Wafer Backgrinding Tape Market By Type (UV Curable and Non-UV), and Wafer Size (6-Inch, 8-Inch, 12-Inch, and Others): Global Opportunity Analysis and Industry Forecast, 2021-2030

Description

List of Tables

Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits. It is the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly. It is also referred to as wafer thinning. Most package types in the semiconductor industry today would require a wafer thickness ranging from 8 mils to 20 mils.

Wafer backgrinding tapes fully protect the wafer surface during backgrinding and also prevent wafer surface contamination from infiltration of grinding fluid. Usage of wafer backgrinding tapes in wafer fabrication ensures precision in wafer thickness after backgrinding. Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting. Once the wafer has been processed, exposing the tape to ultraviolet light (UV) reduces its adhesive strength, making tape peeling or die pick up simple.

On March 14, 2017, Furukawa Electric Co., launched "Plasma Masked Backgrind Tape" for laser grooving and plasma dicing. The tape is expected to improve the quality of chips and wafers.

The factors such as rise in need for wafer fabrication, increase in focus toward wafer surface protection during grinding process, and growth in the semiconductor industry boost the growth of the wafer backgrinding tapes market globally. However, increase in shift from non-UV to UV curable backgrinding tapes that increase the overall cost of wafer manufacturing is expected to hamper the market growth.

Furthermore, increase in investment in wafer fabrication equipment and materials, especially in Korea and China, is expected to offer lucrative opportunities for market expansion.

The wafer backgrinding tapes market is segmented on the basis of type, wafer size, and region. By type, the market is bifurcated into UV curable and Non-UV. By wafer size, the market is divided into 6-inch, 8-inch, 12-inch, and others. By region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.

The key players profiled in the report include Furukawa Electric Co. Ltd., Mitsui Chemicals, Inc., Nitto Denko Corporation, Minitron Elektron GMBH, Denka Company Limited, Lintec of America Inc., AI Technology, Inc., Force-One Applied Materials Inc., AMC Co, Ltd, and Pantech Tape Co., Ltd. These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.

Wafer Backgrinding Tape Market Key Segments

By Type

UV Curable
Non-UV

By Wafer Size

6-Inch
8-Inch
12-Inch
Others

By Region

North America
U.S.
Canada
Mexico
Europe
UK
Germany
France
Russia
Rest of Europe
Asia-Pacific
China
Japan
Taiwan
South Korea
Rest of Asia-Pacific
LAMEA
Latin America
Middle East & Africa
Key Market Players
AI Technology Inc.
AMC Co. Ltd.
Denka Company Limited
Furukawa Electric Co. Ltd.
Force-One Applied Materials
Lintec of America Inc. (Lintec Corporation)
Mitsui Chemicals Inc.
Nitto Denko Corporation
Pantech Tape Co. Ltd.
Minitron Elektronik GmbH

Product Code: SE_195394 / A05029

CHAPTER 1:INTRODUCTION

1.1.Report description
1.2.Key benefits for stakeholders
1.3.Key market segments
1.4.Research methodology
- 1.4.1.Primary research
- 1.4.2.Secondary research
- 1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

2.1.CXO perspective

CHAPTER 3:MARKET OVERVIEW

3.1.Market definition and scope
3.2.Key findings
- 3.2.1.Top impacting factors
- 3.2.2.Top investment pockets
3.3.Porter's five forces analysis
3.5.Market dynamics
- 3.5.1.Drivers
  - 3.5.1.1.Increase in demand for ultra-thin wafers
  - 3.5.1.2.Rise in need for wafer fabrication
  - 3.5.1.3.Increase in focus toward wafer surface protection during grinding process
  - 3.5.1.4.Growth in the semiconductor industry
- 3.5.2.Restraint
  - 3.5.2.1.Increase in cost of wafer manufacturing
- 3.5.3.Opportunity
  - 3.5.3.1.Increase in investment in wafer fabrication equipment and materials
3.6.COVID-19 impact analysis
- 3.6.1.COVID-19 Outbreak
- 3.6.2.Impact on market size
- 3.6.3.End user trends, preferences, and budget impact
- 3.6.4.Key player strategies to tackle negative impact
  - 3.6.4.1.Limiting cuts to R&D expense:
  - 3.6.4.2.Shifting toward agile supply chain model
- 3.6.5.Opportunity window

