Market Research Report
Global Wafer Backgrinding Tape Market Size study, by Type (UV Curable and Non-UV), and Wafer Size (6-Inch, 8-Inch, 12-Inch, and Others) and Regional Forecasts 2021-2027
|Global Wafer Backgrinding Tape Market Size study, by Type (UV Curable and Non-UV), and Wafer Size (6-Inch, 8-Inch, 12-Inch, and Others) and Regional Forecasts 2021-2027|
Published: January 15, 2022
Bizwit Research & Consulting LLP
Delivery time: 2-3 business days
Global Wafer Backgrinding Tape Market is valued approximately USD 201.6 million in 2020 and is anticipated to grow with a healthy growth rate of more than 4.5 % over the forecast period 2021-2027. Wafer backgrinding is a semiconductor device fabrication technique that reduces wafer thickness to facilitate integrated circuit stacking and high-density packing. ICs are made on semiconductor wafers, which go through a series of processing stages. It is the process of grinding the backside of the wafer to the proper thickness before assembly. The global wafer backgrinding market is primarily driven by increased demand for wafer manufacture, increased focus on wafer surface protection during the grinding process, and growth in the semiconductor sector. For instance, LINTEC Corporation introduced the Back Grinding Tape Laminator "RAD-3520F/12" in April 2017 to protect the circuit surface of the wafer during back grinding. However, the market is projected to be restrained by the change from non-UV to UV curable backgrinding tapes, which raises the entire cost of wafer fabrication.
The key regions considered for the global Wafer Backgrinding Tape market study includes Asia Pacific, North America, Europe, Latin America and Rest of the World. Asia Pacific is the leading/significant region across the world in terms of market share owing to the wafer fabrication demand is increasing, as is the focus on wafer surface protection during the grinding process, and the semiconductor industry is expanding. Whereas, Asia-Pacific is also anticipated to exhibit highest growth rate / CAGR over the forecast period 2021-2027.
Major market player included in this report are:
AI Technology Inc.
AMC Co. Ltd.
Denka Company Limited
Furukawa Electric Co. Ltd.
Force-One Applied Materials
Lintec of America Inc. (Lintec Corporation)
Mitsui Chemicals Inc.
Nitto Denko Corporation
Pantech Tape Co. Ltd.
Minitron Elektronik GmbH
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Wafer Size:
Rest of the World
Furthermore, years considered for the study are as follows:
Historical year - 2018, 2019
Base year - 2020
Forecast period - 2021 to 2027
Target Audience of the Global Wafer Backgrinding Tape Market in Market Study:
Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Value-Added Resellers (VARs)
Third-party knowledge providers
List of figures