Cover Image
Annual Information Service

Material Market Data Subscription (MMDS)

Published by SEMI Product code 44297
Published 4 issues / year Content info
Price
Back to Top
Material Market Data Subscription (MMDS)
Published: 4 issues / year Content info:
Description

Note: “Material Market Data Subscription (MMDS)” is also available as a one-off report, please contact GII for further information.

Abstract

Quarterly Worldwide Semiconductor Material Market Data and Trends

The Material Market Data Subscription includes current revenue data along with three-year forecast and two years of historical data. The report contains 10 segments for wafer fab related materials and 7 segments for packaging related materials. In addition, quarterly revenues are included for photoresist, and ancillaries. Shipment numbers are included for silicon* (quarterly) and leadframe (monthly).

Seven regions of the world are covered in this report including North America, Japan, Europe, Korea, Taiwan, China, and Rest of World (ROW). All sales revenue estimates are reflected in U.S. dollars.

Methodology

Data is compiled from actual inputs by material suppliers from around the world. Key categories are updated each quarter with data supplied by participating semiconductor material companies to an independent third-party accounting firm, guaranteeing confidentiality of company specific information.

Screenshot


Material Market Data Subscription
Format: xls

Coverage

Fab MaterialsPackaging Materials
  • Silicon
  • SOI
  • Photomasks
  • Resist
  • Ancillaries
  • Gases
  • Chemicals
  • Targets
  • CMP
  • Others
  • Leadframes
  • Substrates
  • Bonding Wire
  • Die Attach
  • Mold Compounds/Encapsulants
  • Ceramic Packages
  • Others

About SEMI

SEMI® is the global industry association serving the manufacturing supply chain for the micro- and nano-electronics industries.

The industries, companies, and people SEMI represents are the architects of the electronics revolution. SEMI members are responsible for the innovations and technologies that enable smarter, faster, more powerful, and more affordable electronic products and devices that bring the power of the digital age to more people every day.

Table of Contents
Product Code: 330

Table of Contents

  • Intro
  • Wafer Fab Materials
  • Packaging Materials
  • Quarterly Silicon Shipments
  • Quarterly Photoresist Sales
  • Quarterly PR Ancillary Sales
  • Quarterly Process Gas Sales
  • Monthly Leadframe Shipment
Back to Top