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Market Research Report

Semiconductor Assembly and Testing Services Market, By Service, By Packaging Solutions, By Application, and by Region - Size, Share, Outlook, and Opportunity Analysis, 2019 - 2027

Published by Coherent Market Insights Product code 927609
Published Content info 130 Pages
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Semiconductor Assembly and Testing Services Market, By Service, By Packaging Solutions, By Application, and by Region - Size, Share, Outlook, and Opportunity Analysis, 2019 - 2027
Published: February 7, 2020 Content info: 130 Pages
Description

The semiconductor industry is rapidly and unpredictably changing. Most of the companies in this industry are fabless companies, these companies leverage their resources and use their experience to improve the performance of the semiconductors chips. However, assembly and testing packaging services are outsourced to third parties. Semiconductor assembly and testing services offered to various industries such as communication, automobile sectors and in consumer electronics. A semiconductor material has conductivity value between conductor and insulator. Increasing adoption for mobile and connected services has increased the demand of smartphones and tablets with each internet can be accessed.

Market Dynamics

The ongoing demand for consumer electronics with the advancement in technology is driving the growth of global semiconductor assembly and testing services market. High development of cell phones and tablets are the potential markets for SATS. Increasing mobility and growing digital content is expected to drive the growth of global semiconductor assembly and testing services market growth during the forecast period. For instance, according to CMI analysis, the global semiconductor sectors total revenue is increased from USD483 billion in 2018 to USD517 billion in 2019.Increasing demand for automotive electronics in the upcoming generation cars built with electronic components, system to enhance car safety, and management system are driving the growth of global semiconductor assembly and testing services market. Rising adoption of latest technologies in navigation, hybrid electric driver, and in LED creates demand for this market.

Market Taxonomy

This report segments the global semiconductor assembly and testing services market on the basis of by service, by application, and region. On the basis of service, global semiconductor assembly testing and services market is segmented into assembly & packaging services and testing services. On the basis packaging solutions, the global semiconductor assembly and testing services market is segmented into Copper Wire and Gold Wire Bonding, Copper Clip, Flip Chip, Wafer Level Packaging and TSV. On the basis application, the global semiconductor assembly and testing services market is segmented into communication, computing & networking, consumer electronics, industrial and automotive electronics. On the basis of region, global semiconductor assembly and testing services market is segmented into North America, Latin America, Europe, Asia pacific, Middle East and Africa.

Key features of the study:

  • This report provides an in-depth analysis of the global semiconductor assembly and testing services market and provides market size (US$ million) and compound annual growth rate (CAGR %) for the forecast period (2019-2027), considering 2018 as the base year
  • It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrix for this market
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, regional outlook, and competitive strategy adopted by leading players
  • It profiles leading players in the global boat steering system market based on the following parameters - regulatory landscape, company overview, financial performance, product portfolio, geographical presence, distribution strategies, key developments and strategies, and future plans
  • Key companies covered in the Global Semiconductor Assembly and Testing Services Market includes ASE Group, Powertech Technology Inc., Global Foundries Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc. (Psi Technologies Inc.), STATS chipPAC Ltd. (JCET), Chipbond Technology Corporation, and Silicon Precision Industries Company Ltd.
  • These key market players are focusing on collaboration strategy with other market leaders to innovate and launch new products to meet the increasing needs and requirements of consumers.
  • Insights from this report would allow marketers and management authorities of companies to make informed decision regarding future product launches, technology upgradation, market expansion, and marketing tactics
  • The global semiconductor assembly and testing services market report caters to various stakeholders in this industry including investors, suppliers, distributors, new entrants, and financial analysts
  • Stakeholders would have ease in decision-making through the various strategy matrices used in analyzing the global boat steering system market.

