Texas Instruments DLP®-MEMS DMD: Reverse Costing Analysis

Published by	System Plus Consulting
Published	April, 2009	Product code	90773
Content info
Price	US $ 2340 PDF by E-mail (Single User License) US $ 2930 PDF by E-mail ( Site License) US $ 3510 PDF by E-mail (Corporate License)

Introduction
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Texas Instruments DLP?-MEMS DMD: Reverse Costing Analysis published by System Plus Consulting in April, 2009. This report price starts from US $ 2340.

Introduction

Abstract

Yole Developpement is pleased to distribute System Plus Consulting reverse costing report of the MEMS Digital Micro-mirror Device (DMD) for pico-projectors supplied by Texas Instruments. Based on a complete reverse engineering process the report provides an estimation of the production cost as well as the selling price of the circuit.

This Texas Instruments DLPR component is used in pico-projectors systems which can be integrated in phones or in pocket projectors. It uses a specific MEMS technology process using around 187K micro-mirrors with a 7x7μm area to perform a picture. Micro-mirrors are controlled by a CMOS integrated circuit and SRAM memory. The device uses a wafer level packaging technology and a ceramic substrate.

This report provides complete teardown of the MEMS with :

Detailed photos
Material analysis
Schematic assembly description
Manufacturing Process Flow
In-depth economical analysis
Manufacturing cost breakdown
Selling price estimation

Executive Summary p2

Reverse Costing methodology p6

Physical Analysis p7

Physical Analysis Methodology
Digital Micromirror Device
Package
Optical Apertures
Ceramic substrate
Micromirrors - Pictures
ASIC Process Characteristics
Functional Blocks Areas
Synthesis Part 1

Manufacturing Process p20

Front End Process Flow
Back End Process Flow
Wafer Fabrication Unit
Synthesis Part 2

Manufacturing Cost p26

Wafer Cost Data
Main Steps of Economic Analysis
ASIC Wafer Cost
Front End MEMS Wafer Costs
- Breakdown per Process Steps
- Breakdown per Equipment
- Breakdown per Consumables
Probe Test Cost
Windows and Walls Costs
Back End Wafer Cost
- Breakdown per Process Steps
- Breakdown per Equipment
- Breakdown per Consumables
Total Wafer Cost
DMD Silicon Cost
Packaging Cost
Final Test Cost
Component Manufacturing Cost
Synthesis part 3