGAs
Player' s strategy for 3-D integration with memories c 85
- Supply chain analysis: Memory fabs / CMOS foundries / / OSAT packaging
houses / IDMs / Fab-less / Integrator player activities
- Infrastructure & pre-competitive alliances in 3-D IC system integration
Perspectives & Conclusions 98
Annexes 104