CHAPTER 4:WAFER BACKGRINDING TAPE MARKET, BY TYPE

4.1.Overview
4.2.UV Curable
- 4.2.1.Key market trends, growth factors, and opportunities
- 4.2.2.Market size and forecast, by region
- 4.2.3.Market analysis, by country
4.3.Non-UV
- 4.3.1.Key market trends, growth factors, and opportunities
- 4.3.2.Market size and forecast, by region
- 4.3.3.Market analysis, by country

CHAPTER 5:WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE

5.1.Overview
5.2.6-Inch
- 5.2.1.Key market trends, growth factors, and opportunities
- 5.2.2.Market size and forecast, by region
- 5.2.3.Market analysis, by country
5.3.8-Inch
- 5.3.1.Key market trends, growth factors, and opportunities
- 5.3.2.Market size and forecast, by region
- 5.3.3.Market analysis, by country
5.4.12-Inch
- 5.4.1.Key market trends, growth factors, and opportunities
- 5.4.2.Market size and forecast, by region
- 5.4.3.Market analysis, by country
5.5.Others
- 5.5.1.Key market trends, growth factors, and opportunities
- 5.5.2.Market size and forecast, by region
- 5.5.3.Market analysis, by country

CHAPTER 6:WAFER BACKGRINDING TAPE MARKET, BY REGION

6.1.Overview
6.2.North America
- 6.2.1.Key market trends, growth factors, and opportunities
- 6.2.2.Market size and forecast, by type
- 6.2.3.Market size and forecast, by wafer size
- 6.2.4.Market analysis, by country
  - 6.2.4.1.U.S.
  - 6.2.4.1.1.Market size and forecast, by type
  - 6.2.4.1.2.Market size and forecast, by wafer size
  - 6.2.4.2.Canada
  - 6.2.4.2.1.Market size and forecast, by type
  - 6.2.4.2.2.Market size and forecast, by wafer size
  - 6.2.4.3.Mexico
  - 6.2.4.3.1.Market size and forecast, by type
  - 6.2.4.3.2.Market size and forecast, by wafer size
6.3.Europe
- 6.3.1.Key market trends, growth factors, and opportunities
- 6.3.2.Market size and forecast, by type
- 6.3.3.Market size and forecast, by wafer size
- 6.3.4.Market analysis, by country
  - 6.3.4.1.UK
  - 6.3.4.1.1.Market size and forecast, by type
  - 6.3.4.1.2.Market size and forecast, by wafer size
  - 6.3.4.2.Germany
  - 6.3.4.2.1.Market size and forecast, by type
  - 6.3.4.2.2.Market size and forecast, by wafer size
  - 6.3.4.3.France
  - 6.3.4.3.1.Market size and forecast, by type
  - 6.3.4.3.2.Market size and forecast, by wafer size
  - 6.3.4.4.Russia
  - 6.3.4.4.1.Market size and forecast, by type
  - 6.3.4.4.2.Market size and forecast, by wafer size
  - 6.3.4.5.Rest of Europe
  - 6.3.4.5.1.Market size and forecast, by type
  - 6.3.4.5.2.Market size and forecast, by wafer size
6.4.Asia-Pacific
- 6.4.1.Key market trends, growth factors, and opportunities
- 6.4.2.Market size and forecast, by type
- 6.4.3.Market size and forecast, by wafer size
- 6.4.4.Market analysis, by country
  - 6.4.4.1.China
  - 6.4.4.1.1.Market size and forecast, by type
  - 6.4.4.1.2.Market size and forecast, by wafer size
  - 6.4.4.2.Japan
  - 6.4.4.2.1.Market size and forecast, by type
  - 6.4.4.2.2.Market size and forecast, by wafer size
  - 6.4.4.3.Taiwan
  - 6.4.4.3.1.Market size and forecast, by type
  - 6.4.4.3.2.Market size and forecast, by wafer size
  - 6.4.4.4.South Korea
  - 6.4.4.4.1.Market size and forecast, by type
  - 6.4.4.4.2.Market size and forecast, by wafer size
  - 6.4.4.5.Rest of Asia-Pacific
  - 6.4.4.5.1.Market size and forecast, by type
  - 6.4.4.5.2.Market size and forecast, by wafer size
6.5.LAMEA
- 6.5.1.Key market trends, growth factors, and opportunities
- 6.5.2.Market size and forecast, by type
- 6.5.3.Market size and forecast, by wafer size
- 6.5.4.Market analysis, by country
  - 6.5.4.1.Latin America
  - 6.5.4.1.1.Market size and forecast, by type
  - 6.5.4.1.2.Market size and forecast, by wafer size
  - 6.5.4.2.Middle East & Africa
  - 6.5.4.2.1.Market size and forecast, by type
  - 6.5.4.2.2.Market size and forecast, by wafer size

