Market Research Report
Wafer Backgrinding Tape Market By Type (UV Curable and Non-UV), and Wafer Size (6-Inch, 8-Inch, 12-Inch, and Others): Global Opportunity Analysis and Industry Forecast, 2021-2030
|Wafer Backgrinding Tape Market By Type (UV Curable and Non-UV), and Wafer Size (6-Inch, 8-Inch, 12-Inch, and Others): Global Opportunity Analysis and Industry Forecast, 2021-2030|
Published: December 21, 2021
Allied Market Research
Content info: 180 Pages
Delivery time: 2-3 business days
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits. It is the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly. It is also referred to as wafer thinning. Most package types in the semiconductor industry today would require a wafer thickness ranging from 8 mils to 20 mils.
Wafer backgrinding tapes fully protect the wafer surface during backgrinding and also prevent wafer surface contamination from infiltration of grinding fluid. Usage of wafer backgrinding tapes in wafer fabrication ensures precision in wafer thickness after backgrinding. Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting. Once the wafer has been processed, exposing the tape to ultraviolet light (UV) reduces its adhesive strength, making tape peeling or die pick up simple.
On March 14, 2017, Furukawa Electric Co., launched "Plasma Masked Backgrind Tape" for laser grooving and plasma dicing. The tape is expected to improve the quality of chips and wafers.
The factors such as rise in need for wafer fabrication, increase in focus toward wafer surface protection during grinding process, and growth in the semiconductor industry boost the growth of the wafer backgrinding tapes market globally. However, increase in shift from non-UV to UV curable backgrinding tapes that increase the overall cost of wafer manufacturing is expected to hamper the market growth.
Furthermore, increase in investment in wafer fabrication equipment and materials, especially in Korea and China, is expected to offer lucrative opportunities for market expansion.
The wafer backgrinding tapes market is segmented on the basis of type, wafer size, and region. By type, the market is bifurcated into UV curable and Non-UV. By wafer size, the market is divided into 6-inch, 8-inch, 12-inch, and others. By region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.
The key players profiled in the report include Furukawa Electric Co. Ltd., Mitsui Chemicals, Inc., Nitto Denko Corporation, Minitron Elektron GMBH, Denka Company Limited, Lintec of America Inc., AI Technology, Inc., Force-One Applied Materials Inc., AMC Co, Ltd, and Pantech Tape Co., Ltd. These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.
By Wafer Size