Detailed Segmentation:

  • Global Semiconductor Assembly and Testing Services Market, By Service:
    • Assembly & Packaging Services
    • Testing Services
  • Global Semiconductor Assembly and Testing Services Market, By Packaging Solutions:
    • Copper Wire and Gold Wire Bonding,
    • Copper Clip,
    • Flip Chip,
    • Wafer Level Packaging
    • TSV
  • Global, Semiconductor Assembly and Testing Services Market, By Application:
    • Communication
    • Computing & Networking
    • Consumer Electronics
    • Industrial
    • Automotive Electronics
  • Global Semiconductor Assembly and Testing Services Market, By Region:
    • North America
    • Europe
    • Asia Pacific
    • Latin America
    • Middle East and Africa
  • Company Profiles
    • ASE Group*
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments
      • Future Plans
    • Powertech Technology Inc.
    • Global Foundries Inc.
    • Amkor Technology Inc.
    • CORWIL Technology Corp.
    • Integrated Microelectronics Inc. (Psi Technologies Inc.)
    • STATS chipPAC Ltd. (JCET)
    • Chipbond Technology Corporation
    • Silicon Precision Industries Company Ltd.
Table of Contents

Table of Contents

1. Research Objectives and Assumptions

  • Research Objectives
  • Assumptions
  • Abbreviations

2. Market Purview

  • Report Description
    • Market Definition and Scope
  • Executive Summary
    • Market Snippet, By Service
    • Market Snippet, By Packaging
    • Market Snippet, By Application
    • Market Snippet, By Region
  • Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

  • Market Dynamics
    • Drivers
    • Restraints
    • Market Opportunities
  • Regulatory Scenario
  • Industry Trend
  • Merger and Acquisitions
  • New system Launch/Approvals

4. Global Semiconductor Assembly and Testing Services Market, By Service, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Assembly & Packaging Services
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)
  • Testing Services
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)

5. Global Semiconductor Assembly and Testing Services Market, By Packaging Solutions , 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Copper Wire and Gold Wire Bonding
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)
  • Copper Clip
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)
  • Flip Chip
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)
  • Wafer Level Packaging
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)
  • TSV
    • Introduction
    • Market Size and Forecast, 2019-2027, (US$ Million)

6. Global Semiconductor Assembly and Testing Services Market, By Application, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Communication
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Computing & Networking
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Consumer Electronics
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Industrial
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends
  • Automotive Electronics
    • Market Share Analysis, 2017 and 2027 (%)
    • Segment Trends

7. Global Semiconductor Assembly and Testing Services Market, By Region, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, By Region, 2017 and 2027 (%)
  • North America
    • Regional Trends
    • Market Size and Forecast, By Service, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Packaging Solution, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Application, 2019-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • U.S.
    • Canada
  • Europe
    • Regional Trends
    • Market Size and Forecast, By Service, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Packaging Solution, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Application, 2019-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • U.K.
    • Germany
    • Italy
    • France
    • Russia
    • Rest of Europe
  • Asia Pacific
    • Regional Trends
    • Market Size and Forecast, By Service, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Packaging Solution, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Application, 2019-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • China
    • India
    • Japan
    • ASEAN
    • Australia
    • South Korea
    • Rest of Asia Pacific
  • Latin America
    • Regional Trends
    • Market Size and Forecast, By Service, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Packaging Solution, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Application, 2019-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • Brazil
    • Argentina
    • Mexico
    • Rest of Latin America
  • Middle East and Africa
    • Regional Trends
    • Market Size and Forecast, By Service, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Packaging Solution, 2019-2027 (US$ Million)
    • Market Size and Forecast, By Application, 2019-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • GCC Countries
    • South Africa
    • Rest of the Middle East and Africa

8. Competitive Landscape

  • Company Profiles
    • ASE Group
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Powertech Technology Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Global Foundries Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Amkor Technology Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • CORWIL Technology Corp.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Integrated Microelectronics Inc. (Psi Technologies Inc.)
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • STATS chipPAC Ltd. (JCET)
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Chipbond Technology Corporation
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Silicon Precision Industries Company Ltd.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates

9. Section

  • References
  • Research Methodology
  • About us and Sales Contact
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