Market Research Report
Global Radiation-Hardened Electronics Market: Focus on Manufacturing Technique, Component, and End User - Analysis and Forecast, 2020-2025
|Published by||BIS Research Inc.||Product code||986506|
|Published||Content info||237 Pages
Delivery time: 1-2 business days
|Global Radiation-Hardened Electronics Market: Focus on Manufacturing Technique, Component, and End User - Analysis and Forecast, 2020-2025|
|Published: January 27, 2021||Content info: 237 Pages||
"Global Radiation-Hardened Electronics Market Value to Reach $1.93 Billion by 2025."
The global radiation-hardened electronics industry analysis by BIS Research projects the market to have growth with CAGR of 3.90% based on the values during the forecast period from 2020 to 2025. The North America region is expected to dominate the market by 2025 with a share of 33.15%. The North America region includes the U.S. and Canada, but the U.S. is expected to acquire a major share in 2025 due to the increase in the investment of companies in the country.
The radiation-hardened electronics market has gained huge importance in the past few years. This is due to the rising demand for commercial COTS applications of rad-hard components. Several agencies and research organizations and industry players are engaged in developing software-defined rad-hard components.
The global radiation-hardened electronics market research provides the market information for segmentation such as the manufacturing technique, component, and end user. The market is also divided depending upon the end-user as space, military, nuclear power plants, aerospace, and other (healthcare and mining) where space is sub-segmented in satellite and launch vehicle and the military is sub-segmented as missiles, defense vehicle, and munitions. The market analysis examines the radiation hardened electronics market outlook in terms of the trends, driving forces, opportunities, technological advancements, and competitive benchmarking, among others.
The report further takes into consideration the market and business dynamics, along with the detailed product contribution of the key players operating in the market.
The report constitutes an extensive study of the radiation-hardened electronics industry. The report largely focuses on providing market information for radiation hardened electronics covering various segments, manufacturing techniques, components, end-user, and regions. The manufacturing technique included rad-hard by design (RHBD), rad-hard by process (RHBP), and rad-hard by software (RHBS). the component type was classified into microprocessors and controllers, sensors, application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), memory, power sources, discrete semiconductors, analog and mixed signals, others (optoelectronics, rectifiers, and fets). The market is further segmented into five end-use, namely space, military, nuclear power plants, aerospace, other (healthcare and mining).
The radiation-hardened electronics is segregated by region under four major regions, namely North America, Europe, APAC, and Rest-of-the-World. Data for each of these regions (by country) is provided.
The key players in the global radiation-hardened electronics market include Analog Devices Inc., BAE System, Cobham PLc, Honeywell, IBM, Infineon, Microchip, Renesas, ST Microelectronics, Texas, Boeing, Xilinx Inc., Maxwell, Psemi Corporation, Teledyne E2v Semiconductors, 3d Plus, Micropac Industries, Inc, Anaren Inc, Tt Electronics Plc, Data Device Corporation (Transdigm), and Solid-State Devices, Inc. (SSDI).