CHAPTER 7:COMPETITIVE LANDSCAPE

7.1.Introduction
- 7.1.1.Market player positioning, 2020
7.2.Top Winning Strategies
7.3.Competitive dashboard
7.4.Competitive heatmap

CHAPTER 8:COMPANY PROFILES

8.1.AI TECHNOLOGY, INC.
- 8.1.1.Company overview
- 8.1.2.Company snapshot
- 8.1.3.Product portfolio
8.2.AMC CO., LTD
- 8.2.1.Company overview
- 8.2.2.Company snapshot
- 8.2.3.Product portfolio
8.3.DENKA COMPANY LIMITED
- 8.3.1.Company overview
- 8.3.2.Company snapshot
- 8.3.3.Operating business segments
- 8.3.4.Product portfolio
- 8.3.5.Business performance
- 8.3.6.Key strategic moves and developments
8.4.FURUKAWA ELECTRIC CO., LTD.
- 8.4.1.Company overview
- 8.4.2.Company snapshot
- 8.4.3.Operating business segments
- 8.4.4.Product portfolio
- 8.4.5.Business performance
- 8.4.6.Key strategic moves and developments
8.5.FORCE-ONE APPLIED MATERIALS
- 8.5.1.Company overview
- 8.5.2.Company snapshot
- 8.5.3.Product portfolio
8.6.LINTEC OF AMERICA, INC (LINTEC CORPORATION)
- 8.6.1.Company overview
- 8.6.2.Company snapshot
- 8.6.3.Operating business segments
- 8.6.4.Product portfolio
- 8.6.5.Business performance
- 8.6.6.Key strategic moves and developments
8.7.MITSUI CHEMICALS, INC.
- 8.7.1.Company overview
- 8.7.2.Company snapshot
- 8.7.3.Operating business segments
- 8.7.4.Product portfolio
- 8.7.5.Business performance
- 8.7.6.Key strategic moves and developments
8.8.NITTO DENKO CORPORATION
- 8.8.1.Company overview
- 8.8.2.Company snapshot
- 8.8.3.Operating business segments
- 8.8.4.Product portfolio
- 8.8.5.Business performance
- 8.8.6.Key strategic moves and developments
8.9.PANTECH TAPE CO., LTD.
- 8.9.1.Company overview
- 8.9.2.Company snapshot
- 8.9.3.Product portfolio
8.10.MINITRON ELEKTRONIK GmbH
- 8.10.1.Company overview
- 8.10.2.Company snapshot
- 8.10.3.Product portfolio